Semiconductor arrangement and method of production

Claim 1

AN ARTICLE OF MANUFACTURE FOR USE IN THE MANUFACTURE OF SEMICONDUCTOR ARRANGEMENTS WHEREIN A PLURALITY OF SEMICONDUCTOR RECTIFIER WAFERS ARE ARRANGED IN A PLANE AND CONTACTED BETWEEN PORTIONS OF ASSOCIATED CONDUCTORS FORMING A CLAMPTYPE MOUNTING, COMPIRSING: A PLURALITY OF PLANAR CONDUCTORS FORMED FROM A SINGLE CONTINOUS BAND OF PLANAR CONDUCTIVE MATERIAL, EACH OF SAID CONDUCTORS BEING CONNECTED AT ONE END THEREOF, TO A LONGITUDINALLY EXTENDING PORTION OF SAID BAND OF CONDUCTIVE MATERIAL WHEREBY SAID LONGITUDINALLY EXTENDING PORTION SERRVES AS A TRANSPORTING STRIP, SAID CONDUCTORS FORMING A PLANAR GEOMETRICAL STRUCTURE WHICH PERIODICALLY REPEATS ITSELF ALONG THE LENGTH OF SAID BAND, SAID GEOMETRICAL STRUCTURE HAVING A PATTERN SUCH THAT THE CENTER LINES OF THE ENDS OF SAID CONDUCTORS CONNECTED TO SAID LONGITUDINALLY EXTENDING PORTION OF SAID BAND SERVE AS REFERENCE MARKS FOR SEPARATING THE GEOMETRIC STRUCTORES INTO DESIRED SEMICONDUCTOR DEVICES, SAID GEOMETRICAL STRUCTURE INCLUDING A PLURALITY OF CLAMP-TYPE MOUNTINGS AT DESIRED LOCATIONS EACH OF WHICH IS FORMED BY ADJACENT PORTIONS OF TWO OF SAID CONDUCTORS, ONE OF SAID ADJCAENT CONDUCTOR PORTIONS FOR EACH SAID CLAMP-TYPE MOUNTING BEING PERMANENTLY BENT SO AS TO RAISE IT OUT OF THE PLANE OF SAID BAND AND DISPLACE IT PARALEL TO SAID PLANE OF SAID BAND AND LATERALLY IN THE LONGITUDINA DIRECTION PARALLEL TO SAID TRANSPORTING STRIP SO THAT THE ORIGINAL UNDER SURFACE OF SAID ONE OF SAID DJACENT CONDUCTOR PORTIONS OVERLAPS THE ORIGINAL UPPER SURFACE OF SAID OTHER OF SAID ADJACENT CONDUCTOR PORTIONS WHICH THEN SERVES AS A BASE CONDUCTOR PORTION FOR A SEMICONDUCTOR WAFER, WHEREBY THE SEMICONDUCTOR WAFER MAY BE INSERTED BETWEEN SAID OVERLAPPING CONDUCTOR PORTIONS AND CLAMPED THEREBETWEEN BY MEANS OF SPRING PRESSURE.