US3842492A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of providing conductor leads for a semiconductor body
Assignee: US Philips Corp
•
Filing: 1971-12-02
•
Granted: 1974-10-22
•
Expires: 1991-12-02
Abstract
Abstract A method of manufacturing a semiconductor device in which a semiconductor body is secured to a support, contact pads on the semiconductor body are connected, by means of wires, to one end of current conductors and an envelope of synthetic resin is provided. The current conductors are formed from a metal strip into a conductor grid having the ends which will be adjacent the semiconductor body connected together by means of a connection strip. The connection strip is then cut between juxtaposed conductors to form widened conductor ends for more secure encapsulation. Several methods are described for insulating the widened ends from one another.
Inventors
- 👤 D Kamerbeek
- 👤 De Water J Van
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 08:54
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/048; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
174 words
A method of providing conductor leads for a semiconductor body, comprising: forming a spaced pattern of conductor leads having a first supporting strip connecting the ends of said leads intended to be remote from the semiconductor body and having a second supporting strip connecting the other ends of said strips intended to be electrically connected to said semiconductor body; severing said second supporting strip into segments, each segment thereof being connected to an individual conductor lead, thereby forming widened ends for said conductor leads to assure rigid support for said other ends of said leads upon encapsulation thereof; increasing the physical separation between adjacent edges of adjacent widened ends formed by said severing by moving at least one of each of said adjacent edges relative to the other of said adjacent edges; positioning said widened ends adjacent said semiconductor body and electrically connecting conductive wires from said widened ends to desired locations on said semiconductor body; and encapsulating said widened ends and said connecting conductive wires to said semiconductor body in an insulating encapsulant.
Claim 2
Independent Claim
174 words
A method of providing conductor leads for a semiconductor body, comprising: forming a spaced pattern of conductor leads having a first supporting strip connecting the ends of said leads intended to be remote from the semiconductor body and having a second supporting strip connecting the other ends of said strips intended to be electrically connected to said semiconductor body; severing said second supporting strip into segments, each segment thereof being connected to an individual conductor lead, thereby forming widened ends for said conductor leads to assure rigid support for said other ends of said leads upon encapsulation thereof; increasing the physical separation between adjacent edges of adjacent widened ends formed by said severing by moving at least one of each of said adjacent edges relative to the other of said adjacent edges; positioning said widened ends adjacent said semiconductor body and electrically connecting conductive wires from said widened ends to desired locations on said semiconductor body; and encapsulating said widened ends and said connecting conductive wires to said semiconductor body in an insulating encapsulant.
Claim 3
Dependent Claim
33 words
A method as defined in claim 1 wherein said step of increasing the physical separation comprises the step of bringing said adjacent edges of said adjacent widened ends to mutually different positional levels.
Claim 4
Dependent Claim
27 words
A method as defined in claim 1 wherein said step of increasing the physical separation comprises twisting said widened ends about the axes of said conductor leads.
Claim 5
Dependent Claim
25 words
A method as defined in claim 1 wherein said step of increasing the physical separation comprises bringing said adjacent widened ends to mutually different planes.
Claim 6
Dependent Claim
22 words
A method as defined in claim 1 wherein said step of increasing the physical separation comprises bending at least alternate widened ends.
Claim 7
Dependent Claim
27 words
A method as defined in claim 1 wherein said step of increasing the physical separation comprises bending at least alternate conductor leads near the widened ends thereof.
Claim 8
Dependent Claim
26 words
A method as defined in claim 1 further comprising after the encapsulating step the further step of removing said first supporting strip from said conductor leads.
References Cited (Backward Citations)
US3262022A
Cited
US3431092A
Cited
US3482419A
Cited
US3487541A
Cited
US3494022A
Cited
US3702954A
Cited
US3689336A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-10-21 | 1978-04-22 | 1978-10-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-10-21 | 1982-04-22 | 1982-10-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-10-21 | 1986-04-22 | 1986-10-22 | $7700.00 | Window Closed / Lapsed |