Patent US3783347A successfully refreshed from Google Patents.
US3783347A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat-extracting housing for semiconductor
Assignee: Semikron GmbH and Co KG
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Filing: 1972-07-27
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Granted: 1974-01-01
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Expires: 1992-07-27
Abstract
Abstract A semiconductor tablet is in thermally conductive contact with one face of an oxide ceramic plate. A plastic cover is molded around the tablet and is mechanically locked to the oxide ceramic plate. The opposite face of the oxide ceramic plate is free of the plastic cover so that heat extracting means can contact it.
Inventors
- 👤 L Vladik
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 23:33
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W90/00; Y; Y10; Y10S; Y10S257/00; Y10S257/909
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
183 words
A semiconductor arrangement, comprising: a thermally conducting, electrically insulating, continuous plate-shaped, oxide ceramic carrier which is metallized on at least a portion of one face; a semiconductor tablet mounted on and electrically contacted to said metallized portion of said one face; electrical conductor means spaced from said one face and electrically contacting said semiconductor tablet for additionally tapping said semiconductor tablet; a continuous plastic cover encasing said semiconductor tablet, the portion of said conductor means electrically contacting said tablet and said one face of said carrier, and extending over and covering a portion of the edge of said carrier in intimate contact therewith, said carrier having its face opposite said one face free of said plastic cover, whereby said opposite face may be thermally contacted for the extraction of heat; and means for mechanically securing said plastic cover to said carrier, said means for mechanically securing comprising a protruding rib and a mating indentation, one of which is formed on the surface of said edge of said carrier and the other of which is formed on the interior surface of said plastic cover.
Claim 2
Dependent Claim
183 words
A semiconductor arrangement, comprising: a thermally conducting, electrically insulating, continuous plate-shaped, oxide ceramic carrier which is metallized on at least a portion of one face; a semiconductor tablet mounted on and electrically contacted to said metallized portion of said one face; electrical conductor means spaced from said one face and electrically contacting said semiconductor tablet for additionally tapping said semiconductor tablet; a continuous plastic cover encasing said semiconductor tablet, the portion of said conductor means electrically contacting said tablet and said one face of said carrier, and extending over and covering a portion of the edge of said carrier in intimate contact therewith, said carrier having its face opposite said one face free of said plastic cover, whereby said opposite face may be thermally contacted for the extraction of heat; and means for mechanically securing said plastic cover to said carrier, said means for mechanically securing comprising a protruding rib and a mating indentation, one of which is formed on the surface of said edge of said carrier and the other of which is formed on the interior surface of said plastic cover.
Claim 3
Dependent Claim
16 words
A semiconductor arrangement as defined in claim 1 wherein said rib is arranged on said carrier.
Claim 4
Dependent Claim
20 words
A semiconductor arrangement as defined in claim 2, wherein said rib is continuous about the entire edge of said carrier.
Claim 5
Dependent Claim
27 words
A semiconductor arrangement as defined in claim 1, wherein said carrier is formed of a material selected from the group consisting of aluminum oxide, and beryllium oxide.
Claim 6
Dependent Claim
30 words
A semiconductor arrangement as defined in claim 4 wherein said carrier is formed of sintered aluminium oxide having a thermal conductivity of 30 Kcal/hm*C and a density of 3.8 g/cm3.
Claim 7
Dependent Claim
30 words
A semiconductor arrangement as defined in claim 4 wherein said carrier is formed of sintered beryllium oxide having a thermal conductivity of 0.6 cal/cm sec*C and a density of 2.9g/cm3.
Claim 8
Dependent Claim
26 words
A semiconductor arrangement as defined in claim 1 wherein said carrier has a rough surface whereby the adhesion of said cover to said carrier is improved.
Claim 9
Dependent Claim
20 words
A semiconductor arrangement as defined in claim 1 wherein said cover is formed of a silicone resin containing milled alumina.
Claim 10
Dependent Claim
51 words
A semiconductor arrangement as defined in claim 1, wherein said semiconductor tablet has a high current carrying capacity, and wherein said arrangement further comprises a conductor contacting said metallized face and a refractory metal piece interposed between said semiconductor tablet and said electrical conductor means for additionally tapping said semiconductor tablet.
Claim 11
Dependent Claim
21 words
A semiconductor arrangement as defined in claim 1 wherein said tablet is soldered to said metallized portion of said one face.
Claim 12
Dependent Claim
47 words
A semiconductor arrangement as defined in claim 10 further comprising at least one additional semiconductor tablet soldered to said metallized portion of said one face, said metallized portion being continuous between said tablets, said conductor means tapping said tablets to connect same in a rectifying circuit pattern.
Claim 13
Dependent Claim
98 words
A semiconductor arrangement as defined in claim 1, wherein said tablet is a semiconductor rectifier and said face of said carrier which is opposite said one face is planar, and further comprising a metal cooling plate thermally contacting said face opposite said one face, said metal cooling plate having a portion thereof which forms a spring clip means, which extends along the edge of said carrier and said cover and over the exposed surface of said cover, for causing said face opposite the metallized face to bear with force against sAid metal cooling plate for improved heat transfer.
Claim 14
Dependent Claim
40 words
A semiconductor arrangement as defined in claim 1 further comprising means for mounting said carrier on a support, said means comprising a pair of plate shape lugs with mounting holes, said lugs extending laterally from opposite edges of said carrier.
Claim 15
Dependent Claim
79 words
A semiconductor arrangement as defined in claim 1 wherein said electrical conductor means comprises an electrical conductor connected to said semiconductor tablet and extending directly therefrom through said cover to form an external lead for said semiconductor arrangement; and further comprising a further electrical conductor connected to said metallized portion of said one face and extending directly therefrom laterally beyond the edge of said carrier and through said cover to form a further external lead for said semiconductor arrangement.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-12-31 | 1977-07-02 | 1978-01-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-12-31 | 1981-07-02 | 1982-01-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-12-31 | 1985-07-02 | 1986-01-01 | $7700.00 | Window Closed / Lapsed |