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Patent US3801874A successfully refreshed from Google Patents.
US3801874A
Expired / Lapsed
US
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Isolation mounting for semiconductor device
Assignee: General Electric Co
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Filing: 1972-10-30
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Granted: 1974-04-02
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Expires: 1992-10-30
Abstract
Abstract An isolation mounting for a semiconductor device includes a metal heat sink plate to receive heat from the semiconductor device and insulating means to electrically isolate the semiconductor device from the plate which receives the heat. A metal fastener presses the semiconductor device against an insulating wafer which is in turn pressed against the heat sink plate. An insulating liner separates the fastener electrically from metal of the semiconductor device.
Inventors
- 👤 J Stefani
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 13:26
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W40/20; H10W40/231; H10W40/235
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
155 words
An isolation mounting for a semiconductor device which comprises a heat sink plate having a mounting hole therein, a semiconductor device including a metal tab having a solid state element attached thereto and a mounting hole through said tab, a heat conductive electrically insulating wafer having a mounting hole therethrough, the holes of said plate, tab, and wafer being aligned, metal attachment means extending through the respective holes and maintaining said wafer between said tab and said plate in pressure contact with said plate and tab, insulating means for isolating the metal of said tab from the metal of said attachment means, said insulating means including an insulating spacer of a low compressibility material between the attachment means and the metal surface around the hole of said tab, and said insulating means including an insulating collar of a high compressibility material between the attachment means and the metal surface within the hole of said tab.
Claim 2
Dependent Claim
155 words
An isolation mounting for a semiconductor device which comprises a heat sink plate having a mounting hole therein, a semiconductor device including a metal tab having a solid state element attached thereto and a mounting hole through said tab, a heat conductive electrically insulating wafer having a mounting hole therethrough, the holes of said plate, tab, and wafer being aligned, metal attachment means extending through the respective holes and maintaining said wafer between said tab and said plate in pressure contact with said plate and tab, insulating means for isolating the metal of said tab from the metal of said attachment means, said insulating means including an insulating spacer of a low compressibility material between the attachment means and the metal surface around the hole of said tab, and said insulating means including an insulating collar of a high compressibility material between the attachment means and the metal surface within the hole of said tab.
Claim 3
Dependent Claim
15 words
The isolation mounting of claim 1 in which the attachment means is a metal fastener.
Claim 4
Dependent Claim
22 words
The isolation mounting of claim 1 in which the attachment means is a rivet deformed at one end thereof against said plate.
Claim 5
Dependent Claim
27 words
The isolation mounting of claim 1 in which the insulating means includes a deformable insulating collar extending through the hole of said tab and of said wafer.
Claim 6
Dependent Claim
46 words
The isolation mounting of claim 1 in which the insulating means includes a collar of greater length than the length of the aligned holes of said plate, tab and wafer, and in which said collar is compressed against said spacer and against the rivet extending therethrough.
Claim 7
Dependent Claim
20 words
The isolation mounting of claim 1 in which the heat sink plate is the face plate of a dimmer device.
Claim 8
Dependent Claim
22 words
The isolation mounting of claim 1 in which the insulating wafer is a metal oxide in ceramic form of high heat conductivity.
Claim 9
Dependent Claim
18 words
The isolation mounting of claim 1 in which the solid state device is encased within an insulating jacket.
References Cited (Backward Citations)
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Cited
US3411049A
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US3430336A
Cited
US3465212A
Cited
US3571663A
Cited
US3641474A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-04-01 | 1977-10-01 | 1978-04-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-04-01 | 1981-10-01 | 1982-04-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-04-01 | 1985-10-01 | 1986-04-02 | $7700.00 | Window Closed / Lapsed |