US3939488A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing semiconductor device and resulting product
Assignee: Hitachi Ltd
•
Filing: 1974-02-28
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Granted: 1976-02-17
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Expires: 1994-02-28
Abstract
Abstract In sealing at least a semiconductor element portion of a semiconductor device by the use of a resin, the semiconductor element is covered with a stabilizer or with a resin containing the stabilizer. The stabilizer is adapted to check the migration of a mobile substance such as hydrochloric acid and a mobile ion such as chlorine ion existent within the resin. Owing to the fixation of the ion, the electrical characteristics of the semiconductor device are prevented from being degraded, and constituent parts in the semiconductor device are prevented from being corroded.
Inventors
- 👤 Yoshiaki Wakashima
- 👤 Hiroshi Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 16:58
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W74/131; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
74 words
A method for sealing a semiconductor device comprising covering a semiconductor element with a protective covering layer containing a metal-containing stabilizer which prevents the migration of mobile substances and mobile ions within the protective covering layer, said metal-containing stabilizer comprising a salt of an organic acid, an alcoholate, a phenolate or mercaptide, the metal component of said metal-containing stabilizer being selected from the group consisting of Ca, Mg, Sr, Cd, Zn, Sn and Pb.
Claim 2
Independent Claim
74 words
A method for sealing a semiconductor device comprising covering a semiconductor element with a protective covering layer containing a metal-containing stabilizer which prevents the migration of mobile substances and mobile ions within the protective covering layer, said metal-containing stabilizer comprising a salt of an organic acid, an alcoholate, a phenolate or mercaptide, the metal component of said metal-containing stabilizer being selected from the group consisting of Ca, Mg, Sr, Cd, Zn, Sn and Pb.
Claim 3
Dependent Claim
22 words
The method of claim 1, wherein said stabilizer is selected from the group consisting of zinc mercaptide, zinc salicylate and lead phthalate.
Claim 4
Dependent Claim
21 words
The method of claim 2, wherein said layer is synthetic resin containing from 0.1 to 10% by weight of said stabilizer.
Claim 5
Dependent Claim
18 words
The method of claim 3, wherein the protective layer has a thickness ranging from 1μ to 1 mm.
Claim 6
Dependent Claim
18 words
The method of claim 2, wherein the protective layer has a thickness ranging from 1μ to 1 mm.
Claim 7
Dependent Claim
11 words
The method of claim 1, wherein said stabilizer is zinc mercaptide.
Claim 8
Dependent Claim
11 words
The method of claim 1, wherein said stabilizer is zinc salicylate.
Claim 9
Dependent Claim
11 words
The method of claim 1, wherein said stabilizer is lead phthalate.
Claim 10
Dependent Claim
21 words
The method of claim 1, wherein said layer is synthetic resin containing from 0.1 to 10% by weight of said stabilizer.
Claim 11
Dependent Claim
18 words
The method of claim 1, wherein the protective layer has a thickness ranging from 1μ to 1 mm.
Claim 12
Dependent Claim
78 words
A sealed semiconductor device comprising a semiconductor element having a protective covering layer covering a portion thereof, said protective covering layer containing a metal-containing stabilizer which prevents the migration of mobile substances and mobile ions within the protective covering layer, said metal-containing stabilizer comprising a salt of an organic acid, an alcoholate, a phenolate or mercaptide, the metal component of said metal-containing stabilizer being selected from the group consisting of Ca, Mg, Sr, Cd, Zn, Sn and Pb.
Claim 13
Dependent Claim
78 words
A sealed semiconductor device comprising a semiconductor element having a protective covering layer covering a portion thereof, said protective covering layer containing a metal-containing stabilizer which prevents the migration of mobile substances and mobile ions within the protective covering layer, said metal-containing stabilizer comprising a salt of an organic acid, an alcoholate, a phenolate or mercaptide, the metal component of said metal-containing stabilizer being selected from the group consisting of Ca, Mg, Sr, Cd, Zn, Sn and Pb.
Claim 14
Dependent Claim
22 words
The device of claim 2, wherein said stabilizer is selected from the group consisting of zinc mercaptide, zinc salicylate and lead phthalate.
Claim 15
Dependent Claim
21 words
The device of claim 12, wherein said layer is synthetic resin containing from 0.1 to 10% by weight of said stabilizer.
Claim 16
Dependent Claim
11 words
The device of claim 11, wherein said stabilizer is zinc mercaptide.
Claim 17
Dependent Claim
11 words
The device of claim 11, wherein said stabilizer is zinc salicylate.
Claim 18
Dependent Claim
11 words
The device of claim 11, wherein said stabilizer is lead phthalate.
Claim 19
Dependent Claim
21 words
The device of claim 11, wherein said layer is synthetic resin containing from 0.1 to 10% by weight of said stabilizer.
Claim 20
Dependent Claim
18 words
The device of claim 11, wherein the protective layer has a thickness ranging from 1μ to 1 mm.
Claim 21
Dependent Claim
18 words
The device of claim 13, wherein the protective layer has a thickness ranging from 1μ to 1 mm.
Claim 22
Dependent Claim
18 words
The device of claim 12, wherein the protective layer has a thickness ranging from 1μ to 1 mm.
Claim 23
Dependent Claim
30 words
The device of claim 12, wherein said protective covering layer includes a member selected from the group consisting of epoxy resin, silicon resin, phenol resin, polyimide resin and polyamide resin.
Claim 24
Dependent Claim
30 words
The device of claim 11, wherein said protective covering layer includes a member selected from the group consisting of epoxy resin, silicon resin, phenol resin, polyimide resin and polyamide resin.
Claim 25
Dependent Claim
30 words
The method of claim 2, wherein said protective covering layer includes a member selected from the group consisting of epoxy resin, silicon resin, phenol resin, polyimide resin and polyamide resin.
Claim 26
Dependent Claim
30 words
The method of claim 1, wherein said protective covering layer includes a member selected from the group consisting of epoxy resin, silicon resin, phenol resin, polyimide resin and polyamide resin.
References Cited (Backward Citations)
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US3756872A
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US3696263A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-02-16 | 1979-08-18 | 1980-02-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-02-16 | 1983-08-18 | 1984-02-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-02-16 | 1987-08-18 | 1988-02-17 | $7700.00 | Window Closed / Lapsed |