US3783346A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor arrangement
Assignee: Semikron GmbH and Co KG
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Filing: 1971-11-08
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Granted: 1974-01-01
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Expires: 1991-11-08
Abstract
Abstract A semiconductor arrangement including a continuous band of planar conductive material forming a geometric structure with periodically repeating zones. The structure has conductor portions connected together by a longitudinal edge strip serving as a transporting strip, at least one contact bar extending alongside the transporting strip and connected to the transporting strip by a plurality of ones of the conductor portions, and planar contact portions which are also connected to the transporting strip and arranged between pairs of the plurality of conductor portions. The contact bar is arranged to be offset and to overlap a number of the contact portions by bending the conductor portions in the direction of the transporting strip and to contact the contact portions under pressure in the manner of a spring to form a clamp-type mount with the contact portions for at least one semiconductor wafer.
Inventors
- 👤 W Schierz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 19:48
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/481; H10W76/00; H10W76/10; H10W76/12; H10W76/161
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
323 words
In a semiconductor arrangement having a plurality of semiconductor devices, particularly rectifier devices, aligned in a plane, with the semiconductor wafers of said devices being contacted between sections of associated conductor portions which form a clamp-type mount; wherein said arrangement includes a continuous band-shaped or planar strip of conductor material which is provided with openings to form a planar geometric structure therein with periodically repeating zones, the structure having bar-shaped conductor portions connected together by a longitudinal edge zone which serves as a transporting strip, and with one of the conductor portions which is associated with a semiconductor wafer being bent out of the plane of said band and displaced parallelly so that it overlaps the other conductor portion associated with the same conductor wafer to thereby form the clamp-type mount for the semiconductor wafer, and with the center line of one section of each conductor portion which constitutes an external lead for a device serving as a reference mark for separating the geometric structure into any number of desired rectifier circuits, the improvement wherein said geometric conductor structure comprises: at least one continuous contact bar extending parallel to said transporting strip and being connected to said transporting strip by a plurality of ones of said associated conductor portions, which serve as external connecting leads, and planar contact portions which are disposed between pairs of said plurality of said associated conductor portions which are connected with said transporting strip; and, said plurality of conductor portions associated with said contact bar being bent so as to parallelly offset said contact bar in the direction toward said transporting strip so that said contact bar overlaps a plurality of said contact portions and, due to the selection of an appropriate elastic material, contacts said contact portions under pressure in the manner of a spring so as to form one of said clamp-type mounts with each said overlapped contact portion for holding at least one semiconductor wafer.
Claim 2
Dependent Claim
323 words
In a semiconductor arrangement having a plurality of semiconductor devices, particularly rectifier devices, aligned in a plane, with the semiconductor wafers of said devices being contacted between sections of associated conductor portions which form a clamp-type mount; wherein said arrangement includes a continuous band-shaped or planar strip of conductor material which is provided with openings to form a planar geometric structure therein with periodically repeating zones, the structure having bar-shaped conductor portions connected together by a longitudinal edge zone which serves as a transporting strip, and with one of the conductor portions which is associated with a semiconductor wafer being bent out of the plane of said band and displaced parallelly so that it overlaps the other conductor portion associated with the same conductor wafer to thereby form the clamp-type mount for the semiconductor wafer, and with the center line of one section of each conductor portion which constitutes an external lead for a device serving as a reference mark for separating the geometric structure into any number of desired rectifier circuits, the improvement wherein said geometric conductor structure comprises: at least one continuous contact bar extending parallel to said transporting strip and being connected to said transporting strip by a plurality of ones of said associated conductor portions, which serve as external connecting leads, and planar contact portions which are disposed between pairs of said plurality of said associated conductor portions which are connected with said transporting strip; and, said plurality of conductor portions associated with said contact bar being bent so as to parallelly offset said contact bar in the direction toward said transporting strip so that said contact bar overlaps a plurality of said contact portions and, due to the selection of an appropriate elastic material, contacts said contact portions under pressure in the manner of a spring so as to form one of said clamp-type mounts with each said overlapped contact portion for holding at least one semiconductor wafer.
Claim 3
Dependent Claim
48 words
A semiconductor arrangement as defined in claim 1, wherein said contact bar is formed by an additional longitudinal edge strip of said planar conductive material, and wherein all of said zones of said geometric structure are connected together by said contact bar provided as a continuous contacting strip.
Claim 4
Dependent Claim
71 words
A semiconductor arrangement as defined in claim 1, further comprising a further continuous contact bar disposed in each zone of said geometric structure between the other said contact bar and said transporting strip and extending parallel to said transporting strip, said further contact bar being connected by a plurality of said baR-shaped conductor portions with said transporting strip and forming therewith a pair of contacting components for d.c. or a.c. connection.
Claim 5
Dependent Claim
96 words
A semiconductor arrangement as defined in claim 3 wherein said plurality of bar-shaped conductor portions associated with said further contact bar are bent so as to parallelly offset said further contact bar in the direction toward said transporting strip so that said further contact bar overlaps a plurality of said contact portions and, due to the selection of an appropriate elastic material, contacts said contact portions under pressure in the manner of a spring so as to form one of said clamp-type mounts with each said overlapped contact portion for holding at least one semiconductor wafer.
Claim 6
Dependent Claim
65 words
A semiconductor arrangement as defined in claim 4 wherein the said plurality of conductor portions associated with said other contact bar are bent so that said other contact bar contacts one surface of said contact portions and said plurality of bar-shaped conductor portions associated with said further contact bar are bent so that said further contact bar contacts the opposite surface of said contact portions.
Claim 7
Dependent Claim
47 words
A semiconductor arrangement as defined in claim 4 wherein the said plurality of conductor portions associated with each of said other and further contact bars are bent so that both of said contact bars contact the same surface of said contact portions in side by side relationship.
Claim 8
Dependent Claim
47 words
A semiconductor arrangement as defined in claim 3 wherein at least one bent section of said conductor portions is provided for insertion within a housing, and wherein said bent portion is configurated and dimensioned to serve as a plug-in mount for said geometric structure in said housing.
Claim 9
Dependent Claim
83 words
A semiconductor arrangement as defined in claim 4 wherein said further contact portion is connected to said transport strip via a pair of said bar-shaped conductor portions disposed between a pair of said conductor portions associated with said contact bar; and wherein there are a pair of said planar contact portions disposed between said pair of bar-shaped conductor portions associated with said further contact bar, said contact bar and said further contact bar each contacting each of said pair of planar contact portions.
References Cited (Backward Citations)
US3702954A
Cited
US3569797A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-12-31 | 1977-07-02 | 1978-01-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-12-31 | 1981-07-02 | 1982-01-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-12-31 | 1985-07-02 | 1986-01-01 | $7700.00 | Window Closed / Lapsed |