Abstract A method of manufacturing semiconductor devices is provided which comprises the steps of depositing a coating of platinum on the surface of a silicon substrate prior to the formation of a plated nickel layer thereon, plating a layer of nickel on the silicon substrate coated with platinum, and then subjecting the structure to the process of heat treatment to thereby cause the platinum to diffuse into the silicon substrate, whereby the platinum acts to increase the adhesion strength of the plated nickel layer on the silicon substrate and further the platinum element diffused into the silicon substrate serves as a lifetime killer of carriers to thereby improve the switching characteristic of the semiconductor device.
A method of manufacturing a semiconductor device comprising the steps of depositing a coating of platinum having a thickness of 0.1 to 0.4 μ on at least one surface of a silicon substrate having at least one PN junction formed therein, subjecting said substrate to a first heat treatment for increasing the adhesion strength of the plated platinum layer to the silicon substrate, plating a layer of nickel on said silicon substrate coated with platinum, and then subjecting said plated nickel layer to a second heat treatment at a temperature of 800° to 900°C to cause said platinum to diffuse into said silicon substrate.
Claim 2
Independent Claim
104 words
A method of manufacturing a semiconductor device comprising the steps of depositing a coating of platinum having a thickness of 0.1 to 0.4 μ on at least one surface of a silicon substrate having at least one PN junction formed therein, subjecting said substrate to a first heat treatment for increasing the adhesion strength of the plated platinum layer to the silicon substrate, plating a layer of nickel on said silicon substrate coated with platinum, and then subjecting said plated nickel layer to a second heat treatment at a temperature of 800° to 900°C to cause said platinum to diffuse into said silicon substrate.
Claim 3
Dependent Claim
31 words
A manufacturing method according to claim 1, wherein said step for depositing a platinum coating consists of dipping said silicon substrate into an aqueous solution containing chloroplatinic acid and hydrofluoric acid.
Claim 4
Dependent Claim
35 words
A manufacturing method according to claim 1, wherein said first heat treatment step for said plated platinum layer is performed for 5 to 10 minutes in an inert atmosphere at a temperature of about 700°C.
Claim 5
Dependent Claim
28 words
A manufacturing method according to claim 1, wherein said second heat treatment step for said plated nickel is performed for 10 to 60 minutes in an inert atmosphere.