US3569797A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device with preassembled mounting
Assignee: Bendix Corp
•
Filing: 1969-03-12
•
Granted: 1971-03-09
•
Expires: 1989-03-12
Abstract
Abstract A semiconductor device in which the active element is isolated from the housing by a thermally conducting material and having the leads formed to provide spring contact with the active element and also serve as an inserting and positioning fixture.
Inventors
- 👤 George Simmons
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 13:43
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/481; H10W70/421; H10W70/424; H10W70/427
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
112 words
A semiconductor device assembly comprising a housing having a cavity substantially filled with epoxy, a lead frame assembly having a tab from which extend emitter, collector and base leads respectively, said collector lead terminating at one end in a mounting platform, a semiconductor element seated on said mounting platform and fixedly retained thereto by means of clamping spring pressure exerted on opposite sides of said semiconductor element by said emitter and base leads and by a said mounting platform respectively, and a relatively thin coating of epoxy overlying said mounting platform, said mounting platform and said semiconductor element being positioned in said housing cavity and being intimately surrounded by said epoxy filler.
Claim 2
Dependent Claim
112 words
A semiconductor device assembly comprising a housing having a cavity substantially filled with epoxy, a lead frame assembly having a tab from which extend emitter, collector and base leads respectively, said collector lead terminating at one end in a mounting platform, a semiconductor element seated on said mounting platform and fixedly retained thereto by means of clamping spring pressure exerted on opposite sides of said semiconductor element by said emitter and base leads and by a said mounting platform respectively, and a relatively thin coating of epoxy overlying said mounting platform, said mounting platform and said semiconductor element being positioned in said housing cavity and being intimately surrounded by said epoxy filler.
Claim 3
Dependent Claim
30 words
The combination as set forth in claim 1 in which said semiconductor element is secured to said platform and said emitter and base leads by solder forming electrical contacts therewith.
Claim 4
Dependent Claim
30 words
The combination as set forth in claim 2 and including means for removing said tab after said semiconductor element is secured to said platform and said emitter and base leads.
Claim 5
Dependent Claim
21 words
The combination as set forth in claim 2 in which said platform is positioned adjacent to one side of said housing.
Claim 6
Dependent Claim
24 words
The combination as set forth in claim 4 in which said housing includes means for positioning said platform to one side of said housing.
Claim 7
Dependent Claim
20 words
The combination as set forth in claim 1 in which said epoxy has good thermal conductivity yet providing electrical insulation.
Claim 8
Dependent Claim
16 words
The combination as set forth in claim 1 in which said housing is an alloy casting.
Claim 9
Dependent Claim
16 words
The combination as set forth in claim 1 in which said housing includes a mounting section.
Claim 10
Dependent Claim
21 words
The combination as set forth in claim 1 in which said emitter, collector and base leads are in parallel spaced relationship.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-03-08 | 1974-09-07 | 1975-03-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-03-08 | 1978-09-07 | 1979-03-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-03-08 | 1982-09-07 | 1983-03-09 | $7700.00 | Window Closed / Lapsed |