Abstract A method and means for forming electrical joints between intermediate parts of an elongated conductor and selected conductive elements on an electrical assembly. The electrical assembly is mounted upon a shiftable support means. A shiftable soldering assembly is positioned above the support means and carries an intermediate part of the elongated conductor. The soldering assembly and support means are shifted relative to each other to cause the intermediate conductor part to be held against a selected conductive element. The intermediate conductor part is then heated to cause the stripping or melting of the insulation, if any, from the conductor part and the melting of the solder on the conductive element in contact with the conductor part. The conductor part is then cooled to permit the melted solder to adheringly solidify to the conductor part. With the conductor part so anchored to the electrical assembly the soldering assembly and support means are shifted relative to each other to cause another intermediate part of the conductor to be held against another selected conductive element. This last mentioned intermediate conductor part is heated and cooled to cause its adherence to the contacting conductive element in the manner previously described for heating and cooling the first mentioned intermediate conductor part.
A method of forming joints between spaced parts of an elongated flexible heat strippable insulated conductor and selected spaced conductive elements of an electrical assembly, wherein one of said conductor and said elements carries solder, comprising the steps: a. positioning a said part of said conductor and a said conductive element in contact at said solder, b. heating said conductor part to strip the insulation therefrom and to melt said solder where said conductor part and condUctive element contact; c. cooling the area where said conductor part and said conductive element contact to promote rapid solidification of the molten solder and to adhere said conductor part and said conductive element by directing air under pressure about said area while maintaining said conductor part and said conductive element in contact; d. then shifting at least one of said electrical assembly and said conductor relative to the other to position a second part of said conductor in contact with a second conductive element at said solder; e. heating said second conductor part to strip the insulation therefrom and to melt said solder where said second conductive part and said second conductive element contact; and f. cooling the area where said second conductor part and said second conductive element contact to promote rapid solidification of the molten solder and to adhere said second conductor part and said second conductive element by directing air under pressure about said last mentioned area while maintaining said second conductor part and said second conductive element in contact.
Claim 2
Independent Claim
250 words
A method of forming joints between spaced parts of an elongated flexible heat strippable insulated conductor and selected spaced conductive elements of an electrical assembly, wherein one of said conductor and said elements carries solder, comprising the steps: a. positioning a said part of said conductor and a said conductive element in contact at said solder, b. heating said conductor part to strip the insulation therefrom and to melt said solder where said conductor part and condUctive element contact; c. cooling the area where said conductor part and said conductive element contact to promote rapid solidification of the molten solder and to adhere said conductor part and said conductive element by directing air under pressure about said area while maintaining said conductor part and said conductive element in contact; d. then shifting at least one of said electrical assembly and said conductor relative to the other to position a second part of said conductor in contact with a second conductive element at said solder; e. heating said second conductor part to strip the insulation therefrom and to melt said solder where said second conductive part and said second conductive element contact; and f. cooling the area where said second conductor part and said second conductive element contact to promote rapid solidification of the molten solder and to adhere said second conductor part and said second conductive element by directing air under pressure about said last mentioned area while maintaining said second conductor part and said second conductive element in contact.
Claim 3
Dependent Claim
59 words
The method of claim 1 wherein each step (a) and (d) thereof includes engaging each conductor part with a soldering tip and utilizing said soldering tip to position said conductor part against a conductive element and wherein each step (b) and (e) thereof includes heating said soldering tip to cause said heating of the conductor part in contact therewith.