Patent US3921201A successfully refreshed from Google Patents.
US3921201A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Improved liquid cooled semiconductor disk arrangement
Assignee: Siemens AG
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Filing: 1974-07-15
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Granted: 1975-11-18
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Expires: 1994-07-15
Abstract
Abstract Semiconductors in the form of disks having contact ends are positioned side-by-side between electrically conductive flat plates spanning the ends of at least two of the disks and contacting and pressing against these ends. One of the plates may be formed by conductive sections structurally interconnected by electrical insulation with each section spanning the ends of groups of the disks and electrically interconnecting these ends, and an opposite one of the plates may then contact the other ends of all of a plurality of such groups and be electrically conductive throughout, permitting operation of the semiconductors as branches of rectifier or converter circuits and the like. One or both of the plates may be cooled by a flow of liquid coolant in thermally conductive connection with one or another of the plate''s surfaces. By using an electrically non-conductive coolant, such as oil, short-circuiting of the sections interconnected by the electrical insulation is avoided when the plate having these sections is contacted throughout its length by the coolant.
Inventors
- 👤 Max Eisele
- 👤 Gunter Wilhelm
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 23:55
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/30; H10W40/70; H10W40/73; H10W90/00
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
107 words
A semiconductor arrangement, comprising: a plurality of semiconductor discs, each having ends forming contacts, disposed in a spaced-apart adjacent relationship; a plurality of electrically conductive plates, disposed in space-apart parallel relationship in engagement with said discs and between which said discs are arranged, at least a pair of said plurality of semiconductor discs being disposed between said plates in an axially superimposed relationship; a plurality of coil springs, disposed between said axially superimposed discs, for pressing said discs into engagement with said plates; and means, coupled to said plates, and including side walls interposed therebetween, for conducting a liquid coolant between said plates around said semiconductor discs.
Claim 2
Dependent Claim
107 words
A semiconductor arrangement, comprising: a plurality of semiconductor discs, each having ends forming contacts, disposed in a spaced-apart adjacent relationship; a plurality of electrically conductive plates, disposed in space-apart parallel relationship in engagement with said discs and between which said discs are arranged, at least a pair of said plurality of semiconductor discs being disposed between said plates in an axially superimposed relationship; a plurality of coil springs, disposed between said axially superimposed discs, for pressing said discs into engagement with said plates; and means, coupled to said plates, and including side walls interposed therebetween, for conducting a liquid coolant between said plates around said semiconductor discs.
Claim 3
Dependent Claim
54 words
The arrangement recited in claim 1, wherein at least one of said plates is formed by a plurality of sections which are structurally interconnected by electrical insulation, each of said plate sections being disposed so as to span the contacts of at least two adjacent semiconductor discs for electrically interconnecting said adjacent semiconductor contacts.
Claim 4
Dependent Claim
37 words
The arrangement recited in claim 2, wherein another one of said plates is formed by an electrical equipment casing, said semiconductor discs being electrically cooperative with said electrical equipment and being disposed in engagement with said casing.
Claim 5
Dependent Claim
64 words
The arrangement recited in claim 2, wherein each of the sections of said one of said plates spans the contacts of at least two adjacent ones of said semiconductor discs, and another of said plates, disposed opposite said one of said plates, spans all of the opposing contacts of said semiconductor discs, said another of said plates being electrically conductive throughout its axial length.
Claim 6
Dependent Claim
27 words
The arrangement recited in claim 1, further comprising a plurality of electrically conductive members disposed between and in engagement with said coil springs and said semiconductor discs.
Claim 7
Dependent Claim
61 words
The arrangement recited in claim 1, wherein a plurality of pairs of said discs are disposed in said axially superimposed arrangement so as to form a plurality of said superimposed arrangements between said plates, and further comprising a plurality of flexible electrical conductors, coupled to adjacent ones of said plurality of superimposed disc arrangements, for electrically interconnecting said adjacent disc arrangements.
Claim 8
Dependent Claim
21 words
The arrangement recited in claim 1, wherein said plates each include fluid passages extending axially therethrough for conducting a liquid coolant.
Claim 9
Dependent Claim
20 words
The arrangement recited in claim 1, wherein one of said plates comprises the flat side of an electrical transformer casing.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-11-17 | 1979-05-19 | 1979-11-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-11-17 | 1983-05-19 | 1983-11-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-11-17 | 1987-05-19 | 1987-11-18 | $7700.00 | Window Closed / Lapsed |