Method for making semiconductor devices employing a hollow, slotted cylindrical jig and vertical mounting posts

Claim 1

A METHOD OF FABRICATING AN ELECTRONIC DEVICE WHICH INCLUDES A PLURALITY OF VERTICALLY POSITIONED AND ELECTRICALLY AND MECHANICALLY CONNECTED PORTIONS, SAID METHOD INCLUDING THE STEPS OF PROVIDING A CYLINDRICAL HOLLOW FIXTURE WITH A PLURALITY OF SLOTS OPENING FROM THE TOP OF SAID FIXTURE AND EXTENDING A PREDETERMINED DISTANCE DOWNWARDLY THEREFROM, ENCLOSING ONE OF SAID PLURALITY OF PORTIONS WITH SAID FIXTURE AT THE BOTTOM PORTION OF THE FIXTURE, PLACING IN PAIRS OF OPPOSITELY-ALIGNED ONES OF SAID SLOTS SPACER MEMBERS WHICH EXTEND ENTIRELY ACROSS THE FIXTURE, DROPPING INTO SAID CYLINDRICAL HOLLOW FIXTURE FROM THE TOP THEREOF A SECOND ONE OF SAID DEVICE PORTIONS AND PERMITTING IT TO DROP THEREIN AND GUIDED BY THE FIXTURE, AGAIN PLACING IN PAIRS OF OPPOSITELY-ALIGNED ONES OF SAID SLOTS SPACER MEMBERS WHICH EXTEND ENTIRELY ACROSS THE FIXTURE AND ARE FREE TO DROP DOWNWARDLY UNTIL RESTING ON A DEVICE PORTION, DROPPING INTO SAID CYLINDRICAL HOLLOW FIXTURE ANOTHER OF SAID PLURALITY OF PORTIONS TO REST ON THE LAST NAMED SPACER MEMBERS, PROVIDING MELTABLE MATERIAL BETWEEN THE VERTICALLY SPACED APART PORTIONS BUT OUT OF CONTACT WITH THE SPACER MEMBERS, HEATING THE FIXTURE AND THAT WITHIN THE FIXTURE TO MELT THE MELTABLE MATERIAL AND SECURE THE PORTIONS INTO AN ELECTRONIC DEVICE ASSEMBLY, COOLING THE ASSEMBLY, AND SEPARATING THE ASSEMBLED ELECTRONIC DEVICE FROM THE FIXTURE AND THE SPACER MEMBERS.