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US3816906A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of dividing mg-al spinel substrate wafers coated with semiconductor material and provided with semiconductor components

Assignee: Siemens AG
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Filing: 1973-02-26
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Granted: 1974-06-18
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Expires: 1993-02-26
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Abstract

Abstract Process of dividing a plurality of semiconductor components on a Mg-Al spinel substrate, coated with semiconductor material. The process comprises providing the spinel substrate wafer, prior to the production of the individual semiconductor elements, with a marking which indicates the <100> directions, producing the semiconductor elements so that their boundaries are parallel to the marked <100 > directions, scoring and mechanically dividing the entire substrate wafer into individual components along these lines.

Inventors

  • 👤 R Falckenberg

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 07:39
CPC Classifications
B; B28; B28D; B28D5/00; B28D5/0005; B28D5/0011; H; H10; H10P; H10P95/00; Y; Y10; Y10S; Y10S148/00; Y10S148/028; Y10S148/051; Y10S148/115; Y10S148/15

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 33 words
The method of claim 1, wherein a (100) oriented surface of said pinel spinel wafer is used and the scored lines and boundary lines are parallel to the 100 directions of the substrate.
Claim 2
Dependent Claim 21 words
The method of claim 1, wherein the epitaxially grown layer is selected from silicon, germanium, an AIIIBV compound and silicon carbide.

References Cited (Backward Citations)

US3054709A Cited
US3349475A Cited
US3332143A Cited
US3433684A Cited
US3542266A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1977-06-17 1977-12-17 1978-06-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1981-06-17 1981-12-17 1982-06-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1985-06-17 1985-12-17 1986-06-18 $7700.00 Window Closed / Lapsed

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