Patent US3911570A successfully refreshed from Google Patents.
US3911570A
Expired / Lapsed
US
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Electrical connector and method of making
Assignee: Electro Oxide Corp
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Filing: 1973-08-21
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Granted: 1975-10-14
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Expires: 1993-08-21
Abstract
Abstract The method of making an improved electrical connector and the resulting article of manufacture. The invention is directed to an improved method of bonding connector pins within a ceramic substrate to form a high strength force resistant bond therebetween. A bonding mixture is formed whereby between 0.5 to 10.0 parts by weight of copper within copper oxide particulates are mixed with 1.0 parts of silver within silver or silver oxide paticulates. In one form of the invention, the bonding mixture is formed into a pasty consistency by the addition of an organic binder. The mixture is then placed contiguous to openings formed in the ceramic substrate. Connector pins are inserted in the openings and the connector assembly is fired in an air or inert atmosphere at a predetermined temperature within the range 950* to 1010*C. The resulting bond between connector pins and ceramic substrate is highly force resistant. In another form of the invention, the bonding mixture is added to a molding resin. The combination is then cast into bonding sheets. The sheets are stamped out in a contour dimension equal to the ceramic substrate. The bonding sheets are placed contiguous to the ceramic substrate surface and the connector pins are inserted into substrate openings. The connector assembly is then fired as previously described to form the improved bond strength electrical connector.
Inventors
- 👤 Baynard R Smith
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:08
CPC Classifications
H; H01; H01R; H01R9/00; H01R9/16; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49204; Y10T29/49208; Y10T29/4921
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
137 words
A METHOD OF BONDING CONNECTOR PINS WITHIN A CERAMIC SUBSTRATE MEMBER TO FORM AN ELECTRICAL CONNECTOR INCLUDING THE STEPS OF: A. ESTABLISHING A WEIGHT RATIO OF BETWEEN 0.5-10.0 PARTS OF COPPER OXIDE POWDER TO 1.0 PARTS OF ONE MATERIAL FROM THE GROUP CONSISTING OF SILVER AND SILVER OXIDE POWDER, B. COMBINING SAID COPPER OXIDE POWDER AND SAID MATERIAL FROM THE GROUP CONSISTING OF SAID SILVER AND SILVER OXIDE TO FORMING A BONDING MIXTURE. C. PLACING SAID BONDING MIXTURE ON SAID CERAMIC SUBSTRATE MEMBER CONTIGUOUS TO AT LEAST ONE OPENING FORMED WITHIN SAID CERAMIC SUBSTRATE MEMBER, D. INSERTING AT LEAST ONE CONNECTOR PIN WITHIN SAID OPENING TO FORM A CONNECTOR ASSEMBLY, AND, E. FIRING SAID CONNECTOR ASSEMBLY WITHIN A TEMPERATURE RANGE BETWEEN APPROXIMATELY 950* TO 1010*C. TO FORM A BOND BETWEEN SAID CONNECTOR PIN AND SAID CERAMIN SUBSTRATE.
Claim 2
Independent Claim
137 words
A METHOD OF BONDING CONNECTOR PINS WITHIN A CERAMIC SUBSTRATE MEMBER TO FORM AN ELECTRICAL CONNECTOR INCLUDING THE STEPS OF: A. ESTABLISHING A WEIGHT RATIO OF BETWEEN 0.5-10.0 PARTS OF COPPER OXIDE POWDER TO 1.0 PARTS OF ONE MATERIAL FROM THE GROUP CONSISTING OF SILVER AND SILVER OXIDE POWDER, B. COMBINING SAID COPPER OXIDE POWDER AND SAID MATERIAL FROM THE GROUP CONSISTING OF SAID SILVER AND SILVER OXIDE TO FORMING A BONDING MIXTURE. C. PLACING SAID BONDING MIXTURE ON SAID CERAMIC SUBSTRATE MEMBER CONTIGUOUS TO AT LEAST ONE OPENING FORMED WITHIN SAID CERAMIC SUBSTRATE MEMBER, D. INSERTING AT LEAST ONE CONNECTOR PIN WITHIN SAID OPENING TO FORM A CONNECTOR ASSEMBLY, AND, E. FIRING SAID CONNECTOR ASSEMBLY WITHIN A TEMPERATURE RANGE BETWEEN APPROXIMATELY 950* TO 1010*C. TO FORM A BOND BETWEEN SAID CONNECTOR PIN AND SAID CERAMIN SUBSTRATE.
Claim 3
Dependent Claim
44 words
The method of bonding connector pins within a ceramic substrate member as recited in claim 1 where the step of combining includes the step of establishing a weight ratio of between 1.77 parts of copper to 1.0 parts of silver for said bonding mixture.
Claim 4
Dependent Claim
22 words
The method of bonding connector pins within a ceramic substrate as recited in claim 1 where said copper oxide is cupric oxide.
Claim 5
Dependent Claim
22 words
The method of bonding connector pins within a ceramic substrate as recited in claim 1 where said copper oxide is cuprous oxide.
Claim 6
Dependent Claim
32 words
The method of bonding connector pins within a ceramic substrate as recited in claim 1 where the step of firing includes the step of inserting said connector assembly within an inert atmosphere.
Claim 7
Dependent Claim
32 words
The method of bonding connector pins within a ceramic substrate as recited in claim 1 where the step of firing includes the step of inserting said connector assembly within an air atmosphere.
Claim 8
Dependent Claim
39 words
The method of bonding connector pins within a ceramic substrate as recited in claim 1 where the step of firing said connector assembly is followed by the step of cleaning said bonded connector pins of oxide coatings formed thereon.
Claim 9
Dependent Claim
34 words
The method of bonding connector pins within a ceramic substrate as recited in claim 7 where the step of cleaning includes the step of chemical etching said fired connector pins to remove said coating.
Claim 10
Dependent Claim
23 words
The method of bonding connector pins within a ceramic substrate as recited in claim 1 where said connector pins are constructed of Kovar.
Claim 11
Dependent Claim
39 words
The method of bonding connector pins within a ceramic substrate as recited in claim 1 where the step of combining is followed by the step of forming said bonding mixture into a preform for placement on said ceramic substrate.
Claim 12
Dependent Claim
36 words
The method of bonding connector pins within a ceramic substrate as recited in claim 10 where the step of forming includes the step of adding a predetermined weight percentage of organic binder to said bonding mixture.
Claim 13
Dependent Claim
49 words
The method of bonding connector pins within a ceramic substrate as recited in claim 11 where the step of adding is followed by the step of casting said bonding mixture into preforms having a contour dimension slightly in excess of the diameters of said openings in said ceramic substrate.
Claim 14
Dependent Claim
39 words
The method of bonding connector pins within a ceramic substrate as recited in claim 10 where the step of forming said bonding mixture includes the step of compacting said bonding mixture into a preform having a predetermined contour dimension.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-10-13 | 1979-04-14 | 1979-10-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-10-13 | 1983-04-14 | 1983-10-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-10-13 | 1987-04-14 | 1987-10-14 | $7700.00 | Window Closed / Lapsed |