US3702954A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor component and method of its production
Assignee: Siemens AG
•
Filing: 1971-06-22
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Granted: 1972-11-14
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Expires: 1991-06-22
Abstract
Abstract A semiconductor p-n junction device having a monocrystalline body, preferably of silicon, is equipped with connector leads which are punched out of sheet material and are soldered to the electrodes of the device. Each connector lead has at least one springy clamping lug protruding toward the other connector lead and located beside a clamping lug of another connector lead. The semiconductor body is clamped between the lugs of two superpositioned adjacent connector leads and is soldered thereto.
Inventors
- 👤 Willi Mosch
- 👤 Gerhard Lutz
- 👤 Lothar Putter
- 👤 Erich Waldkotter
- 👤 Heinz Martin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 17:13
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/481
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
87 words
With an electric semiconductor device, comprising a semiconductor body of monocrystalline material having at least one p-n junction and two electrodes with sheet-metal connector leads soldered to said respective electrodes, the improvement according to which each of said connector leads comprises at least one springy clamping lug directed toward the other connector lead and located above the clamping lug of said other lead, said semiconductor body being clamped between the springy clamping lugs of two adjacent connector leads, and solder bonds joining said body with said lugs.
Claim 2
Dependent Claim
87 words
With an electric semiconductor device, comprising a semiconductor body of monocrystalline material having at least one p-n junction and two electrodes with sheet-metal connector leads soldered to said respective electrodes, the improvement according to which each of said connector leads comprises at least one springy clamping lug directed toward the other connector lead and located above the clamping lug of said other lead, said semiconductor body being clamped between the springy clamping lugs of two adjacent connector leads, and solder bonds joining said body with said lugs.
References Cited (Backward Citations)
US2795745A
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US2882462A
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US2894183A
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US2981875A
Cited
US3436603A
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US3500136A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-11-14 | 1976-05-15 | 1976-11-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-11-14 | 1980-05-15 | 1980-11-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-11-14 | 1984-05-15 | 1984-11-14 | $7700.00 | Window Closed / Lapsed |