Method of preparing at least one conductive form
Abstract
Abstract A METHOD OF PREPARING CONDUCTIVE PATTERNS COMPRISES DEPOSITING A THIN METALLIC FORM OR PATTERN ON A BASE MATERIAL COMPRISING A VALVE METAL. THE VALVE METAL BASE WITH THE DEPOSITED PATTERN THEREON IS THEN SUBJECTED TO AN ELECTROLYTIC PLATING TREATMENT IN WHICH ONLY THE PATTERN AND NOT THE BASE IS ELECTROPLATED AND BUILT UP TO A DESIRED THICKNESS. A BACKGROUND SUPPORT OR SUBSTRATE, HAVING AT LEAST ONE SURFACE RENDERED ADHESIVE, MAY THEN BE CONTACTED WITH THE BUILT-UP PATTERN AT THE ADHESIVE SURFACE, PRESSURE IS THEN MAINTAINED ALONG THE SUBSTRATE SUFFICIENT TO (1) INSURE THE SUBSEQUENT REMOVAL OF THE PATTERN FROM THE BASE WHEN THE SUBSTRATE IS REMOVED FROM CONTACT THEREWITH AND (2) INSURE THE TEMPORARY RETENTION OF THE PATTERNS ON THE SUBSTRATE. THE RETENTION OF THE PATTERNS MAY THEN BE RENDERED PERMANENT.
Inventors
- 👤 Angelo M De
- 👤 D Sharp
Bibliographic Details
Claims Analysis
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