Patent US3960674A successfully refreshed from Google Patents.
US3960674A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of depositing a metal on a surface comprising an electrically non-conductive ferrite
Assignee: AT&T Inc
•
Filing: 1974-12-20
•
Granted: 1976-06-01
•
Expires: 1994-12-20
Abstract
Abstract A method of depositing a metal on a surface comprising an electrically non-conductive ferrite is disclosed. The method comprises contacting the surface with a cathodically charged element. The element is then electroplated to deposit a metal thereon and on the contacted surface.
Inventors
- 👤 Alexander Coucoulas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 12:59
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K3/00; H05K3/10; H05K3/18; H05K3/188; H05K7/1061; H05K2203/00; H05K2203/14; H05K2203/1461; H05K3/30; H05K3/32
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
57 words
A method of depositing a metal on an exposed surface comprising an electrically non-conductive ferrite, having a resistivity of at least 10 4 ohm-cm, which comprises: directly contacting the exposed ferrite surface with a cathodically charged element, and electroplating said element to deposit a metal thereon and on an adjoining portion of said contacted exposed ferrite surface.
Claim 2
Independent Claim
57 words
A method of depositing a metal on an exposed surface comprising an electrically non-conductive ferrite, having a resistivity of at least 10 4 ohm-cm, which comprises: directly contacting the exposed ferrite surface with a cathodically charged element, and electroplating said element to deposit a metal thereon and on an adjoining portion of said contacted exposed ferrite surface.
Claim 3
Dependent Claim
30 words
The method as defined in claim 1 wherein said surface comprises a ferrite selected from the group consisting of Ba(Fe 2 O 3 ) and Sr(Fe 2 O 3 ).
Claim 4
Independent Claim
88 words
A method of preparing at least one discrete conductive form which comprises: a. selectively masking an exposed surface of a base comprising an electrically non-conductive ferrite, having a resistivity of at least 10 4 ohm-cm, to delineate an unmasked pattern, on said exposed surface, conforming in shape to the conductive form; b. contacting said pattern with a cathodically charged element; and c. exposing said element and said contacted pattern to an electrolytic plating bath to deposit a metal on at least said pattern to produce the conductive form.
Claim 5
Independent Claim
88 words
A method of preparing at least one discrete conductive form which comprises: a. selectively masking an exposed surface of a base comprising an electrically non-conductive ferrite, having a resistivity of at least 10 4 ohm-cm, to delineate an unmasked pattern, on said exposed surface, conforming in shape to the conductive form; b. contacting said pattern with a cathodically charged element; and c. exposing said element and said contacted pattern to an electrolytic plating bath to deposit a metal on at least said pattern to produce the conductive form.
Claim 6
Dependent Claim
30 words
The method as defined in claim 3 wherein said base comprises a ferrite selected from the group consisting of Ba(Fe 2 O 3 ) and Sr(Fe 2 O 3 ).
Claim 7
Dependent Claim
18 words
The method as defined in claim 3 which further comprises removing the conductive form from said base surface.
Claim 8
Independent Claim
79 words
A method of electroforming a metallic article, which comprises: a. preparing a mandrel, comprising an electrically non-conductive ferrite containing material, having a resistivity of at least 10 4 ohm-cm, conforming in shape to the article; b. contacting an exposed surface of said mandrel with a cathodically charged element; and c. exposing said element and said contacted exposed mandrel surface to an electroplating solution to deposit a metal on at least said exposed mandrel surface to form the metallic article.
Claim 9
Independent Claim
79 words
A method of electroforming a metallic article, which comprises: a. preparing a mandrel, comprising an electrically non-conductive ferrite containing material, having a resistivity of at least 10 4 ohm-cm, conforming in shape to the article; b. contacting an exposed surface of said mandrel with a cathodically charged element; and c. exposing said element and said contacted exposed mandrel surface to an electroplating solution to deposit a metal on at least said exposed mandrel surface to form the metallic article.
Claim 10
Dependent Claim
30 words
The method as defined in claim 6 wherein said mandrel comprises a ferrite selected from the group consisting of Ba(Fe 2 O 3 ) and Sr(Fe 2 O 3 ).
Claim 11
Dependent Claim
19 words
The method as defined in claim 6 which further comprises removing said formed metallic article from said mandrel surface.
Claim 12
Independent Claim
91 words
A method of conductively joining at least two electrically conductive elements, which comprises: a. situating the elements adjacent to one another on an exposed area of a fixture comprising an electrically non-conductive ferrite having a resistivity of at least 10 4 ohm-cm, b. cathodically charging at least one of said elements, and c. exposing said exposed fixture area having the elements thereon to an electroplating bath to deposit a metal on said charged element and on at least a portion of said exposed fixture area contiguous thereto to join the elements.
Claim 13
Independent Claim
91 words
A method of conductively joining at least two electrically conductive elements, which comprises: a. situating the elements adjacent to one another on an exposed area of a fixture comprising an electrically non-conductive ferrite having a resistivity of at least 10 4 ohm-cm, b. cathodically charging at least one of said elements, and c. exposing said exposed fixture area having the elements thereon to an electroplating bath to deposit a metal on said charged element and on at least a portion of said exposed fixture area contiguous thereto to join the elements.
Claim 14
Dependent Claim
30 words
The method as defined in claim 9 wherein said fixture comprises a ferrite selected from the group consisting of Ba(Fe 2 O 3 ) or Sr(Fe 2 O 3 ).
Claim 15
Independent Claim
48 words
A method of making an electrical connection to a lead of an integrated circuit device, which comprises: a. placing the integrated circuit having the lead extending therefrom on an exposed surface of a carrier comprising an electrically non-conductive ferrite having a resistivity of at least 10 4 ohm-cm,
Claim 16
Independent Claim
48 words
A method of making an electrical connection to a lead of an integrated circuit device, which comprises: a. placing the integrated circuit having the lead extending therefrom on an exposed surface of a carrier comprising an electrically non-conductive ferrite having a resistivity of at least 10 4 ohm-cm,
Claim 17
Dependent Claim
67 words
b. placing a conductive lead on said exposed carrier surface adjacent to said integrated circuit lead, c. cathodically charging one of said leads, and d. immersing said exposed carrier surface having said charged lead thereon in an electroplating bath to deposit a metal on said charged lead and on an area of said exposed carrier surface contiguous thereto to form the electrical connection and an electroplated assembly.
Claim 18
Dependent Claim
67 words
b. placing a conductive lead on said exposed carrier surface adjacent to said integrated circuit lead, c. cathodically charging one of said leads, and d. immersing said exposed carrier surface having said charged lead thereon in an electroplating bath to deposit a metal on said charged lead and on an area of said exposed carrier surface contiguous thereto to form the electrical connection and an electroplated assembly.
Claim 19
Dependent Claim
30 words
The method as defined in claim 11 wherein said carrier comprises a ferrite selected from the group consisting of Ba(Fe 2 O 3 ) and Sr(Fe 2 O 3 ).
Claim 20
Dependent Claim
33 words
The method as defined in claim 11 which further comprises partially encapsulating said electroplated assembly with a suitable encapsulant to form an assembly having at least a portion of said conductive lead exposed.
Claim 21
Dependent Claim
19 words
The method as defined in claim 13 which further comprises removing said partially encapsulated assembly from said carrier surface.
Claim 22
Dependent Claim
22 words
The method as defined in claim 14 which further comprises: treating said removed assembly with said encapsulant to coat the carrier-contacted surface.
Claim 23
Dependent Claim
162 words
In an improved method of forming an integrated circuit package, which comprises: a. electrically interconnecting a portion of each lead of an integrated circuit, containing a plurality of leads, with a terminal pin to form an interconnected device; b. partially encapsulating the interconnected device in an electrically insulative material to form an insulative body having a plurality of terminal pins, extending therefrom, wherein the improvement comprises: in step (a), placing the integrated circuit and the plurality of terminal pins on a surface of a carrier, comprising an electrically non-conductive ferrite, having a resistivity of at least 10 4 ohm-cm, in a desired spatial relationship whereby each terminal pin of the plurality of terminal pins is adjacent to each lead to which it is to be connected; cathodically charging the terminals or the leads; and exposing said carrier surface to an electroplating solution to electroplate metal on the terminals, on the carrier contiguous thereto and on the leads to form the interconnected device.
Claim 24
Dependent Claim
162 words
In an improved method of forming an integrated circuit package, which comprises: a. electrically interconnecting a portion of each lead of an integrated circuit, containing a plurality of leads, with a terminal pin to form an interconnected device; b. partially encapsulating the interconnected device in an electrically insulative material to form an insulative body having a plurality of terminal pins, extending therefrom, wherein the improvement comprises: in step (a), placing the integrated circuit and the plurality of terminal pins on a surface of a carrier, comprising an electrically non-conductive ferrite, having a resistivity of at least 10 4 ohm-cm, in a desired spatial relationship whereby each terminal pin of the plurality of terminal pins is adjacent to each lead to which it is to be connected; cathodically charging the terminals or the leads; and exposing said carrier surface to an electroplating solution to electroplate metal on the terminals, on the carrier contiguous thereto and on the leads to form the interconnected device.
Claim 25
Dependent Claim
30 words
The method as defined in claim 16 wherein said carrier comprises a ferrite selected from the group consisting of Ba(Fe 2 O 3 ) and Sr(Fe 2 O 3 ).
Claim 26
Dependent Claim
17 words
The method as defined in claim 16 which further comprises removing said insulative body from said surface.
Claim 27
Dependent Claim
22 words
The method as defined in claim 18 which further comprises: treating said removed body with said encapsulant to coat the carrier-contacted surface.
References Cited (Backward Citations)
US2285553A
Cited
US1275687A
Cited
US1858125A
Cited
FR843625A
Cited
US3325379A
Cited
US3520782A
Cited
US3808106A
Cited
US3737583A
Cited
US3639215A
Cited
US3729388A
Cited
US3859180A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-06-01 | 1979-12-01 | 1980-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-06-01 | 1983-12-01 | 1984-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-06-01 | 1987-12-01 | 1988-06-01 | $7700.00 | Window Closed / Lapsed |