Patent US3903048A successfully refreshed from Google Patents.
← Back to Patent Explorer
US3903048A Expired / Lapsed US ⏱️ 0.0 years remaining

Catalyst systems for lowering epoxy resin cure temperatures

Assignee: Braskem America Inc
•
Filing: 1973-04-02
•
Granted: 1975-09-02
•
Expires: 1993-04-02
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract New structural adhesives are disclosed in which an epoxy resin is cured with dicyandiamide. The curing of the epoxy resin by dicyandiamide is accelerated by the addition of appropriate amounts of organic compounds containing certain active groups such as SCN, NH, NH2, SH, N, or CN, in combination with azo, hydroxyl, H:N, or sulfur groups.

Inventors

  • 👤 Andrew D Lombardi
  • 👤 Thomas W Smeal

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 13:17
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/18; C08G59/68; C08G59/687; C08G59/40; C08G59/4007; C08G59/4014; C08G59/4021

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 51 words
A COMPOSITION COMPRISING A 1,2-EPOXY ETHER RESIN HAVING AN EPOXY EQUIVALENCY GREATER THAN ONE, FROM ABOUT ONE TO ABOUT TWENTY PERCENT DICYANDIAMIDE, AND FROM ABOUT ONE TO ABOUT TEN PERCENT OF AN ACCELERATOR SELECTED FROM THE GROUP CONSISTING OF DIMETHYL DITHIOCARBAMIC ACID DIMETHYLAMMONIUM SALT, BIS(DIMETHYLTHIOCARBAMY) SULFIDE, TETRAMETHYLTHIURAM DISULFIDE, AND TETRAETHYLTHIURAM DISULFIDE.
Claim 2
Dependent Claim 51 words
A COMPOSITION COMPRISING A 1,2-EPOXY ETHER RESIN HAVING AN EPOXY EQUIVALENCY GREATER THAN ONE, FROM ABOUT ONE TO ABOUT TWENTY PERCENT DICYANDIAMIDE, AND FROM ABOUT ONE TO ABOUT TEN PERCENT OF AN ACCELERATOR SELECTED FROM THE GROUP CONSISTING OF DIMETHYL DITHIOCARBAMIC ACID DIMETHYLAMMONIUM SALT, BIS(DIMETHYLTHIOCARBAMY) SULFIDE, TETRAMETHYLTHIURAM DISULFIDE, AND TETRAETHYLTHIURAM DISULFIDE.
Claim 3
Dependent Claim 17 words
Composition of claim 1 in which the epoxy resin is a polyglycidyl ether of a polyhydric phenol.
Claim 4
Dependent Claim 25 words
Composition of claim 1 in which the epoxy resin is a polyglycidyl ether of bisphenol A having an epoxy equivalent weight of 170 to 1200.
Claim 5
Dependent Claim 44 words
A curable composition of matter consisting essentially of a. a polyepoxide whose molecule contains on an average more than one 1,2-epoxide groups; b. dicyandiamide as curing agent, and c. as curing accelerator 0.1 to about 10 percent of a composition of the formula (((CH3)2NCS)2S).
Claim 6
Dependent Claim 44 words
A curable composition of matter consisting essentially of a. a polyepoxide whose molecule contains on an average more than one 1,2-epoxide groups; b. dicyandiamide as curing agent, and c. as curing accelerator 0.1 to about 10 percent of a composition of the formula (((CH3)2NCS)2S).
Claim 7
Dependent Claim 44 words
A curable composition of matter consisting essentially of a. a polyepoxide whose molecule contains on an average more than one 1,2-epoxide groups; b. dicyandiamide as curing agent; and c. as curing accelerator 0.1 to about 10 percent of a composition of the formula (((CH3)2NCS)2S2).
Claim 8
Dependent Claim 44 words
A curable composition of matter consisting essentially of a. a polyepoxide whose molecule contains on an average more than one 1,2-epoxide groups; b. dicyandiamide as curing agent; and c. as curing accelerator 0.1 to about 10 percent of a composition of the formula (((CH3)2NCS)2S2).
Claim 9
Dependent Claim 44 words
A curable composition of matter consisting essentially of a. a polyepoxide whose molecule contains on an average more than one 1,2-epoxide groups; b. dicyandiamide as curing agent; and c. as curing accelerator 0.1 to about 10 percent of a composition of the formula ((CH3)2NCSSNH2(CH3)2).
Claim 10
Dependent Claim 44 words
A curable composition of matter consisting essentially of a. a polyepoxide whose molecule contains on an average more than one 1,2-epoxide groups; b. dicyandiamide as curing agent; and c. as curing accelerator 0.1 to about 10 percent of a composition of the formula ((CH3)2NCSSNH2(CH3)2).
Claim 11
Independent Claim 55 words
A method of accelerating the rate of curing of a 1,2-epoxy ether resin having an epoxy equivalency Greater than one with dicyandiamide comprising adding to the epoxy resin-dicyandiamide composition from 0.1 to about 10 percent of an accelerator selected from the group consisting of dimethyldithiocarbamic acid dimethylammonium salt, bis(dimethylthiocarbamyl) sulfide, tetramethylthiuram disulfide, and tetraethylthiuram disulfide.
Claim 12
Independent Claim 55 words
A method of accelerating the rate of curing of a 1,2-epoxy ether resin having an epoxy equivalency Greater than one with dicyandiamide comprising adding to the epoxy resin-dicyandiamide composition from 0.1 to about 10 percent of an accelerator selected from the group consisting of dimethyldithiocarbamic acid dimethylammonium salt, bis(dimethylthiocarbamyl) sulfide, tetramethylthiuram disulfide, and tetraethylthiuram disulfide.

References Cited (Backward Citations)

US2847395A Cited
US3397156A Cited
US3562215A Cited
US3554967A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1978-09-01 1979-03-03 1979-09-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1982-09-01 1983-03-03 1983-09-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1986-09-01 1987-03-03 1987-09-02 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag