US3846824A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Improved thermally conductive and electrically insulative mounting systems for heat sinks
Assignee: General Electric Co
•
Filing: 1973-06-13
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Granted: 1974-11-05
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Expires: 1993-06-13
Abstract
Abstract A two-part adhesive system for mounting heat sinks to power supply cases. A heat sink made of some suitable material such as aluminum is provided having holes or slots for mounting semiconductors thereon. At least part of the heat sink is coated with a material which exhibits high thermal conductivity and high electrical insulating strength. The heat sink is adhered to the power supply case by an epoxy formulated adhesive material having granules placed therein for electrical spacing. The adhesive material also has high electrical insulating strength and high thermal conductivity. The adhesive material also forms a good mechanical bond.
Inventors
- 👤 G Bell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 13:19
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/10
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
121 words
An apparatus for mounting at least one electrical device to a supportive surface comprising: a heat sink for dissipating thermal energy; means for mounting at least one electrical device to said heat sink; said heat sink having a first portion disposed toward said supportive surface; said first portion having a coating of a material exhibiting a high degree of electrical insulation and a high degree of thermal conductivity; an adhesive material situated between said coating on said first portion of said heat sink and a corresponding portion of said supportive surface for providing a mechanical bond between said heat sink and said supportive surface, said adhesive material exhibiting a high degree of electrical insulation and a high degree of thermal conductivity.
Claim 2
Independent Claim
121 words
An apparatus for mounting at least one electrical device to a supportive surface comprising: a heat sink for dissipating thermal energy; means for mounting at least one electrical device to said heat sink; said heat sink having a first portion disposed toward said supportive surface; said first portion having a coating of a material exhibiting a high degree of electrical insulation and a high degree of thermal conductivity; an adhesive material situated between said coating on said first portion of said heat sink and a corresponding portion of said supportive surface for providing a mechanical bond between said heat sink and said supportive surface, said adhesive material exhibiting a high degree of electrical insulation and a high degree of thermal conductivity.
Claim 3
Dependent Claim
43 words
An apparatus as set forth in claim 1 wherein said adhesive material includes an epoxy formulation with electrically insulative granules for facilitating the provision of a predetermined spacing between said coating on said one portion of said heat sink and said supportive surface.
Claim 4
Dependent Claim
26 words
An apparatus as set forth in claim 1 wherein said adhesive material has a dielectric strength in the range of about 300 volts per 0.001 inch.
Claim 5
Dependent Claim
37 words
An apparatus as set forth in claim 1 wherein said adhesive material is an epoxy formulation having from about 60 to about 80 percent filler by weight and with about 3 percent by weight insulative granules added.
Claim 6
Dependent Claim
23 words
An apparatus as set forth in claim 1 wherein said adhesive material has a thermal resistance from 0.220* to 0.336*C per watt inch2.
Claim 7
Dependent Claim
38 words
An apparatus as set forth in claim 1 wherein said coating is between about 0.006 inch and about 0.010 inch thick and has a dielectric strength of between about 500 volts and about 800 volts per 0.001 inch.
Claim 8
Dependent Claim
26 words
An apparatus as set forth in claim 1 wherein said coating includes an epoxy formulation having from about 35 to about 50 percent filler by weight.
Claim 9
Dependent Claim
24 words
An apparatus as set forth in claim 1 wherein said coating material has a thermal resistance range of 0.426* to 1.278*C per watt inch2.
Claim 10
Dependent Claim
37 words
An apparatus as set forth in claim 1 wherein the electrical insulation from an electrical device mounted on said heat sink to said supportive surface will withstand a voltage within the range of 4200 to 7200 volts.
Claim 11
Dependent Claim
28 words
An apparatus as set forth in claim 1 wherein the mechanical bond strength of said adhesive material is between 880 pounds per inch2 and 1800 pounds per inch2.
Claim 12
Dependent Claim
40 words
Apparatus as set forth in claim 1 wherein said heat sink includes mountings for a plurality of electrical devices; said heat sink being substantially completely coated with said coating material for electrically insulating the plurality of semiconductors from one another.
Claim 13
Dependent Claim
22 words
An apparatus as set forth in claim 1 wherein said electrical devices are adhered to said heat sink by said adhesive material.
Claim 14
Independent Claim
208 words
An apparatus for mounting at least one semiconductor device to a power supply case comprising: a heat sink for supporting said at least one semiconductor device and for dissipating thermal energy, said heat sink having a first portion disposed adjacent said power supply case; at least said first portion of said heat sink being coated with a coating material including epoxy and a silica filler, said coating material having a thermal resistance between about 0.426* and about 1.278*C per watt inch2; an adhesive material positioned between said coating on said first portion of said heat sink and a corresponding portion of said power supply case for mounting said heat sink to said power supply case; said adhesive material including epoxy and a silica filler, with silica granules added to facilitate the provision of a predetermined spacing between said coating on said first portion of said heat sink and said corresponding portion of said power supply case; said adhesive material having a thermal resistance between about 0.220* and about 0.336*C per watt inch2; said coating material together with said adhesive material providing a dielectric strength to withstand between about 4200 and about 7200 volts and a mechanical strength of between about 880 and about 1800 pounds per square inch.
Claim 15
Independent Claim
208 words
An apparatus for mounting at least one semiconductor device to a power supply case comprising: a heat sink for supporting said at least one semiconductor device and for dissipating thermal energy, said heat sink having a first portion disposed adjacent said power supply case; at least said first portion of said heat sink being coated with a coating material including epoxy and a silica filler, said coating material having a thermal resistance between about 0.426* and about 1.278*C per watt inch2; an adhesive material positioned between said coating on said first portion of said heat sink and a corresponding portion of said power supply case for mounting said heat sink to said power supply case; said adhesive material including epoxy and a silica filler, with silica granules added to facilitate the provision of a predetermined spacing between said coating on said first portion of said heat sink and said corresponding portion of said power supply case; said adhesive material having a thermal resistance between about 0.220* and about 0.336*C per watt inch2; said coating material together with said adhesive material providing a dielectric strength to withstand between about 4200 and about 7200 volts and a mechanical strength of between about 880 and about 1800 pounds per square inch.
Claim 16
Dependent Claim
31 words
An apparatus as set forth in claim 1 wherein at least selected other portions of said heat sink removed from said supportive surface also have a coating of said coating material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-11-04 | 1978-05-06 | 1978-11-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-11-04 | 1982-05-06 | 1982-11-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-11-04 | 1986-05-06 | 1986-11-05 | $7700.00 | Window Closed / Lapsed |