Patent US4049179A successfully refreshed from Google Patents.
Patent US3916266A successfully refreshed from Google Patents.
US3916266A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Planar packaging for integrated circuits
Assignee: International Business Machines Corp
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Filing: 1973-12-13
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Granted: 1975-10-28
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Expires: 1993-12-13
Abstract
Abstract A package for interconnecting a plurality of integrated circuit chips including a dielectric body having a plurality of intersecting planes and a plurality of metallized interconnection patterns located thereon. Conductive interconnecting lines connected to at least some of said metallized patterns located on different intersecting planes provide inter-plane electrical continuity, and input/output connectors connect to at least one of the metallized patterns for connecting to the outside world.
Inventors
- 👤 Marvin Bennett
- 👤 Carlo Nuccio
- 👤 Charles Wurms
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 23:14
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H05; H05K; H05K1/00; H05K1/02; H05K1/0284; H10W70/67; H10W70/68; H10W90/00; H10W90/401; H05K1/03; H05K1/05; H05K1/053; H05K1/056; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09118; H05K2201/09209; H05K2201/09654; H05K2201/09754; H05K2201/09818; H05K2201/0999
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
159 words
A package for interconnecting integrated circuit chips comprising: a. a substrate having a plurality of intersecting planes, b. a plurality of metallized interconnection patterns located on different ones of only external surfaces of said plurality of intersecting planes, c. at least one integrated circuit chip connected to said metallized interconnection patterns on one of said planes, d. said plurality of metallized interconnection patterns located on its associated intersecting plane having at least a portion thereof connecting to an interconnection pattern located on another intersecting plane, e. input/output connectors connected to at least one of said metallized patterns for connecting to another level of packaging, f. said substrate comprises a partially open-sided body, g. a heat dissipating mounting post for slideably internally engaging a plurality of said partially open-sided substrates, said open-sided substrates being maintained in electrical contact with each other, and h. connector means connected to at least one of said substrates for connecting to another level of packaging.
Claim 2
Dependent Claim
159 words
A package for interconnecting integrated circuit chips comprising: a. a substrate having a plurality of intersecting planes, b. a plurality of metallized interconnection patterns located on different ones of only external surfaces of said plurality of intersecting planes, c. at least one integrated circuit chip connected to said metallized interconnection patterns on one of said planes, d. said plurality of metallized interconnection patterns located on its associated intersecting plane having at least a portion thereof connecting to an interconnection pattern located on another intersecting plane, e. input/output connectors connected to at least one of said metallized patterns for connecting to another level of packaging, f. said substrate comprises a partially open-sided body, g. a heat dissipating mounting post for slideably internally engaging a plurality of said partially open-sided substrates, said open-sided substrates being maintained in electrical contact with each other, and h. connector means connected to at least one of said substrates for connecting to another level of packaging.
Claim 3
Dependent Claim
26 words
A package for interconnecting integrated circuit chips as in claim 1 wherein: a. said mounting post comprises a hollow body adaptable for receiving a cooling medium.
Claim 4
Dependent Claim
128 words
A package for interconnecting integrated circuit chips comprising: a. a substrate having a plurality of intersecting planes, b. a plurality of metallized interconnection patterns located on different ones of only external surfaces of said plurality of intersecting planes, c. at least one integrated circuit chip connected to said metallized interconnection patterns on one of said planes, d. said plurality of metallized interconnection patterns located on its associated intersecting plane having at least a portion thereof connecting to an interconnection pattern located on another intersecting plane, e. input/output connectors connected to at least one of said metallized patterns for connecting to another level of packaging, f. said substrate comprises a metal core for providing heat dissipation, and a dielectric coating over said core for receiving said metallized patterns thereover.
Claim 5
Dependent Claim
128 words
A package for interconnecting integrated circuit chips comprising: a. a substrate having a plurality of intersecting planes, b. a plurality of metallized interconnection patterns located on different ones of only external surfaces of said plurality of intersecting planes, c. at least one integrated circuit chip connected to said metallized interconnection patterns on one of said planes, d. said plurality of metallized interconnection patterns located on its associated intersecting plane having at least a portion thereof connecting to an interconnection pattern located on another intersecting plane, e. input/output connectors connected to at least one of said metallized patterns for connecting to another level of packaging, f. said substrate comprises a metal core for providing heat dissipation, and a dielectric coating over said core for receiving said metallized patterns thereover.
Claim 6
Dependent Claim
20 words
A package for interconnecting integrateD circuit chips as in claim 3 wherein: a. said metal core constitutes a common ground.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-10-27 | 1979-04-28 | 1979-10-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-10-27 | 1983-04-28 | 1983-10-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-10-27 | 1987-04-28 | 1987-10-28 | $7700.00 | Window Closed / Lapsed |