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US3945856A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of ion implantation through an electrically insulative material

Assignee: International Business Machines Corp
•
Filing: 1974-07-15
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Granted: 1976-03-23
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Expires: 1994-07-15
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Abstract

Abstract A method of ion implantation into a semiconductor substrate which comprises forming a layer of an electrically insulative material, such as silicon dioxide, on the substrate over the region to be ion implanted. Then, a beam of ions having sufficient energy to pass through the layer of insulative material and to penetrate into the substrate is directed at a particular portion of the insulative layer. Before proceeding further, at least the upper half of the insulative layer, and preferably all of the upper portion of the insulative layer, in excess of a remaining thickness of 100A, is removed by etching. Then, the substrate is heated whereby the ions are driven further into the substrate to form the selected ion implanted region.

Inventors

  • 👤 Wilfried G. Koenig
  • 👤 James S. Makris
  • 👤 Burton J. Masters

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 02:45
CPC Classifications
H; H10; H10P; H10P30/00; H10P30/20; H10P30/202; H10P30/204; H10P30/21; H10P30/212; H10W; H10W15/00; H10W15/01; Y; Y10; Y10S; Y10S148/00; Y10S148/007; Y10S148/037; Y10S148/06; Y10S148/145

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 86 words
A method of ion implantation into a semiconductor substrate comprising forming a protective layer on said substrate over a region to be ion implanted, directing at said layer a beam of ions having sufficient energy to pass through said layer and penetrate said substrate, maintaining said substrate below 1000°C, removing at least the upper half of said layer through which said ions passed by etching, and, then heating said substrate whereby said penetrated ions are driven further into said substrate to form said ion implanted region.
Claim 2
Independent Claim 86 words
A method of ion implantation into a semiconductor substrate comprising forming a protective layer on said substrate over a region to be ion implanted, directing at said layer a beam of ions having sufficient energy to pass through said layer and penetrate said substrate, maintaining said substrate below 1000°C, removing at least the upper half of said layer through which said ions passed by etching, and, then heating said substrate whereby said penetrated ions are driven further into said substrate to form said ion implanted region.
Claim 3
Dependent Claim 13 words
The method of claim 1 wherein said layer is an electrically insulative layer.
Claim 4
Dependent Claim 18 words
The method of claim 2 wherein said remaining layer after said etching has a maximum thickness of 100A.
Claim 5
Dependent Claim 14 words
The method of claim 3 wherein said layer is completely removed by said etching.
Claim 6
Dependent Claim 16 words
The method of claim 3 wherein said substrate is silicon and said layer is silicon dioxide.
Claim 7
Dependent Claim 27 words
The method of claim 3 wherein said implanted ions in said region have a concentration of at least 1 × 10 18 atoms/cm 3 after said drive-in.
Claim 8
Dependent Claim 13 words
The method of claim 5 wherein said etching is chemical etching hydrofluoric acid.
Claim 9
Dependent Claim 29 words
The method of claim 5 wherein said heating for drive-in is conducted in an oxidizing atmosphere whereby the removed portion of said silicon dioxide is regrown during said heating.
Claim 10
Dependent Claim 27 words
The method of claim 8 comprising the further steps of removing the silicon dioxide layer after drive-in and epitaxially depositing a silicon layer on the exposed substrate.

References Cited (Backward Citations)

US3388009A Cited
US3388009B1 Cited
US3529347A Cited
US3632438A Cited
US3566519A Cited
US3704178A Cited
US3717790A Cited
US3793088A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1979-03-23 1979-09-22 1980-03-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1983-03-23 1983-09-22 1984-03-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1987-03-23 1987-09-22 1988-03-23 $7700.00 Window Closed / Lapsed

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