Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
155 words
In an integrated circuit including at least one bipolar transistor, at least one resistor and a MOS type capacitor, said integrated circuit being formed in a P-type silicon body having an epitaxial layer of N-type conductivity grown thereon, said transistor having been formed in a first portion of said epitaxial layer, said resistor having been formed by ion implantation of P-type impurities in a second portion of said epitaxial layer at the surface thereof, a silicon oxide film of a uniform thickness between 800 and 3000 angstroms having been grown over and covering said resistor, the improvement comprising said capacitor having one electrode consisting of a P-type region in a third portion of said epitaxial layer and extending to the surface thereof, said oxide film of said uniform thickness having also been grown over said P-type electrode region, and another electrode of metal lying over and being spaced from said P-type region by said film.
Claim 2
Dependent Claim
155 words
In an integrated circuit including at least one bipolar transistor, at least one resistor and a MOS type capacitor, said integrated circuit being formed in a P-type silicon body having an epitaxial layer of N-type conductivity grown thereon, said transistor having been formed in a first portion of said epitaxial layer, said resistor having been formed by ion implantation of P-type impurities in a second portion of said epitaxial layer at the surface thereof, a silicon oxide film of a uniform thickness between 800 and 3000 angstroms having been grown over and covering said resistor, the improvement comprising said capacitor having one electrode consisting of a P-type region in a third portion of said epitaxial layer and extending to the surface thereof, said oxide film of said uniform thickness having also been grown over said P-type electrode region, and another electrode of metal lying over and being spaced from said P-type region by said film.
Claim 3
Dependent Claim
46 words
The integrated circuit of claim 1 wherein said first, second and third portions of said epitaxial layer are defined therein by surrounding isolation walls of P-type conductivity, and wherein said P-type electrode region contains essentially the same concentration of P-type dopants as contained in said walls.
Claim 4
Dependent Claim
47 words
The integrated circuit of claim 2 wherein said capacitor additionally includes a buried layer of N-type conductivity being positioned at the interface of said second epitaxial layer portion and said body, and being interposed between said P-type region and said p-type body for providing electrical isolation therebetween.
Claim 5
Dependent Claim
50 words
The integrated circuit of claim 2 wherein said metal electrode serves as a first terminal of said capacitor and wherein said capacitor additionally includes a second metal capacitor terminal making ohmic contact to both said P-type electrode regions and the adjacent of said N-type third portion of said epitaxial layer.
Claim 6
Dependent Claim
49 words
The integrated circuit of claim 1 wherein said at least one transistor has a standard NPN structure, said first portion serving as the collector thereof, said P-type region in said one epitaxial portion having essentially the same concentration of P-type dopants as the base region of said NPN transistor.
Claim 7
Dependent Claim
20 words
The integrated circuit of claim 1 wherein said uniform silicon oxide film is from 1600 angstroms to 2200 angstroms thick.
Claim 8
Dependent Claim
97 words
The integrated circuit of claim 1 wherein said P-type region has a portion thereof extending laterally beyond said oxide film of said uniform thickness grown over said P-type region, said P-type region containing a concentration of P-type impurities in a surface region thereof under said oxide film of uniform thickness that is greater than the concentration of P-type impurities in said laterally extending portion of said P-type region by an amount that is equal to the concentration of said P-type impurities in said ion implanted resistor, said surface region having the same thickness as said P-type resistor.
Claim 9
Dependent Claim
23 words
The integrated circuit of claim 7 wherein said thickness of said shallow P-type region of said capacitor is from 0.1 to 0.8 microns.