Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
261 words
The process for the manufacture of heat resistant polymeric film comprising the steps of: 1. extruding into film at high temperature a flowable polymer composition containing solvent, which composition may be handled as a solid at room temperature, said composition being comprised of (a) a polymer having in the repeating units thereof, a member selected from the group consisting of precursor units which on heat curing form heterocyclic rings, and a mixture of said precursor units and heterocyclic rings formed from such precursor units, said polymer being selected from the group consisting of polyamide-imide, polyimide, and polyamide-acid and containing at least 15% of said heterocyclic rings by weight of said polymer and (b) 25-130% by weight of an organic solvent based on the weight of said polymer, said solvent being selected from the group consisting of N-methyl-2-pyrrolidone (NMP), N,N-dimethylacetamide (DMAC), N,N-dimethylformamide (DMF), N,N-dimethylmethoxy acetamide, N-methylcaprolactam, dimethyl sulfoxide, tetramethyl urea, pyridine, dimethylsulfone, hexamethylphosphoramide, tetramethylene sulfone, formamide, butyrolactam, N-acetylpyrrolidone, m-cresol and P-cresol, said polymer composition being normally solid at room temperature, said extrusion being carried out to form film at a temperature above room temperature and below the curing temperature of said polymer, immersing said extruded film in a liquid which is miscible with the solvent in said film, said polymer being insoluble in said liquid, said liquid being selected from the group consisting of water, aliphatic and aromatic hydrocarbons, hydrocarbon halides and ketones, and 2. thereafter curing said uncured film with an effective amount of heat sufficient to causes ring closure of said precursor units, hereby forming said heat resistant polymeric film.
Claim 2
Dependent Claim
261 words
The process for the manufacture of heat resistant polymeric film comprising the steps of: 1. extruding into film at high temperature a flowable polymer composition containing solvent, which composition may be handled as a solid at room temperature, said composition being comprised of (a) a polymer having in the repeating units thereof, a member selected from the group consisting of precursor units which on heat curing form heterocyclic rings, and a mixture of said precursor units and heterocyclic rings formed from such precursor units, said polymer being selected from the group consisting of polyamide-imide, polyimide, and polyamide-acid and containing at least 15% of said heterocyclic rings by weight of said polymer and (b) 25-130% by weight of an organic solvent based on the weight of said polymer, said solvent being selected from the group consisting of N-methyl-2-pyrrolidone (NMP), N,N-dimethylacetamide (DMAC), N,N-dimethylformamide (DMF), N,N-dimethylmethoxy acetamide, N-methylcaprolactam, dimethyl sulfoxide, tetramethyl urea, pyridine, dimethylsulfone, hexamethylphosphoramide, tetramethylene sulfone, formamide, butyrolactam, N-acetylpyrrolidone, m-cresol and P-cresol, said polymer composition being normally solid at room temperature, said extrusion being carried out to form film at a temperature above room temperature and below the curing temperature of said polymer, immersing said extruded film in a liquid which is miscible with the solvent in said film, said polymer being insoluble in said liquid, said liquid being selected from the group consisting of water, aliphatic and aromatic hydrocarbons, hydrocarbon halides and ketones, and 2. thereafter curing said uncured film with an effective amount of heat sufficient to causes ring closure of said precursor units, hereby forming said heat resistant polymeric film.
Claim 3
Dependent Claim
13 words
The process according to claim 1 wherein the heat resistant polymer is polyamideimide.
Claim 4
Dependent Claim
13 words
The process according to claim 1 wherein the heat resistant polymer is polyesterimide.
Claim 5
Dependent Claim
18 words
The process according to claim 1 wherein said polymer composition has a softening point of less than 270°C.
Claim 6
Dependent Claim
13 words
The process according to claim 1 wherein the heat treating temperature is 200°-500°C.
Claim 7
Dependent Claim
46 words
The process according to claim 1 wherein said polymer composition is extruded at a temperature of no more than 350°C., and no less than 30°C., above that to which the composition is exposed immediately after extrusion to form a shaped article which is thereafter heat treated.
Claim 8
Dependent Claim
24 words
The process according to claim 1 wherein said polymer composition after it has been extruded is heat treated prior to the complete solidification thereof.