Semiconductor mounting structure

Claim 2

A mounting structure for a capsule containing a heatgenerating semiconductor, said capsule having apertured mounting means and leads protruding from the electrodes of said semiconductor, said structure comprising: a circuit board of insulating material, a plug-in connector socket affixed to one side of said circuit board, with terminals extending through said board, and having a plurality of receptacles adapted to receive said respective semiconductor electrode leads; and a heat-dissipating metal plate having an anchor hole adapted to receive an anchoring screw through the mounting means aperture of said capsule, said metal plate further having first and second restraining members spaced on opposite sides of said anchor hole and positioned to engage the body portion of said capsule so as to prevent lateral movement of said capsule when said anchoring screw is tightened, said plate and said circuit board being attached to one another in a substantially perpendicular relation such that said capsule, with its semiconductor electrode leads inserted into said connector socket and said anchoring screw tightened, is held in firm heat-conducting contact with said metal plate.

Claim 3

A semiconductor capsule-mounting structure as defined in claim 1, wherein: said mounting means comprises an apertured tab extending from the semiconductor-containing body portion of said capsule.

Claim 4

A semiconductor capsule-mounting structure as defined in claim 2, wherein: said two spaced restraining members are positioned on opposite sides of the body portion of said capsule and extend over the edges of said capsule to support said capsule against said plate and to prevent lateral movement of said capsule when said anchoring screw is tightened.

Claim 5

A semiconductor capsule-mounting structure as defined in claim 3, wherein: said restraining blocks are extruded from said metal plate.

Claim 6

A semiconductor capsule-mounting structure as defined in claim 4, wherein: said anchor hole is extruded from said plate; and said anchoring screw is self-tapping.

Claim 7

A mounting structure for a capsule containing a heat-generating semiconductor, said capsule having leads protruding from the electrodes of said semiconductor and apertured mounting means comprising an apertured tab extending from the semiconductor-containing body portion of said capsule, said structure comprising: a circuit board of insulating material; a heat-dissipating metal plate attached in substantially perpendicular relation to said circuit board, said plate having an anChor hole adapted to receive an anchoring screw through the mounting means aperture of said capsule, and two spaced restraining blocks positioned on opposite sides of the body portion of said capsule to prevent lateral movement of said capsule when said anchoring screw is tightened; a connector socket affixed to one side of said circuit board, with terminals extending through said board, and having a plurality of receptacles substantially parallel to said metal plate adapted to receive said respective semiconductor electrode leads; wherein said semiconductor electrode leads protrude from the body portion of said capsule substantially parallel to said capsule-mounting tab and said metal plate; and said plate and said circuit board are attached to each other in such relation that said capsule, with its semiconductor electrode leads inserted into said connector and said anchor screw tightened, is held in firm heat-conducting contact with said metal plate.

Claim 8

A mounting structure for a capsule containing a heat-generating semiconductor, said capsule having leads protruding from the electrodes of said semiconductor and apertured mounting means comprising an apertured tab extending from the semiconductor-containing body portion of said capsule, said structure comprising: a circuit board of insulating material; a heat-dissipating metal plate attached in substantially perpendicular relation to said circuit board, said plate having an anChor hole adapted to receive an anchoring screw through the mounting means aperture of said capsule, and two spaced restraining blocks positioned on opposite sides of the body portion of said capsule to prevent lateral movement of said capsule when said anchoring screw is tightened; a connector socket affixed to one side of said circuit board, with terminals extending through said board, and having a plurality of receptacles substantially parallel to said metal plate adapted to receive said respective semiconductor electrode leads; wherein said semiconductor electrode leads protrude from the body portion of said capsule substantially parallel to said capsule-mounting tab and said metal plate; and said plate and said circuit board are attached to each other in such relation that said capsule, with its semiconductor electrode leads inserted into said connector and said anchor screw tightened, is held in firm heat-conducting contact with said metal plate.

Claim 9

A semiconductor capsule-mounting structure as defined in claim 6, wherein: said mounting tab aperture is provided with an insulating bushing to electrically isolate said anchoring screw from said capsule.

Claim 10

A semiconductor capsule-mounting structure as defined in claim 7, wherein: a thin sheet of heat-conducting, electrically insulating material is inserted between said capsule and said metal plate.