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Method of manufacturing a semiconductor region

Assignee: Telefunken Electronic GmbH
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Filing: 1971-06-28
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Granted: 1974-02-12
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Expires: 1991-06-28
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Abstract

Abstract A method of manufacturing a semiconductor region comprises forming a layer of diffusion material over a diffusion window and a layer of insulating material on a semiconductor body and in which the diffusion window is formed, removing the diffusion material from the insulating layer so as to leave the diffusion material over the diffusion window and diffusing the diffusion material through the diffusion window into the semiconductor body.

Inventors

  • 👤 K Merchant

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 11:53
CPC Classifications
H; H10; H10P; H10P95/00; H10D; H10D99/00; H10P32/00; H10P32/10; H10P32/14; H10P32/1408; H10P32/141; H10P32/17; H10P32/171

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 31 words
A method as defined in claim 1, wherein said diffusion material layer is removed by etching using an etching mask having an area larger than the area of said diffusion window.
Claim 2
Dependent Claim 22 words
A method as defined in claim 1, wherein said first diffusion stage occurs simultaneously with the formation of said diffusion material layer.
Claim 3
Dependent Claim 24 words
A method as defined in claim 1, wherein said diffusion material layer is a glass layer formed by vapour diffUsion in an oxidising atmosphere.
Claim 4
Dependent Claim 36 words
A method as defined in claim 1, wherein said semiconductor body includes a base region and wherein an emitter region of a transistor is formed by said diffusion through said diffusion window into the base region.
Claim 5
Dependent Claim 51 words
A method as defined in claim 5, wherein said diffusion material layer is removed by etching using an etching mask whose area is larger than that of said diffusion window so as to cover not only said diffusion window but also a portion of said insulating layer adjacent said diffusion window.
Claim 6
Dependent Claim 77 words
A method as defined in claim 6 wherein a major portion of the surface area of said insulating layer is free of the etching mask so that this area is free of said diffusion material layer subsequent to the etching, and further comprising the step of forming a further window in said area of said insulating layer which is free of said diffusion material layer for providing a contact area for the base region of the transistor.
Claim 7
Dependent Claim 17 words
A method as defined in claim 7, wherein said etching mask is a layer of photo-sensitive lacquer.
Claim 8
Dependent Claim 21 words
A method as defined in claim 8, wherein said diffusion window for said emitter region is used for a phosphorus diffusion.

References Cited (Backward Citations)

US3341381A Cited
US3507716A Cited
US3437533A Cited
US3634133A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1977-02-11 1977-08-13 1978-02-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1981-02-11 1981-08-13 1982-02-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1985-02-11 1985-08-13 1986-02-12 $7700.00 Window Closed / Lapsed

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