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US4005456A Expired / Lapsed US ⏱️ 0.0 years remaining

Contact system for semiconductor arrangement

Assignee: Telefunken Electronic GmbH
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Filing: 1975-02-10
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Granted: 1977-01-25
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Expires: 1995-02-10
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Abstract

Abstract A semiconductor arrangement comprises a semiconductor body with a metal layer thereon whose exterior surface is vapor deposited or sputtered gold, a layer of palladium on the metal layer and a connecting region of electrolytically deposited gold on the palladium layer.

Inventors

  • 👤 Leonhard Botzenhardt

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 13:10
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/20; H10W72/241; H10W72/244; H10W72/251; H10W72/90; H10W72/921; H10W72/922; H10W72/923; H10W72/951; H10W72/952

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 81 words
In a semiconductor arrangement including a semiconductor body, a metal layer arranged on a surface of said semiconductor body with said metal layer having, at least on the outside, a vapor deposited or sputtered layer of gold, and a connection region of gold deposited electrolytically on said metal layer and being thicker than said metal layer; the improvement wherein a layer of palladium is arranged between, and in direct contact with, said gold layer and said thicker connection region of gold.
Claim 2
Dependent Claim 81 words
In a semiconductor arrangement including a semiconductor body, a metal layer arranged on a surface of said semiconductor body with said metal layer having, at least on the outside, a vapor deposited or sputtered layer of gold, and a connection region of gold deposited electrolytically on said metal layer and being thicker than said metal layer; the improvement wherein a layer of palladium is arranged between, and in direct contact with, said gold layer and said thicker connection region of gold.
Claim 3
Dependent Claim 18 words
A semiconductor arrangement as defined in claim 1, wherein said palladium layer is an electrolytically deposited palladium layer.
Claim 4
Dependent Claim 18 words
A semiconductor arrangement as defined in claim 1, wherein said palladium layer is 0.05 - 5 μm thick.
Claim 5
Dependent Claim 39 words
A semiconductor arrangement as defined in claim 1, wherein said metal layer comprises a contact conductive path which forms a resistive contact with a region of the semiconductor body and extends on an insulating layer covering said semiconductor surface.
Claim 6
Dependent Claim 35 words
A semiconductor arrangement as defined in claim 4, wherein said metal contact conductive path comprises a plurality of layers of different metals of which the outer layer is said vapor deposited or sputtered gold layer.
Claim 7
Dependent Claim 31 words
A semiconductor arrangement as defined in claim 1, wherein said connection region of electrolytically deposited gold comprises a connection region for wire-less connection to a connection part of a contacting strip.
Claim 8
Dependent Claim 54 words
A semiconductor arrangement comprising: a semiconductor body; a metal layer, including a vapor deposited or sputtered gold exterior, on said semiconductor body; a layer of palladium directly on said metal layer; and a connecting region of electrolytically deposited gold directly on said palladium layer, said connecting region being substantially thicker than said metal layer.
Claim 9
Dependent Claim 54 words
A semiconductor arrangement comprising: a semiconductor body; a metal layer, including a vapor deposited or sputtered gold exterior, on said semiconductor body; a layer of palladium directly on said metal layer; and a connecting region of electrolytically deposited gold directly on said palladium layer, said connecting region being substantially thicker than said metal layer.

References Cited (Backward Citations)

US3290127A Cited
US3495959A Cited
US3609472A Cited
US3645785A Cited
US3662454A Cited
US3775200A Cited
US3878554A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1980-01-25 1980-07-26 1981-01-25 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1984-01-25 1984-07-26 1985-01-25 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1988-01-25 1988-07-26 1989-01-25 $7700.00 Window Closed / Lapsed

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