Patent US970050A successfully refreshed from Google Patents.
Patent US3791019A successfully refreshed from Google Patents.
US3791019A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of soldering a conductor to a semiconductor
Assignee: Robert Bosch GmbH
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Filing: 1972-04-28
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Granted: 1974-02-12
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Expires: 1992-04-28
Abstract
Abstract A semi-conductor element is to be connected with one or more conductor members by soft-soldering. The conductor member is formed with a nose-like projection having circumferential surface portions and a free end face which is planar and with which the circumferential surface portions define arcuate angles. Liquid solder is flow-deposited on the surface portions and on the end face to form a solder-coating on them, particularly on the surface portions, and thereupon the coated endface is abutted against the semi-conductor element and soldered thereto.
Inventors
- 👤 G Schmidt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 15:49
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/08; H; H10; H10W; H10W72/00; H10W72/30; B23K1/085; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/07351; H10W72/07354; H10W72/341; H10W72/347; H10W72/351; H10W72/352; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
137 words
A method of connecting a conductor member with a semiconductor element provided with a face having a first surface area, comprising the steps of forming said conductor member with a circumferential surface, a free planar contact face spaced from said circumferential surface and having a second surface area substantially corresponding to said first surface area, and a recessed portion intermediate to, and forming obtuse angles with said circumferential surface and said contact face; flowdepositing liquid solder on said contact face as well as in said recessed portion to form a solder-coating on the same; abutting the thus coated contact face against said semi-conductor element so that said first and second surface areas face one another; and effecting adherence of said semi-conductor element to said solder so as to connect said element and said member with one another.
Claim 2
Independent Claim
137 words
A method of connecting a conductor member with a semiconductor element provided with a face having a first surface area, comprising the steps of forming said conductor member with a circumferential surface, a free planar contact face spaced from said circumferential surface and having a second surface area substantially corresponding to said first surface area, and a recessed portion intermediate to, and forming obtuse angles with said circumferential surface and said contact face; flowdepositing liquid solder on said contact face as well as in said recessed portion to form a solder-coating on the same; abutting the thus coated contact face against said semi-conductor element so that said first and second surface areas face one another; and effecting adherence of said semi-conductor element to said solder so as to connect said element and said member with one another.
Claim 3
Dependent Claim
45 words
A method as defined in claim 1, wherein the step of flow-depositing said solder comprises exposing said conductor member to a flowing quantity of liquid solder so that the same flows about said conductor member and adheres predominantly to said contact face and recessed portion.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-02-11 | 1977-08-13 | 1978-02-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-02-11 | 1981-08-13 | 1982-02-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-02-11 | 1985-08-13 | 1986-02-12 | $7700.00 | Window Closed / Lapsed |