Package for mounting semiconductor device in microstrip line

Claim 2

A package for mounting a semiconductor device in a microstrip line comprising a substrate of electrically insulating material having a single central recess for mounting the semiconductor device therein, at least one pair of metal strips disposed respectively only on the upper surface portions of said electrically insulating substrate, at least one pair of substantially planar electrical leads partially disposed on the portions of and partially extending beyond said at least one pair of metal strips respectively, at least one pair of electrical leads for electrically connecting the semiconductor device with said at least one pair of metal strips respectively, and a conductive layer disposed on the lower surface of said electrically insulating substrate.

Claim 3

A microstrip line having a first conductive plate, a pair of planar blocks of dielectric material disposed on said first conductive plate to be spaced apart a predetermined distance from each other in the longitudinally extending direction of said first conductive plate, at least one pair of second conductive plates disposed respectively on the upper surface portions of said dielectric blocks in parallel with said first conductive plate, a substrate of electrically insulating material disposed in the space defined between said dielectric blocks and having a single central recess, a required semiconductor device mounted in said central recess, at least one pair of metal strips disposed respectively only on the upper surface portions of said electrically insulating substrate, at least one pair of substantially planar electrical leads partially disposed on the portions of said at least one pair of metal strips respectively and partially connected electrically on the portions of at least one pair of second conductive plates respectively, at least one pair of electrical leads for electrically connecting said semiconductor device with said at least one pair of metal strips respectively, and a conductive layer disposed on the lower surface of said electrically insulating substrate, the width and thickness of said substantially planar electrical leads being so selected that the impedance of said substantially planar electrical leads and said electrically insulating substrate is equal to the impedance of said microstrip line at the operating microwave frequency.

Claim 4

A microstrip line having a first conductive plate, a pair of planar blocks of dielectric material disposed on said first conductive plate to be spaced apart a predetermined distance from each other in the longitudinally extending direction of said first conductive plate, at least one pair of second conductive plates disposed respectively on the upper surface portions of said dielectric blocks in parallel with said first conductive plate, a substrate of electrically insulating material disposed in the space defined between said dielectric blocks and having a single central recess, a required semiconductor device mounted in said central recess, at least one pair of metal strips disposed respectively only on the upper surface portions of said electrically insulating substrate, at least one pair of substantially planar electrical leads partially disposed on the portions of said at least one pair of metal strips respectively and partially connected electrically on the portions of at least one pair of second conductive plates respectively, at least one pair of electrical leads for electrically connecting said semiconductor device with said at least one pair of metal strips respectively, and a conductive layer disposed on the lower surface of said electrically insulating substrate, the width and thickness of said substantially planar electrical leads being so selected that the impedance of said substantially planar electrical leads and said electrically insulating substrate is equal to the impedance of said microstrip line at the operating microwave frequency.

Claim 5

A microstrip line according to claim 2, wherein the thickness of said electrically insulating substrate on which said semiconductor device is mounted is about one-third of the thickness of said dielectric blocks.

Claim 6

A microstrip line according to claim 2, wherein the portion of said electrically insulating substrate on which said semiconductor device is mounted is made of a high heat conductor.

Claim 7

A microstrip line according to claim 2, wherein said semi-conductor device is a device operating at a frequency of not less than 3GHz.

Claim 8

A package for mounting a semiconductor device in a microstrip line comprising: a substrate of electrically insulating material having a single recess for mounting the semiconductor device therein; at least one pair of metal strips disposed respectively only on the upper surface portions of said electrically insulating substrate; at least one pair of substantially planar electrical leads partially disposed on the portions of and partially extending beyond said at least one pair of metal strips, respectively; and at least one pair of electrical leads for electrically connecting the semiconductor device with said at least one pair of metal strips, respectively.

Claim 9

A package for mounting a semiconductor device in a microstrip line comprising: a substrate of electrically insulating material having a single recess for mounting the semiconductor device therein; at least one pair of metal strips disposed respectively only on the upper surface portions of said electrically insulating substrate; at least one pair of substantially planar electrical leads partially disposed on the portions of and partially extending beyond said at least one pair of metal strips, respectively; and at least one pair of electrical leads for electrically connecting the semiconductor device with said at least one pair of metal strips, respectively.

Claim 10

A microstrip line having a first conductive plate; a pair of planar blocks of dielectric material disposed on said first conductive plate to be spaced apart a predetermined distance from each other; at least one pair of second conductive plates disposed respectively on the upper surface portions of said dielectric blocks; a substrate of electrically insulating material disposed in the space defined between said dielectric blocks and having a single recess; a required semiconductor device mounted in said recess; at least one pair of metal strips disposed respectively only on the upper surface portions of said electrically insulating substrate; at least one pair of substantially planar electrical leads partially disposed on the portions of said at least one pair of metal strips respectively and partially connected electrically on the portions of said at least one pair of second conductive plates, respectively; and at least one pair of electrical leads for electrically connecting said semiconductor device with said at least one pair of metal strips, respectively.

Claim 11

A microstrip line having a first conductive plate; a pair of planar blocks of dielectric material disposed on said first conductive plate to be spaced apart a predetermined distance from each other; at least one pair of second conductive plates disposed respectively on the upper surface portions of said dielectric blocks; a substrate of electrically insulating material disposed in the space defined between said dielectric blocks and having a single recess; a required semiconductor device mounted in said recess; at least one pair of metal strips disposed respectively only on the upper surface portions of said electrically insulating substrate; at least one pair of substantially planar electrical leads partially disposed on the portions of said at least one pair of metal strips respectively and partially connected electrically on the portions of said at least one pair of second conductive plates, respectively; and at least one pair of electrical leads for electrically connecting said semiconductor device with said at least one pair of metal strips, respectively.

Claim 12

A microstrip line according to claim 7, wherein the width and thickness of said substantially planar electrical leads is so selected that the impedance of said substantially planar electrical leads and said electrically insulating substrate is equal to the impedance of said microstrip line at the operating microwave frequency.

Claim 13

A microstrip line according to claim 7, wherein the portion of said electrically insulating substrate on which said semiconductor device is mounted is made of a high heat conductor.

Claim 14

A microstrip line according to claim 7, wherein said semiconductor device is a device operating at a frequency of not less than 3 GHz.

Claim 15

A microstrip line according to claim 2, wherein the upper surfaces of said at least one pair of metal strips are of substantially the same height as the upper surfaces of said at least one pair of second conductive plates.

Claim 16

A microstrip line according to claim 7, wherein the upper surfaces of said at least one pair of metal strips are of substantially the same height as the upper surfaces of said at least one pair of second conductive plates.