Patent US3977074A successfully refreshed from Google Patents.
US3977074A
Expired / Lapsed
US
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Double sided printed circuit board and method for making same
Assignee: Motors Liquidation Co
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Filing: 1975-02-06
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Granted: 1976-08-31
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Expires: 1995-02-06
Abstract
Abstract A single sided printed circuit board on a rigid substrate is prepared in a conventional manner, such as etching, with a first circuit including pads at the desired sites of interfacial connections. A rectangular hole is punched through the substrate at each inconnect site. A conductive foil is bonded to the other side of the substrate and a second circuit pattern is etched from the foil with circuit paths overlying the apertures. Then portions of the second circuit are inserted through the apertures by a gang of piercing tools so that the second circuit portions lie adjacent the pads of the first circuit. The interfacial connections are then completed by dip soldering or by welding. Alternatively, the second circuit applied to the substrate may be in the form of a preformed circuit on a flexible substrate.
Inventors
- 👤 Thomas J. Furnival
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 23:27
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K3/363; H05K3/40; H05K3/4038; H05K3/4084; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0397; H05K2201/04; H05K2201/048; H05K2201/09; H05K2201/09145; H05K2201/09172; H05K2203/00; H05K2203/01; H05K2203/0195; H05K2203/06; H05K2203/063; H05K3/366; H05K3/46; H05K3/4688; H05K3/4691; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165; Y10T29/49167
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
120 words
The method of fabricating a double sided printed circuit board with electrical interconnections through the board comprising forming conductive paths on a first side of an insulated substrate, the paths extending to desired interconnection sites, forming an aperture through the substrate at the site of each desired interconnection, providing conductive paths on the second side of the substrate with portions of said paths overlying the apertures, deflecting each portion of said path overlying an aperture through the aperture to form an integral tab connection having a free end extending through the aperture to a position adjacent a path on the first side of the substrate, and connecting the tab connector with the path on the first side of the substrate.
Claim 2
Independent Claim
120 words
The method of fabricating a double sided printed circuit board with electrical interconnections through the board comprising forming conductive paths on a first side of an insulated substrate, the paths extending to desired interconnection sites, forming an aperture through the substrate at the site of each desired interconnection, providing conductive paths on the second side of the substrate with portions of said paths overlying the apertures, deflecting each portion of said path overlying an aperture through the aperture to form an integral tab connection having a free end extending through the aperture to a position adjacent a path on the first side of the substrate, and connecting the tab connector with the path on the first side of the substrate.
Claim 3
Independent Claim
126 words
The method of fabricating a double sided printed circuit board with electrical interconnection through the board comprising forming first conductive paths on a first side of an insulated substrate, punching an aperture in the substrate and within a conductive path at the site of each desired interconnection, bonding a layer of metal to the second side of the substrate, forming second conductive paths from the layer of metal with portions of the conductive paths overlying the apertures, simultaneously piercing the portions of the second conductive paths overlying the apertures and forming said pierced portions through said apertures to thereby form tabs extending through the apertures adjacent the first paths, and bonding the tabs with the first paths to form interconnections between the first and second paths.
Claim 4
Independent Claim
126 words
The method of fabricating a double sided printed circuit board with electrical interconnection through the board comprising forming first conductive paths on a first side of an insulated substrate, punching an aperture in the substrate and within a conductive path at the site of each desired interconnection, bonding a layer of metal to the second side of the substrate, forming second conductive paths from the layer of metal with portions of the conductive paths overlying the apertures, simultaneously piercing the portions of the second conductive paths overlying the apertures and forming said pierced portions through said apertures to thereby form tabs extending through the apertures adjacent the first paths, and bonding the tabs with the first paths to form interconnections between the first and second paths.
Claim 5
Independent Claim
113 words
The method of fabricating a double sided printed circuit board with electrical interconnections through the board comprising forming first conductive paths on one side of an insulated rigid substrate, the paths extending to desired interconnection sites, forming an aperture through the substrate at the site of each desired interconnection, forming second conductive paths on an insulated flexible substrate, securing the flexible substrate to the other side of the rigid substrate with the second conductive paths overlying the apertures, deforming each second conductive path overlying an aperture to form a tab extending through an aperture adjacent a first conductive path, and connecting the tab with the path on the first side of the substrate.
Claim 6
Independent Claim
113 words
The method of fabricating a double sided printed circuit board with electrical interconnections through the board comprising forming first conductive paths on one side of an insulated rigid substrate, the paths extending to desired interconnection sites, forming an aperture through the substrate at the site of each desired interconnection, forming second conductive paths on an insulated flexible substrate, securing the flexible substrate to the other side of the rigid substrate with the second conductive paths overlying the apertures, deforming each second conductive path overlying an aperture to form a tab extending through an aperture adjacent a first conductive path, and connecting the tab with the path on the first side of the substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-08-31 | 1980-03-01 | 1980-08-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-08-31 | 1984-03-01 | 1984-08-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-08-31 | 1988-03-01 | 1988-08-31 | $7700.00 | Window Closed / Lapsed |