Carrier for beam lead integrated circuits

Claim 2

A removable carrier for a semiconductor circuit having a body portion and relatively rigid electrical leads extending therefrom at predetermined locations comprising: an electrically-insulating base member having a major surface; said base member including a central depression in said major surface thereof, said depression having dimensions to accurately accommodate such semiconductor circuit and such electrical leads extending therefrom and said leads being adapted to have predetermined positions relative to the edges of said depression; an electrically-insulating cover member having a major surface for disposition in face to face relationship with the major surface of said base member, said cover member including a central recess extending inwardly from said major surface of said cover member; means for removably holding said base member and said cover member in an assembled condition and when so held, said central recess registers with said central depression; a self-supporting, electrically-insulating thin film having metallic film circuits disposed thereon for disposition between said major surfaces of said base and said cover members; said self-supporting film having means for removably holding the same in a predetermined position when said film is disposed between said base and said cover member for holding said metallic film circuits in predetermined locations; a central opening in said self-supporting film adapted to register with said depression when said film is held in its predetermined position; said metallic film circuits terminating at the edges of said central opening in said self-supporting film and being disposed toward said depression when said film is disposed between said major surfaces; said terminations of said film circuits having predetermined locations conforming to the pre-determined locations of such electrical leads on said semiconductor circuit; said self-supporting film and said metallic film circuits thereon having an extent to project beyond the extremities of said base and said cover members whereby electrical contact may be made to said film circuits and to such electrical leads of a semiconductor circuit disposed in said depression; and resilient means disposed in said recess for urging said metallic film circuits against said electrical leads.

Claim 3

A removable carrier for a semiconductor circuit according to claim 1 wherein said base member and said cover member are transparent.

Claim 4

A removable carrier for a semiconductor circuit having a body portion and relatively rigid electrical leads extending therefrom at predetermined locations comprising: a transparent, electrically-insulating base member having a major surface; said base member including a central depression in said major surface thereof, said depression having dimensions to accurately accommodate such semiconductor circuit and such electrical leads extending therefrom and said leads being adapted to have predetermined positions relative to the edges of said depression; guiding and holding members extending upwardly from said major surface; a transparent electrically-insulating cover member having a major surface for disposition in face to face relationship with the major surface of said base member, said cover member including a central recess extending inwardly from said major surface of said cover member; holes in said cover member adapted to be disposed over said guiding and holding means for removably holding said cover member to said base member and when so disposed, said central recess registers with said central depression; a self-supporting, electrically-insulating thin film having metallic film circuits disposed thereon for disposition between said major surfaces of said base and saiD cover members; said self-supporting film having openings therein to be disposed over said guiding and holding members when said film is disposed between said base and said cover members for removably holding said metallic film circuits in predetermined locations; a central opening in said self-supporting film adapted to register with said depression when the openings of said film are disposed over said guiding and holding means; said metallic film circuits terminating at the edges of said central opening in said self-supporting film and being disposed toward said depression when said film is disposed between said major surfaces; said terminations of said film circuits having predetermined locations conforming to the predetermined locations of such electrical leads on said semiconductor circuit; said self-supporting film and said metallic film circuits thereon having an extent to project beyond the extremities of said base and said cover members whereby electrical contact may be made to said film circuits and to such electrical leads of a semiconductor circuit disposed in said depression; and resilient means disposed in said recess for urging said metallic film circuits against said electrical leads.

Claim 5

A removable carrier for a semiconductor circuit having a body portion and relatively rigid electrical leads extending therefrom at predetermined locations comprising: a transparent, electrically-insulating base member having a major surface; said base member including a central depression in said major surface thereof, said depression having dimensions to accurately accommodate such semiconductor circuit and such electrical leads extending therefrom and said leads being adapted to have predetermined positions relative to the edges of said depression; guiding and holding members extending upwardly from said major surface; a transparent electrically-insulating cover member having a major surface for disposition in face to face relationship with the major surface of said base member, said cover member including a central recess extending inwardly from said major surface of said cover member; holes in said cover member adapted to be disposed over said guiding and holding means for removably holding said cover member to said base member and when so disposed, said central recess registers with said central depression; a self-supporting, electrically-insulating thin film having metallic film circuits disposed thereon for disposition between said major surfaces of said base and saiD cover members; said self-supporting film having openings therein to be disposed over said guiding and holding members when said film is disposed between said base and said cover members for removably holding said metallic film circuits in predetermined locations; a central opening in said self-supporting film adapted to register with said depression when the openings of said film are disposed over said guiding and holding means; said metallic film circuits terminating at the edges of said central opening in said self-supporting film and being disposed toward said depression when said film is disposed between said major surfaces; said terminations of said film circuits having predetermined locations conforming to the predetermined locations of such electrical leads on said semiconductor circuit; said self-supporting film and said metallic film circuits thereon having an extent to project beyond the extremities of said base and said cover members whereby electrical contact may be made to said film circuits and to such electrical leads of a semiconductor circuit disposed in said depression; and resilient means disposed in said recess for urging said metallic film circuits against said electrical leads.

Claim 6

A removable carrier for a semiconductor circuit according to claim 3 wherein said resilient means comprises a soft rubber member.

Claim 7

A removable carrier for a semiconductor circuit according to claim 3 wherein there is provided in one of said base and cover members locating means for determining the orientation of the leads of a semiconductor circuit disposed in said depression.

Claim 8

A removable carrier for a semiconductor circuit according to claim 5 wherein the locating means comprises a hole in said base member.

Claim 9

A removable carrier for a semiconductor circuit having a body portion of predetermined dimensions and relatively thick rigid electrical leads of accurate lineal projection extending upwardly and outwardly from such body portion at predetermined locations comprising: an electrically-insulating base member having a major surface; said base member including a central depression in said major surface thereof, said depression having lateral dimensions to accurately accommodate the lineal projection of such electrical leads and a depth dimension essentially equal to the thickness of such electrical leads to such semiconductor circuit, and said leads being adapted to have predetermined positions relative to the edges of said depression; an electrically-insulating cover member having a major surface for disposition in face to face relationship with the major surface of said base member, said cover member including a central recess extending inwardly from said major surface of said cover member, and said central recess having lateral dimensions substantially greater than the lateral dimensions of the body portion of such semiconductor circuit and a depth dimension substantially greater than the thickness of such semiconductor circuit; means for removably holding said base member and said cover member in an assembled condition and when so held, said central recess registers with said central depression; a self-supporting, electrically-insulating thin film having metallic film circuits disposed thereon for disposition between said major surfaces of said base and said cover members; said self-supporting film having means for removably holding the same in a predetermined position when said film is disposed between said base and said cover members for holding said metallic film circuits in predetermined locations; a central opening accurately conforming to the lateral dimensions of the body portion of such semi-conductor circuit in said self-supporting film adapted to register with said depression when said film is held in its predetermined position; said metallic film circuits terminating at the edges of said central opening in said self-supporting film and being disposed toward said deprEssion when said film is disposed between said major surfaces; said terminations of said film circuits having predetermined locations conforming to the predetermined locations of such electrical leads on said semiconductor circuit; said self-supporting film and said metallic film circuits thereon having an extent to project beyond the extremities of said base and said cover members whereby electrical contact may be made to said film circuits and to such electrical leads of a semiconductor circuit disposed in said depression; and resilient means disposed in said recess for urging said metallic film circuits against said electrical leads.

Claim 10

A removable carrier for a semiconductor circuit having a body portion of predetermined dimensions and relatively thick rigid electrical leads of accurate lineal projection extending upwardly and outwardly from such body portion at predetermined locations comprising: an electrically-insulating base member having a major surface; said base member including a central depression in said major surface thereof, said depression having lateral dimensions to accurately accommodate the lineal projection of such electrical leads and a depth dimension essentially equal to the thickness of such electrical leads to such semiconductor circuit, and said leads being adapted to have predetermined positions relative to the edges of said depression; an electrically-insulating cover member having a major surface for disposition in face to face relationship with the major surface of said base member, said cover member including a central recess extending inwardly from said major surface of said cover member, and said central recess having lateral dimensions substantially greater than the lateral dimensions of the body portion of such semiconductor circuit and a depth dimension substantially greater than the thickness of such semiconductor circuit; means for removably holding said base member and said cover member in an assembled condition and when so held, said central recess registers with said central depression; a self-supporting, electrically-insulating thin film having metallic film circuits disposed thereon for disposition between said major surfaces of said base and said cover members; said self-supporting film having means for removably holding the same in a predetermined position when said film is disposed between said base and said cover members for holding said metallic film circuits in predetermined locations; a central opening accurately conforming to the lateral dimensions of the body portion of such semi-conductor circuit in said self-supporting film adapted to register with said depression when said film is held in its predetermined position; said metallic film circuits terminating at the edges of said central opening in said self-supporting film and being disposed toward said deprEssion when said film is disposed between said major surfaces; said terminations of said film circuits having predetermined locations conforming to the predetermined locations of such electrical leads on said semiconductor circuit; said self-supporting film and said metallic film circuits thereon having an extent to project beyond the extremities of said base and said cover members whereby electrical contact may be made to said film circuits and to such electrical leads of a semiconductor circuit disposed in said depression; and resilient means disposed in said recess for urging said metallic film circuits against said electrical leads.

Claim 11

A removable carrier for a semiconductor circuit according to claim 7 wherein said resilient means comprises a soft compliant member having a central aperture of essentially the same lateral dimension as the body portion of such semiconductor circuit.

Claim 12

A removable carrier for a semiconductor circuit according to claim 8 wherein said base and cover members are of transparent material.

Claim 13

A removable carrier for a semiconductor circuit according to claim 9 wherein there is provided in one of said base and cover members locating means for determining the orientation of the leads of a semiconductor circuit disposed in said depression.

Claim 14

A removable carrier for a semiconductor circuit according to claim 10 wherein the locating means comprises a hole in said base member.

Claim 15

A removable carrier for a semiconductor circuit according to claim 7 wherein said holding means for said base and cover members comprises: guiding and holding members extending upwardly from the major surface of said base member; and holes in said cover member adapted to be disposed over said guiding and holding means.

Claim 16

A removable carrier for a semiconductor circuit according to claim 10 wherein the metallic film circuits on said self-supporting film include an indicia associated with one of said metallic film circuits for orienting same with respect to said locating means.

Claim 17

A removable carrier for a semiconductor circuit according to claim 13 wherein said indicia comprises a shortened end on one of said metallic film strips.

Claim 18

A removable carrier for a semiconductor circuit according to claim 7 wherein said semiconductor circuit comprises an integrated circuit on a substrate and said relatively rigid leads comprise beam leads.