US3557446A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming printed circuit board through-connections
Assignee: AT&T Inc
•
Filing: 1968-12-16
•
Granted: 1971-01-26
•
Expires: 1988-12-16
Abstract
Abstract A TRANSVERSELY DEFORMABLE, CONDUCTIVE FOIL SHEET IS POSITIONED OVER ONE OR MORE HOLES IN, AND IN CONTACT WITH, A MAJOR SURFACE OF A NONCONDUCTIVE SUBSTRATE. UNIFORM PRESSURE IS APPLIED TO THE FREE MAJOR SURFACE OF THE SHEET WITH A HYDRAULIC MEDIUM SUCH AS A RUBBER PAD. SUCH PRESSURE EXTRUDES, EXPLODES OR RUPTURES THE UNSUPPORTED PORTION OF THE SHEET OVER THE HOLE THEREINTO TO PRODUCE A THROUGH-CONNECTION.
Inventors
- 👤 Sidney Samuel Charschan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 19:34
CPC Classifications
B; B30; B30B; B30B15/00; B30B15/06; B30B15/061; B30B15/02; B30B15/022; B30B15/024; B30B15/065; B30B5/00; B30B5/02; H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4084; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/02; H05K2203/0278; H05K2203/06; H05K2203/063; H05K2203/15; H05K2203/1572; H05K3/4092; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165; Y10T29/49167; Y10T29/49805
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-01-25 | 1974-07-27 | 1975-01-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-01-25 | 1978-07-27 | 1979-01-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-01-25 | 1982-07-27 | 1983-01-26 | $7700.00 | Window Closed / Lapsed |