Nail head bonding apparatus for thermocompressively securing lead wire to semi-conductor devices

Claim 1

APPARATUS FOR THERMOCOMPRESSIVELY BONDING LEAD WIRE TO SEMI-CONDUCTOR DEVICES COMPRISING A VERTICALLYDISPOSED GUIDEWAY, AN ACTUATING FINGER VERTICALLY RECIPROCABLE IN SAID GUIDEWAY, MEANS RESILIENTLY BIASING SAID ACTUATING FINGER IN AN UPWARDLY DIRECTION, AN ELONGATED SLIDER DETACHABLY SUSPENDED FROM SAID FINGER, MEANS ON SAID FINGER COOPERATING WITH THE WEIGHT OF SAID SLIDER HORIZONTALLY INDUCING SAID SLIDER INTO COMPLEMENTARY FACETO-FACE SLIDABLE CONTACT WITH SAID GUIDEWAY, A WIRE-CARRYING BOUNDING TOOL ON SAID SLIDER, SAID SLIDER HAVING A CENTER OF GRAVITY ECCENTRICALLY DISPOSED WITH RESPECT TO SAID TOOL, AND MEANS TO DEPRESS SAID FINGER TO A LEVEL AT WHICH SAID TOOL ABUTS THE SEMI-CONDUCTOR DEVICE AND THE SLIDER BECOMES DETACHED FROM SAID FINGER, WHEREBY THE MOMENT OF SAID DETECTED SLIDER ACTING THROUGH THE POINT OF ABUTMENT OF SAID TOOL WITH THE SEMI-CONDUCTOR DEVICE MAINTAINS SAID SLIDER IN FACE-TO-FACE CONTACT WITH SAID GUIDEWAY SO THAT SAID TOOL WILL BE GUIDED IN A PURE VERTICAL FRICTIONLESS PATH AND WILL REPEATEDLY EXERT THE SAME FORCE ON SUCCESSIVE BONDS WITHOUT SCRUBBING.