Patent US3786556A successfully refreshed from Google Patents.
US3786556A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mounting semiconductor bodies
Assignee: US Philips Corp
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Filing: 1971-12-10
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Granted: 1974-01-22
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Expires: 1991-12-10
Abstract
Abstract Method of securing a semiconductor body to a support surface comprising steps of placing semiconductor body face in contact with surface with at least one solder body on the surface and spaced laterally from the semiconductor body, melting solder to cause it to flow by capillary action between the body face and support surface, and cooling solder to provide intermediate layer between the surface and the body face. Also, a product made by this method.
Inventors
- 👤 A Weston
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 18:13
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/351; H10W72/352; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
112 words
A method of securing a semiconductor body to a support surface, comprising the steps of: a disposing said body on said surface so that a face of said body contacts at least a part of said surface, b disposing on said surface at least one body of solder material, said solder body being spaced laterally from said semi-conductor body; c heating said solder body to a temperature exceeding the melting point thereof so that molten solder material flows by capillary action over said part of said surface; and d cooling said solder material so as to provide an intermediate solder layer at least between said surface part and said semiconductor body face.
Claim 2
Independent Claim
112 words
A method of securing a semiconductor body to a support surface, comprising the steps of: a disposing said body on said surface so that a face of said body contacts at least a part of said surface, b disposing on said surface at least one body of solder material, said solder body being spaced laterally from said semi-conductor body; c heating said solder body to a temperature exceeding the melting point thereof so that molten solder material flows by capillary action over said part of said surface; and d cooling said solder material so as to provide an intermediate solder layer at least between said surface part and said semiconductor body face.
Claim 3
Dependent Claim
33 words
A method as recited in claim 1, Wherein a plurality of said bodies of solder material are situated on said support surface and are substantially symmetrically disposed with respect to said semiconductor body.
Claim 4
Dependent Claim
20 words
A method as recited in claim 1, wherein two solder bodies are disposed at opposite sides of said semiconductor body.
Claim 5
Dependent Claim
23 words
A method as recited in claim 1, wherein a single solder body is used, said solder body only partially surrounding said semiconductor body.
Claim 6
Dependent Claim
34 words
A method as recited in claim 1, wherein said semiconductor body is of silicon and at least the part of said support to which said semiconductor body is to be secured is of copper.
Claim 7
Dependent Claim
43 words
A method as recited in claim 5, wherein the surface of said copper support part comprises a layer of gold on a layer of one of nickel and cobalt and said solder body consists essentially of an alloy of lead, silver and tin.
Claim 8
Dependent Claim
43 words
A method as claimed in claim 6, wherein prior to locating said semiconductor body at said support surface, a layer of titanium is provided at said face of said silicon semiconductor body and a layer of silver is provided on said titanium layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-01-21 | 1977-07-23 | 1978-01-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-01-21 | 1981-07-23 | 1982-01-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-01-21 | 1985-07-23 | 1986-01-22 | $7700.00 | Window Closed / Lapsed |