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US3562215A Expired / Lapsed US ⏱️ 0.0 years remaining

Low temperature,latent epoxy resin curing system

Assignee: 3M Co
•
Filing: 1967-06-09
•
Granted: 1971-02-09
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Expires: 1987-06-09
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Abstract

Abstract A MULTICOMPONENT CURING SYSTEM STABLE IN THE PRESENCE OF EXPOXY RESIN UNDER NORMAL SHELF CONDITIONS AND CAPABLE OF CURING THE RESIN AT ACCEPTABLE RATES BY IN SITU GENERATION OF THE CURING AGENTS BELOW ABOUT 200*F. INCLUDING A ROOM TEMPERATURE STABLE COMPOUND DECOMPOSABLE TO FORM AN AMINE HAVING AT LEAST ONE ACTIVE HYDROGEN ATOM, SUCH AS 3-PHENYL-1,1-DIMETHYL UREA, AN OH CONTAINING ORGANIC COMPOUND, SUCH AS ETHYLENE GLYCOL, AND AN ORGANO LEAD OR ORGANO MERCURY COMPOUND, SUCH AS LEAD OCTOATE OR PHENYL MERCURIC HYDROXIDE.

Inventors

  • 👤 Neal E Moore

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 22:21
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/4007; C08G59/4014; C08G59/4021; C08G59/68; C08G59/681; C08G59/685

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1974-02-08 1974-08-10 1975-02-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1978-02-08 1978-08-10 1979-02-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1982-02-08 1982-08-10 1983-02-09 $7700.00 Window Closed / Lapsed

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