Abstract A process for the plating of a non-metallic material, such as polyethylene or polypropylene strip, which includes the step of immersing said material in an alcohol solution containing boron, phosphorous and a metal selected from the group consisting of gold, palladium, rhodium and platinum. The metal film forms adherently on the strip. The solution is prepared by mixing phosphorous pentoxide in an alcohol solvent. The dissolution of the phosphorous pentoxide is exothermic and the temperature of the solution will rise during the reaction. Then, boric anhydride and a salt of gold, palladium, rhodium or platinum is added. The solution appears to strip any contamination while depositing a layer of the gold, platinum, rhodium or palladium onto the surface of the non-metallic part. The process is particularly advantageous for preparing metallized strips for use during semiconductor device assembly.
A PROCESS OF PLATING NON-METALLIC MATERIAL WHICH CONSISTIS OF THE STEP OF COATING THE MATERIAL WITH A COMPLEX SOLUTION CONSISTING ESSENTIALLY OF 1 TO 30 GRAMS PER LITER PHOSPHOROUS PENTOXIDE, 1 TO 60 GRAMS PER LITER BORIC ANHYDRIDE, 0.01 TO 10.0 GRAMS PER LITER OF A MATERIAL SELECTED FROM THE GROUP CONSISTING OF GOLD, PLATINUM, PALLADIUM AND RHODIUM SALTS AND OXIDE, AND THE BALANCE A SOLVENT SELECTED FROM THE GROUP CONSISTING OF METHYL, ETHYL, PROPYL, ISOPROPYL, BUTYL, AND ISOBUTYL ALCOHOL, ETHYLENE GLYCOL, AND TETRAHYDRO FURFURYL ALCOHOL.
Claim 2
Dependent Claim
86 words
A PROCESS OF PLATING NON-METALLIC MATERIAL WHICH CONSISTIS OF THE STEP OF COATING THE MATERIAL WITH A COMPLEX SOLUTION CONSISTING ESSENTIALLY OF 1 TO 30 GRAMS PER LITER PHOSPHOROUS PENTOXIDE, 1 TO 60 GRAMS PER LITER BORIC ANHYDRIDE, 0.01 TO 10.0 GRAMS PER LITER OF A MATERIAL SELECTED FROM THE GROUP CONSISTING OF GOLD, PLATINUM, PALLADIUM AND RHODIUM SALTS AND OXIDE, AND THE BALANCE A SOLVENT SELECTED FROM THE GROUP CONSISTING OF METHYL, ETHYL, PROPYL, ISOPROPYL, BUTYL, AND ISOBUTYL ALCOHOL, ETHYLENE GLYCOL, AND TETRAHYDRO FURFURYL ALCOHOL.
Claim 3
Dependent Claim
29 words
In a process as recited in claim 1 wherein said coating step includes immersing a semiconductor device in said complex solution for 1 - 24 hours at room temperature.
Claim 4
Dependent Claim
32 words
In a process as recited in claim 1 wherein said coating step includes covering a surface of a semiconductor device with said complex solution for 1 - 24 hours at room temperature.