US3755891A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Three dimensional circuit modules for thick-film circuits and the like and methods for making same
Assignee: Individual
•
Filing: 1971-06-03
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Granted: 1973-09-04
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Expires: 1991-06-03
Abstract
Abstract Three Dimensional Circuit Modules For Thick-Film Circuits And The Like And Methods For Making Same are provided in which such circuits are printed in selected portions on both the internal and external walls of a hollow cylindrical substrate to remove the crossovers normally present in an equivalent planar circuit configuration. The circuit sections are disposed on the substrate such that common connections therebetween are effected by conductive clips straddling the end faces of the substrate in notches or declivities formed therein to receive the clips. Like declivities are utilized to both physically and electrically interconnect a plurality of substrates and/or external circuit components and the like. These substrates also comprise a housing for self-contained functional circuit modules of the foregoing type.
Inventors
- 👤 W Muckelroy
- 👤 S Hawkins
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 09:26
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/189; H05K1/02; H05K1/0284; H05K1/09; H05K1/092; H05K1/095; H05K1/16; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09018; H05K2201/09145; H05K2201/09181; H05K2201/09818; H05K2201/0999; H05K2201/10; H05K2201/10227; H05K2201/10363; H05K2201/10386; H05K2201/10431; H05K2201/10439; H05K2201/10446; H05K2201/10613; H05K2201/10621; H05K2201/10651; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
202 words
The method of making three dimensional printed circuit modules with the elimination of conventional crossovers in an equivalent planar circuit configuration, wherein said configuration comprises a network having at least one electrical path loop and at least two electrical paths connected across said loop and crossing each other, said crossing forming at least one crossover, comprising the steps of: separating said conventional planar circuit configuration into selected portions, wherein at least one of said portions comprises one of said two electrical paths connected across said electrical path loop; selectively printing one of said portions in three dimensional configuration on the internal or external wall of a hollow cylindrical substrate; arranging said portions on said substrate such that common connections between said circuit portions respectfully terminate in registry on said internal and external walls at an end face of said substrate; connecting a portion comprising said electrical path to said electrical path loop by utilizing a part of the surface of said hollow cylindrical substrate wherein crossovers are eliminated; providing a declivity in said end face extending between related ones of said common connections; and subsequently fitting a conductor in each such declivity in common electrical contact with those common connections associated therewith.
Claim 2
Independent Claim
202 words
The method of making three dimensional printed circuit modules with the elimination of conventional crossovers in an equivalent planar circuit configuration, wherein said configuration comprises a network having at least one electrical path loop and at least two electrical paths connected across said loop and crossing each other, said crossing forming at least one crossover, comprising the steps of: separating said conventional planar circuit configuration into selected portions, wherein at least one of said portions comprises one of said two electrical paths connected across said electrical path loop; selectively printing one of said portions in three dimensional configuration on the internal or external wall of a hollow cylindrical substrate; arranging said portions on said substrate such that common connections between said circuit portions respectfully terminate in registry on said internal and external walls at an end face of said substrate; connecting a portion comprising said electrical path to said electrical path loop by utilizing a part of the surface of said hollow cylindrical substrate wherein crossovers are eliminated; providing a declivity in said end face extending between related ones of said common connections; and subsequently fitting a conductor in each such declivity in common electrical contact with those common connections associated therewith.
Claim 3
Dependent Claim
91 words
The method of claim 1 including the additional steps of: nesting an additional substrate and circuit thereon within the first; arranging said circuits such that common interconnection points between said circuits on adjacent substrates respectively terminate at adjacent end faces of said substrates; providing declivities in said end faces at said common interconnection points; arranging said substrates to align said declivities; and physically and electrically interconnecting said substrates and said circuits, respectively, by fixing substantially rigid conductors in said aligned declivities in electrical contact with those common interconnection points associated therewith.
Claim 4
Dependent Claim
76 words
The method of claim 1 including the additional steps of: placing an additional substrate and circuit thereon adjacent the first; arranging said circuits such that common interconnection points between said circuits on adjacent substrates respectively terminate at an end face of said substrates; aligning said termination points; and physically and electrically interconnecting said substrates and said circuits, respectively, by physically bonding a substantially rigid conductor to said end faces in electrical contact with said interconnection points.
Claim 5
Dependent Claim
44 words
The method of claim 1 including the steps of: forming additional declivities in related pairs in the end faces of said substrate; and physically attaching external circuit components having conductive terminals of said substrate by fixing the said conductive terminals in said additional declivities.
Claim 6
Dependent Claim
92 words
The method of claim 1 in the provision of interconnecting and mounting external circuit components with said circuits and on said substrate, respectively, wherein said external components have substantially rigid conductive terminals extending therefrom, comprising the additional steps of: forming additional declivities in related pairs in the end faces of said substrate; arranging said circuits on said substrate such that external circuit terminals thereof occur at said related Pairs of declivities; and physically bonding said conductive terminals of said exernal components in said declivities in electrical contact with said external circuit terminals.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-09-03 | 1977-03-05 | 1977-09-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-09-03 | 1981-03-05 | 1981-09-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-09-03 | 1985-03-05 | 1985-09-04 | $7700.00 | Window Closed / Lapsed |