US3776447A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Automatic semiconductor bonding machine
Assignee: Texas Instruments Inc
•
Filing: 1971-05-26
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Granted: 1973-12-04
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Expires: 1991-05-26
Abstract
Abstract An automatic machine for ball bonding a lead wire to an expanded contact of a semiconductor device and stitch bonding the wire to a lead of the semiconductor package is described. The machine automactically aligns an X-Y table in predetermined relationship to the semiconductor device by means of an electrooptical system. A bonding needle mounted on the table is then moved in a predetermined manner to press the balled end of the wire against the expanded contact. Wire is then positively payed out as the bonding needle is moved to the lead where a stitch bond is performed. After the stitch bond, the needle is raised to pull out a length of wire, then the wire is clamped to break the wire near the stitch bond. The length of the wire protruding from the needle is then passed through a flame to form a new ball preparatory to a new cycle. The wire is payed out to the bonding needle from a spool supported by an air bearing. After the ball is formed, reverse torque is applied to the spool to pull the ball up against the end of the bonding needle. After the ball bond, forward torque is applied to pay out the wire, and the wire is positively fed through the needle by an air stream. After the stitch bond is completed and the ball reformed by the flame, reverse torque is again applied to the spool to draw the ball up against the end of the needle preparatory to the next bonding cycle.
Inventors
- 👤 M Simmons
- 👤 B Yager
- 👤 A Adams
- 👤 G Yearsley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 16:21
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/002; B23K20/004; B23K20/005; B23K20/007; H; H10; H10P; H10P95/00; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/753; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/53; Y10T29/5313; Y10T29/532; Y10T29/53209; Y10T29/53213; Y10T29/53265
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
546 words
In a system for automatically interconnecting first and second surfaces on a semiconductor device with a jumper wire, the cOmbination of: table means mounted for movement in the X and Y coordinate directions, electro-optic pattern recognition means mounted on the table means having a field of view and means for producing X and Y error signals indicating the X and Y coordinate directions the axis of the field of view must be moved to align the axis in predetermined relationship tO the semiconductor device positioned within the field of view, means for positioning the semiconductor device at a work station within the field of view, servo means responsive to the X and Y error signals for moving the table means until the axis of the field of view is aligned in said predetermined relationship to the semiconductor device, and bonding means mounted on the table means for bonding the jumper wire to first and second predetermined positions on the semiconductor device relative to the axis of the field of view, the first and second predetermined positions being such as to bond the wire to selected points on said first and second surfaces; said bonding means comprising: first and second members mounted for movement generally parallel to the X-Y plane and for movement generally normal to the X-Y plane, respectively, relative to the table means, said first member being mounted on the table means and said second member being mounted on said firsT member, a bonding needle mounted on said second member, means for supplying wire to the bonding needle, said wiresupplying means being mounted on said first member, means for moving said first member in a predetermined manner relative to the table means, means for moving said second member in a predetermined manner relative to said first member, means mounted on the second member for clamping the wire, means for producing a flame, said means for moving the first member and said means for moving the second member being effective to move the tip of the bonding needle past the flame such that a ball will be formed on a length of wire protruding from the bonding needle, a source of clock pulses, counter means for counting the clock pulses in response to a logic input signal designating the start of a bonding cycle, and means for detecting predetermined counts of the counter means and producing logic signals to actuate the system in a sequence to automatically: a. position the table means in predetermined relation to the axis of the field of view, b. move the bonding needle from out of the field of view to the position where the first bond is to be made, c. lower the bonding needle to bond the wire at the first position, d. raise the bonding needle, e. move the bonding needle to the position of the second bond, f. lower the bonding needle to make the second bond, g. raise the bonding needle a short distance then clamp the wire while continuing to raise the bonding needle, h. move the bonding needle back to its original position out of the field of view by way of the flame to form a new ball on the wire, and i. release the wire clamping means after the ball is formed.
Claim 2
Dependent Claim
546 words
In a system for automatically interconnecting first and second surfaces on a semiconductor device with a jumper wire, the cOmbination of: table means mounted for movement in the X and Y coordinate directions, electro-optic pattern recognition means mounted on the table means having a field of view and means for producing X and Y error signals indicating the X and Y coordinate directions the axis of the field of view must be moved to align the axis in predetermined relationship tO the semiconductor device positioned within the field of view, means for positioning the semiconductor device at a work station within the field of view, servo means responsive to the X and Y error signals for moving the table means until the axis of the field of view is aligned in said predetermined relationship to the semiconductor device, and bonding means mounted on the table means for bonding the jumper wire to first and second predetermined positions on the semiconductor device relative to the axis of the field of view, the first and second predetermined positions being such as to bond the wire to selected points on said first and second surfaces; said bonding means comprising: first and second members mounted for movement generally parallel to the X-Y plane and for movement generally normal to the X-Y plane, respectively, relative to the table means, said first member being mounted on the table means and said second member being mounted on said firsT member, a bonding needle mounted on said second member, means for supplying wire to the bonding needle, said wiresupplying means being mounted on said first member, means for moving said first member in a predetermined manner relative to the table means, means for moving said second member in a predetermined manner relative to said first member, means mounted on the second member for clamping the wire, means for producing a flame, said means for moving the first member and said means for moving the second member being effective to move the tip of the bonding needle past the flame such that a ball will be formed on a length of wire protruding from the bonding needle, a source of clock pulses, counter means for counting the clock pulses in response to a logic input signal designating the start of a bonding cycle, and means for detecting predetermined counts of the counter means and producing logic signals to actuate the system in a sequence to automatically: a. position the table means in predetermined relation to the axis of the field of view, b. move the bonding needle from out of the field of view to the position where the first bond is to be made, c. lower the bonding needle to bond the wire at the first position, d. raise the bonding needle, e. move the bonding needle to the position of the second bond, f. lower the bonding needle to make the second bond, g. raise the bonding needle a short distance then clamp the wire while continuing to raise the bonding needle, h. move the bonding needle back to its original position out of the field of view by way of the flame to form a new ball on the wire, and i. release the wire clamping means after the ball is formed.
Claim 3
Dependent Claim
420 words
In a system for automatically interconnecting first and second surfaces on a semiconductor device with a jumper wire, the combination of: table means mounted for movement in the X and Y coordinate directions, electro-optic pattern recognition means mounted on the table means having a field of view and means for Producing X and Y error signals indicating the X and Y coordinate directions the axis of the field of view must be moved to align the axis in predetermined relationship to the semiconductor device positioned within the field of view, means for positioning the semiconductor device at a work station within the field of view, servo means responsive to the X and Y error signals for moving the table means until the axis of the field of view is aligned in said predetermined relationship to the semiconductor device, and bonding means mounted on the table means for bonding the jumper wire to first and second predetermined positions on the semiconductor device relative to the axis of the field of view, the first and second predetermined positions being such as to bond the wire to selected points on said first and second surfaces; said bonding means comprising: first and second members mounted for movement generally parallel to the X-Y plane and for movement generally normal to the X-Y plane, respectively, relative to the table means, one of the members being mounted on the table means and the other of the members being mounted on said one member, a bonding needle mounted on said other member, means for supplying wire to the bonding needle, first cam means and cam follower means for moving said one member in a predetermined manner relative to the table means, and means for driving said first cam means, second cam means and cam follower means for moving said other member in a predetermined manner relative to said one member, and means for driving said second cam means, a stepping motor, at least one of said first and second cam means being driven by said stepping motor connected to rotate the cam means, a source of pulses, a counter for counting the pulses and applying current to the stepping motor to cause the stepping motor to step in synchronism with each pulse applied to the motor, and logic means for gating the pulses to the counter in response to a logic signal defining the number of steps the stepping motor moves the cam means, whereby the bonding needle will move the wire against the first and second surfaces.
Claim 4
Dependent Claim
420 words
In a system for automatically interconnecting first and second surfaces on a semiconductor device with a jumper wire, the combination of: table means mounted for movement in the X and Y coordinate directions, electro-optic pattern recognition means mounted on the table means having a field of view and means for Producing X and Y error signals indicating the X and Y coordinate directions the axis of the field of view must be moved to align the axis in predetermined relationship to the semiconductor device positioned within the field of view, means for positioning the semiconductor device at a work station within the field of view, servo means responsive to the X and Y error signals for moving the table means until the axis of the field of view is aligned in said predetermined relationship to the semiconductor device, and bonding means mounted on the table means for bonding the jumper wire to first and second predetermined positions on the semiconductor device relative to the axis of the field of view, the first and second predetermined positions being such as to bond the wire to selected points on said first and second surfaces; said bonding means comprising: first and second members mounted for movement generally parallel to the X-Y plane and for movement generally normal to the X-Y plane, respectively, relative to the table means, one of the members being mounted on the table means and the other of the members being mounted on said one member, a bonding needle mounted on said other member, means for supplying wire to the bonding needle, first cam means and cam follower means for moving said one member in a predetermined manner relative to the table means, and means for driving said first cam means, second cam means and cam follower means for moving said other member in a predetermined manner relative to said one member, and means for driving said second cam means, a stepping motor, at least one of said first and second cam means being driven by said stepping motor connected to rotate the cam means, a source of pulses, a counter for counting the pulses and applying current to the stepping motor to cause the stepping motor to step in synchronism with each pulse applied to the motor, and logic means for gating the pulses to the counter in response to a logic signal defining the number of steps the stepping motor moves the cam means, whereby the bonding needle will move the wire against the first and second surfaces.
Claim 5
Dependent Claim
70 words
The combination defined in claim 2 wherein the logic means for gating the clock pulses to the counter includes: means for generating a plurality of start pulses at predetermined times in a bonding cycle to initiate the gating of the pulses to the counter, and means associated with the cam means for producing a stop logic signal to terminate the pulses when the cam means has reached a predetermined position.
Claim 6
Dependent Claim
75 words
The combination defined in claim 3 wherein the means for producing the stop logic signal comprises: a light source, light detector means, a disc disposed between the light source and the light detector means and connected to rotate with the cam means, and an aperture in the disc positioned to pass light from the light source to the light detector means when the cam means is at the position where it is to be stopped.
Claim 7
Dependent Claim
88 words
The combination defined in claim 4 wherein: there are two logic means for gating pulses to the counter, there are two means for generating start pulses at different predetermined times in a bonding cycle to initiate the gating of pulses to the counter, there are two light detector means for producing stop logic signals to terminate the pulses from the respective logic means, and there are at least two apertures in the disc on different radii, each aperture passing light only to one of the light detector means.
Claim 8
Dependent Claim
300 words
In a system for automatically interconnecting first and second surfaces on a semiconductor device with a jumper wire, the combination of: table means mounted for movement in the X and Y coordinate directions, electro-optic pattern recognition means mounted on the table means having a field of view and means for producing X and Y error signals indicating the X and Y coordinate directions the axis of the field of view must be moved to align the axis in predetermined relationship to the semiconductor device positioned within the field of view, means for positioning the semiconductor device at a work station within the field of view, servo means responsive to the X and Y error signals for moving the table means until the axis of the field of view is aligned in said predetermined relationship to the semiconductor device, and bonding means mounted on the table means for bonding the jumper wire to first and second predetermined positions on the semiconductor device relative to the axis of the field of view, the first and second predetermined positions being such as to bond the wire to selected points on said first and second surfaces; said bonding means including a tubular bonding needle movably mounted on said table means, means for moving the bonding needle successively to first and second predetermined positions relative to the table, the first and second predetermined positions being in alignment with the first and second surfaces when the table is in said predetermined relationship to the first and second surfaces, means for rasing and lowering the needle in a predetermined manner to press the wire in the needle against the first and second surfaces in sequence, and means for positively feeding wire through the bonding needle as the bonding needle is moved between the first and second surfaces.
Claim 9
Dependent Claim
300 words
In a system for automatically interconnecting first and second surfaces on a semiconductor device with a jumper wire, the combination of: table means mounted for movement in the X and Y coordinate directions, electro-optic pattern recognition means mounted on the table means having a field of view and means for producing X and Y error signals indicating the X and Y coordinate directions the axis of the field of view must be moved to align the axis in predetermined relationship to the semiconductor device positioned within the field of view, means for positioning the semiconductor device at a work station within the field of view, servo means responsive to the X and Y error signals for moving the table means until the axis of the field of view is aligned in said predetermined relationship to the semiconductor device, and bonding means mounted on the table means for bonding the jumper wire to first and second predetermined positions on the semiconductor device relative to the axis of the field of view, the first and second predetermined positions being such as to bond the wire to selected points on said first and second surfaces; said bonding means including a tubular bonding needle movably mounted on said table means, means for moving the bonding needle successively to first and second predetermined positions relative to the table, the first and second predetermined positions being in alignment with the first and second surfaces when the table is in said predetermined relationship to the first and second surfaces, means for rasing and lowering the needle in a predetermined manner to press the wire in the needle against the first and second surfaces in sequence, and means for positively feeding wire through the bonding needle as the bonding needle is moved between the first and second surfaces.
Claim 10
Dependent Claim
46 words
The combination defined in claim 6 wherein the means for positively feeding wire through the bonding needle comprises: a tubular passageway through which wire is fed, and means for directing a gaseous flow of air through the tubular passageway in the direction the wire is fed.
Claim 11
Dependent Claim
69 words
The combination of claim 6 wherein the means for positively feeding wire through the bonding needle comprises: a first tubular passageway through which the wire is fed, a second tubular passageway disposed around the downstream end of the first tubular passageway and extending therebeyond, and means for introducing gas under pressure to the second tubular passageway at a point upstream from the downstream end of the first tubular passageway.
Claim 12
Dependent Claim
272 words
In a system for automatically interconnecting first and second surfaces on a semiconductor device with a jumper wire, the combination of: table means mounted for movement in the X and Y coordinate directions, electro-optic pattern recognition means mounted on the table means having a field of view and means for producing X and Y error signals indicating the X and Y coordinate directions the axis of the field of view must be moved to align the axis in predetermined relationship to the semiconductor device positioned within the field of view, means for positioning the semiconductor device at a work station within the field of view, servo means responsive to the X and Y error signals for moving the table means until the axis of the field of view is aligned in said predetermined relationship to the semiconductor device, and bonding means mounted on the table means for bonding the jumper wire to first and second predetermined positions on the semiconductor device relative to the axis of the field of view, the first and second predetermined positions being such as to bond the wire to selected points on said first and second surfaces; said bonding means including axle means, spool means for a supply of wire mounted on the axle means and forming an annular space between the axle means and the spool means, and port means for directing gas under pressure into the annular space between the axle means and the spool means such that the spool means will be supported by gas, said port means being positioned so as to apply a torque to the spool means acting in one direction.
Claim 13
Dependent Claim
272 words
In a system for automatically interconnecting first and second surfaces on a semiconductor device with a jumper wire, the combination of: table means mounted for movement in the X and Y coordinate directions, electro-optic pattern recognition means mounted on the table means having a field of view and means for producing X and Y error signals indicating the X and Y coordinate directions the axis of the field of view must be moved to align the axis in predetermined relationship to the semiconductor device positioned within the field of view, means for positioning the semiconductor device at a work station within the field of view, servo means responsive to the X and Y error signals for moving the table means until the axis of the field of view is aligned in said predetermined relationship to the semiconductor device, and bonding means mounted on the table means for bonding the jumper wire to first and second predetermined positions on the semiconductor device relative to the axis of the field of view, the first and second predetermined positions being such as to bond the wire to selected points on said first and second surfaces; said bonding means including axle means, spool means for a supply of wire mounted on the axle means and forming an annular space between the axle means and the spool means, and port means for directing gas under pressure into the annular space between the axle means and the spool means such that the spool means will be supported by gas, said port means being positioned so as to apply a torque to the spool means acting in one direction.
Claim 14
Dependent Claim
51 words
The combination defined in claim 9 further characterized by additional means for directing gas to cause torque to be applied to the spool means in the opposite direction, and means for controlling the supply of gas to the two means to control the direction of torque applied to the spool means.
Claim 15
Dependent Claim
97 words
An automatic bonding machine which comprises: a plurality of manipulators which upon sequential actuation bond a jumper wire between first and second contacts on a semiconductor assembly disposed at a work station, a source of clock pulses, counter means for counting the pulses to a predetermined maximum count in response to an enable signal indicating that the first and second contacts are disposed at the work station, and means for producing a series of logic signals on predetermined counts to actuate the manipulators in a sequence to bond the jumper wire between the first and second contacts.
Claim 16
Dependent Claim
97 words
An automatic bonding machine which comprises: a plurality of manipulators which upon sequential actuation bond a jumper wire between first and second contacts on a semiconductor assembly disposed at a work station, a source of clock pulses, counter means for counting the pulses to a predetermined maximum count in response to an enable signal indicating that the first and second contacts are disposed at the work station, and means for producing a series of logic signals on predetermined counts to actuate the manipulators in a sequence to bond the jumper wire between the first and second contacts.
Claim 17
Dependent Claim
236 words
In a system for automatically interconnecting first and second surfaces on a semiconductor device with a jumper wire, the combination of: table means mounted for movement in the X and Y coordinate directions, electro-optic recognition means mounted on the table means having a field of view and means for producing X and Y error signals indicating the X and Y coordinate directions the axis of the field of view must be moved to align the axis in predetermined relationship to the semiconductor device positioned within the field of view, means for positioning the semiconductor device at a work station within the field of view, servo means responsive to the X and Y error signals for moving the table means until the axis of the field of view is aligned in said predetermined relationship to the semiconductor device, and bonding means mounted on the table means for bonding the jumper wire to first and second predetermined positions on the semiconductor device relative to the axis of the field of view, the first and second predetermined positions being such as to bond the wire to selecTed points on said first and second surfaces; said bonding means including a spool for supplying wire to the bonding means, means for exerting reverse torque on the spool to tension the wire, and means for detecting a rate of rotation greater than a predetermined maximum for indicating that the wire is broken.
Claim 18
Dependent Claim
236 words
In a system for automatically interconnecting first and second surfaces on a semiconductor device with a jumper wire, the combination of: table means mounted for movement in the X and Y coordinate directions, electro-optic recognition means mounted on the table means having a field of view and means for producing X and Y error signals indicating the X and Y coordinate directions the axis of the field of view must be moved to align the axis in predetermined relationship to the semiconductor device positioned within the field of view, means for positioning the semiconductor device at a work station within the field of view, servo means responsive to the X and Y error signals for moving the table means until the axis of the field of view is aligned in said predetermined relationship to the semiconductor device, and bonding means mounted on the table means for bonding the jumper wire to first and second predetermined positions on the semiconductor device relative to the axis of the field of view, the first and second predetermined positions being such as to bond the wire to selecTed points on said first and second surfaces; said bonding means including a spool for supplying wire to the bonding means, means for exerting reverse torque on the spool to tension the wire, and means for detecting a rate of rotation greater than a predetermined maximum for indicating that the wire is broken.
Claim 19
Dependent Claim
305 words
In a system for automatically interconnecting first and second surfaces with a jumper wire, the combination of: means for positioning the first and second surfaces at a work station, a table mounted for movement in the X and Y coordinate directions relative to the work station, electro-optical means for automatically positioning the table in predetermined relationship to the first and second surfaces positioned at the work station, a tubular bonding needle movably mounted on the table, means for supplying wire to the bonding needle; said wire-supplying means including an axle operably associated with said tubular bonding needle, a spool for a supply of wire adapted to be threaded through said tubular bonding needle, said spool being mounted on said axle for rotation with respect thereto and cooperating therewith to form an annular space therebetween, port means for directing gas under pressure into the annular space between the axle and the spool such that the spool will be supported by gas, said port means being so positioned as to apply a torque to the spool acting in one direction, second port means associated with said spool for directing gas under pressure against said spool to cause torque to be applied to the spool in the opposite direction, and means for controlling the supply of gas to the two port means to control the direction of torque applied to the spool; means for moving the tubular bonding needle successively to first and second predetermined positions relative to the table, the first and second predetermined positions being in alignment with the first and second surfaces when the table is in said predetermined relationship to the first and second surfaces, and means for raising and lowering the tubular bonding needle in a predetermined manner to press the wire in the tubular bonding needle against the first and second surfaces.
Claim 20
Dependent Claim
305 words
In a system for automatically interconnecting first and second surfaces with a jumper wire, the combination of: means for positioning the first and second surfaces at a work station, a table mounted for movement in the X and Y coordinate directions relative to the work station, electro-optical means for automatically positioning the table in predetermined relationship to the first and second surfaces positioned at the work station, a tubular bonding needle movably mounted on the table, means for supplying wire to the bonding needle; said wire-supplying means including an axle operably associated with said tubular bonding needle, a spool for a supply of wire adapted to be threaded through said tubular bonding needle, said spool being mounted on said axle for rotation with respect thereto and cooperating therewith to form an annular space therebetween, port means for directing gas under pressure into the annular space between the axle and the spool such that the spool will be supported by gas, said port means being so positioned as to apply a torque to the spool acting in one direction, second port means associated with said spool for directing gas under pressure against said spool to cause torque to be applied to the spool in the opposite direction, and means for controlling the supply of gas to the two port means to control the direction of torque applied to the spool; means for moving the tubular bonding needle successively to first and second predetermined positions relative to the table, the first and second predetermined positions being in alignment with the first and second surfaces when the table is in said predetermined relationship to the first and second surfaces, and means for raising and lowering the tubular bonding needle in a predetermined manner to press the wire in the tubular bonding needle against the first and second surfaces.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-12-03 | 1977-06-04 | 1977-12-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-12-03 | 1981-06-04 | 1981-12-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-12-03 | 1985-06-04 | 1985-12-04 | $7700.00 | Window Closed / Lapsed |