Patent US3880723A successfully refreshed from Google Patents.
US3880723A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making substrates for microwave microstrip circuits
Assignee: United States Department of the Air Force
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Filing: 1973-08-28
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Granted: 1975-04-29
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Expires: 1993-08-28
Abstract
Abstract Utilizing photo resist techniques a microstrip circuit is applied to a soluble or etchable substrate having a thin film conductor on at least one surface, after formation of the circuit the photo resist is removed, and the circuit arc-plasma sprayed, subsequently, the original substrate is removed. Another embodiment causes the area from which the original substrate has been removed to be arc-plasma sprayed thereby causing the circuit to be encapsulated. Another embodiment plates the outside surface of the encapsulated circuit to achieve a TEM mode of propagation.
Inventors
- 👤 Clyde H Lane
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 14:01
CPC Classifications
H; H01; H01P; H01P11/00; H01P11/001; H01P11/003; H01Q; H01Q11/00; H05; H05K; H05K3/00; H05K3/10; H05K3/20; H05K3/205
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
78 words
IN A METHOD OF FABRICATING MICROWAVE, MICROSTRIP CIRCUITS, THE STEP OF: DEPOSITIING A FIRST LAYER OF SOLUABLE MATERIAL ON A SMOOTH SOLUABLE SUBSTRATE MATERIAL; DEPPOSITING A SECOND LAYER OF SOLUABLE CONDUCTIVE MATERIAL ON SAID FIRST LAYER; APPLYING A PATTERN PHOTO RESIST TO THE SECOND LAYER, ELECTROPLATING A CONDUCTIVE MATERIAL THROUGH SAID RESIST; REMOVING THE RESIST; ARE-PLASMA SPRAYING THE RESULTING CIRCUIT AND EXPOSED SECOND LAYER WITH A DIELECTRIC MATERIAL AND REMOVING THE ORIGINAL SUBSTRATE AND FIRST AND SECOND LAYERS.
Claim 2
Dependent Claim
78 words
IN A METHOD OF FABRICATING MICROWAVE, MICROSTRIP CIRCUITS, THE STEP OF: DEPOSITIING A FIRST LAYER OF SOLUABLE MATERIAL ON A SMOOTH SOLUABLE SUBSTRATE MATERIAL; DEPPOSITING A SECOND LAYER OF SOLUABLE CONDUCTIVE MATERIAL ON SAID FIRST LAYER; APPLYING A PATTERN PHOTO RESIST TO THE SECOND LAYER, ELECTROPLATING A CONDUCTIVE MATERIAL THROUGH SAID RESIST; REMOVING THE RESIST; ARE-PLASMA SPRAYING THE RESULTING CIRCUIT AND EXPOSED SECOND LAYER WITH A DIELECTRIC MATERIAL AND REMOVING THE ORIGINAL SUBSTRATE AND FIRST AND SECOND LAYERS.
Claim 3
Dependent Claim
28 words
A method of fabricating microwave, microstrip circuits according to claim 1 including the additional step of arc-plasma spraying the circuit and exposed dielectric surface with a dielectric material.
Claim 4
Dependent Claim
29 words
A method of fabricating microwave, microstrip circuits according to claim 2 including the additional step of electroplating a layer of conductive material on opposed exterior surfaces of the microcircuit.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-04-28 | 1978-10-28 | 1979-04-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-04-28 | 1982-10-28 | 1983-04-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-04-28 | 1986-10-28 | 1987-04-29 | $7700.00 | Window Closed / Lapsed |