Abstract The specification discloses a package for a plurality of semiconductor chips which enables both visual and physical inspection and testing of the chips prior to the opening of the package. The package includes first and second transparent plastic sheets each having an array of depressions formed therein. The sheets are adjacently disposed and the depressions are mated and nested with one another in order to form a plurality of discrete compartments for containing the semiconductor chips. The sheets are attached about the peripheries to form a package for transmitting the chips. Apertures are formed through each of the plastic sheets in the region of each of the compartments, the apertures being smaller than the chips to constrain the chips within the compartments while allowing access to the chips through the apertures to enable physical testing of electrical characteristics of the chips. Due to the transparent nature of the plastic sheets, the chips may also be visually inspected prior to opening of the package.
Inventors
👤 Jearld L. Hutson
Bibliographic Details
Application Number—
JurisdictionUS
Data Sourcegoogle_patents
Last Synchronized2026-11-04 13:07
CPC Classifications
B; B65; B65D; B65D71/00; B65D71/70
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
177 words
A package for a plurality of semiconductor chips comprising: a plurality of semiconductor chips each having opposed gate regions, first and second transparent plastic sheets each having an array of depressions formed therein, said sheets being adjacently disposed and said depressions of said first sheet nested with said depressions of said second sheet to form a plurality of discrete compartments between said sheets and spaced from the plane of said sheets, each of said compartments being dimensioned to contain one of said semiconductor chips and to allow visual inspection of said chips, means for attaching said sheets about the peripheries thereof with a permanent bond, structure defining apertures through each of said plastic sheets in the region of each of said compartments, said apertures being aligned and centrally disposed relative to said depressions and being oriented adjacent said gate regions to enable electrical testing of said chips, said apertures being smaller than said chips to constrain said chips within said compartments while allowing access to said chips through said apertures to enable electrical testing of the chips.
Claim 2
Dependent Claim
177 words
A package for a plurality of semiconductor chips comprising: a plurality of semiconductor chips each having opposed gate regions, first and second transparent plastic sheets each having an array of depressions formed therein, said sheets being adjacently disposed and said depressions of said first sheet nested with said depressions of said second sheet to form a plurality of discrete compartments between said sheets and spaced from the plane of said sheets, each of said compartments being dimensioned to contain one of said semiconductor chips and to allow visual inspection of said chips, means for attaching said sheets about the peripheries thereof with a permanent bond, structure defining apertures through each of said plastic sheets in the region of each of said compartments, said apertures being aligned and centrally disposed relative to said depressions and being oriented adjacent said gate regions to enable electrical testing of said chips, said apertures being smaller than said chips to constrain said chips within said compartments while allowing access to said chips through said apertures to enable electrical testing of the chips.
Claim 3
Dependent Claim
13 words
The package of claim 1 wherein said depressions and said chips are rectangular.