Patent US4925156A successfully refreshed from Google Patents.
Patent US3778883A successfully refreshed from Google Patents.
US3778883A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process of mass soldering electrical components to circuit boards having runs formed from insulated magnet wire
Assignee: Bull HN Information Systems Italia SpA
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Filing: 1972-06-02
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Granted: 1973-12-18
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Expires: 1992-06-02
Abstract
Abstract The soldering process uses eutectic solder raised to a higher than normal temperature for printed circuit board soldering. The higher temperature is used to remove the insulation from the wire to allow the solder to electrically fasten the wire and the components to the circuit boards. The process immerses the circuit board into the molten solder for a specific dwell time according to the temperature of the solder, the circuit board material and the insulation to be removed from the wire. The dwell time and solder bath temperature must fall within a determined operating range to remove the insulation from the wire and perform the soldering while preventing damage to the board.
Inventors
- 👤 K Bethsold
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 18:25
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; B; B23; B23K; B23K1/00; B23K1/08; B23K1/085; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/10; H05K2201/10227; H05K2201/10287; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49162
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
161 words
A process for mass soldering high-temperature-insulated-wire to printed circuit boards wherein the boards are prefluxed and preheated, comprising the steps of: experimentally determining a temperature-time relationship which results in the removal of the high-temperature insulation from the wire; experimentally determining a temperature-time relationsip which establishes limits at which degradation of the printed circuit board commences; determining a range of molten solder temperature and a corresponding dwell time during which the high-temperatureinsulated-wire circuit board can be in contact with the molten solder to effect removal of the insulation and soldering of the wire without damaging the printed circuit board; heating solder to a temperature which lies within the determined range; placing the prefluxed printed circuit board with hightemperature-insulated-wire attached in contact with the heated, molten solder; removing the board from the molten solder after the passage of the dwell time determined to be necessary to melt the hightemperature insulation and solder the wire; and cooling the removed board to harden the solder.
Claim 2
Dependent Claim
161 words
A process for mass soldering high-temperature-insulated-wire to printed circuit boards wherein the boards are prefluxed and preheated, comprising the steps of: experimentally determining a temperature-time relationship which results in the removal of the high-temperature insulation from the wire; experimentally determining a temperature-time relationsip which establishes limits at which degradation of the printed circuit board commences; determining a range of molten solder temperature and a corresponding dwell time during which the high-temperatureinsulated-wire circuit board can be in contact with the molten solder to effect removal of the insulation and soldering of the wire without damaging the printed circuit board; heating solder to a temperature which lies within the determined range; placing the prefluxed printed circuit board with hightemperature-insulated-wire attached in contact with the heated, molten solder; removing the board from the molten solder after the passage of the dwell time determined to be necessary to melt the hightemperature insulation and solder the wire; and cooling the removed board to harden the solder.
Claim 3
Dependent Claim
254 words
A process for mass soldering high-temperature-insulated-wire to printed circuit boards by the use of a dip soldering machine comprising the steps of: experimentally determining temperature-time relationships which result in removal of the high-temperature insulation from the wires and which establish limits at which damage to the printed circuit board begins; determining a range of molten solder temperature and a corresponding dwell time during which the high-temperature-insulated-wire circuit board can be in contact with the molten solder to effect removal of the insulation and soldering of the wire without damaging the board; setting controls on the dip soldering machine to heat solder to a temperature which lies within the determined range; setting a dwell timer on the dip soldering machine to control the dwell time to fall within the determined acceptable range; prefluxing the board; placing the prefluxed board in a fixture for usage in the dip solder machine; placing the fixtUre with the board into a holder in the dip solder machine; preheating the board in the placed fixture; skimming the dross from the molten solder; cycling the dip soldering machine to solder the board by dipping the board into the skimmed molten solder; removing the board from the molten solder after the passage of the dwell time determined to be necessary to melt the high-temperature insulation and solder the wire; cooling the soldered board; removing the fixture having the cooled board attached thereto; further cooling the board with the fixture attached; removing the cooled board from the fixture; and cleaning the removed board.
Claim 4
Dependent Claim
254 words
A process for mass soldering high-temperature-insulated-wire to printed circuit boards by the use of a dip soldering machine comprising the steps of: experimentally determining temperature-time relationships which result in removal of the high-temperature insulation from the wires and which establish limits at which damage to the printed circuit board begins; determining a range of molten solder temperature and a corresponding dwell time during which the high-temperature-insulated-wire circuit board can be in contact with the molten solder to effect removal of the insulation and soldering of the wire without damaging the board; setting controls on the dip soldering machine to heat solder to a temperature which lies within the determined range; setting a dwell timer on the dip soldering machine to control the dwell time to fall within the determined acceptable range; prefluxing the board; placing the prefluxed board in a fixture for usage in the dip solder machine; placing the fixtUre with the board into a holder in the dip solder machine; preheating the board in the placed fixture; skimming the dross from the molten solder; cycling the dip soldering machine to solder the board by dipping the board into the skimmed molten solder; removing the board from the molten solder after the passage of the dwell time determined to be necessary to melt the high-temperature insulation and solder the wire; cooling the soldered board; removing the fixture having the cooled board attached thereto; further cooling the board with the fixture attached; removing the cooled board from the fixture; and cleaning the removed board.
Claim 5
Dependent Claim
225 words
A process for mass soldering high-temperature-insulated-wire to printed circuit boards by the use of a wave soldering machine comprising the steps of: experimentally determining temperature-time relationships which result in removal of the high-temperature insulation from the wires and which establish limits at which damage to the printed circuit board begins; determining a range of molten solder temperature and a corresponding dwell time during which the high-temperature-insulated-wire circuit board can be in contact with the molten solder to effect removal of the insulation and soldering of the wire without damaging the board; heating solder to a temperature which lies within the determined temperature range; setting the wave soldering machine for the correct solder wave height and for the desired angle at which the printed circuit board enters and leaves the solder wave; setting a conveyor speed on the wave soldering machine so that the printed circuit board is placed in the molten solder wave for the desired dwell time; placing the board in a fixture for use on the wave solder machine; depositing the fixture with the board on the conveyor; cycling the deposited board through a complete operation of the wave soldering machine to melt the high-temperature insulation and solder the wires to the board; removing the soldered board from the conveyor after the cycle is completed; and cooling the removed board to ambient temperature.
Claim 6
Dependent Claim
225 words
A process for mass soldering high-temperature-insulated-wire to printed circuit boards by the use of a wave soldering machine comprising the steps of: experimentally determining temperature-time relationships which result in removal of the high-temperature insulation from the wires and which establish limits at which damage to the printed circuit board begins; determining a range of molten solder temperature and a corresponding dwell time during which the high-temperature-insulated-wire circuit board can be in contact with the molten solder to effect removal of the insulation and soldering of the wire without damaging the board; heating solder to a temperature which lies within the determined temperature range; setting the wave soldering machine for the correct solder wave height and for the desired angle at which the printed circuit board enters and leaves the solder wave; setting a conveyor speed on the wave soldering machine so that the printed circuit board is placed in the molten solder wave for the desired dwell time; placing the board in a fixture for use on the wave solder machine; depositing the fixture with the board on the conveyor; cycling the deposited board through a complete operation of the wave soldering machine to melt the high-temperature insulation and solder the wires to the board; removing the soldered board from the conveyor after the cycle is completed; and cooling the removed board to ambient temperature.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-12-17 | 1977-06-18 | 1977-12-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-12-17 | 1981-06-18 | 1981-12-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-12-17 | 1985-06-18 | 1985-12-18 | $7700.00 | Window Closed / Lapsed |