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US3769693A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for preparing nuclear hardened semiconductor and microelectronic devices

Assignee: Lockheed Martin Corp
•
Filing: 1971-07-16
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Granted: 1973-11-06
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Expires: 1991-07-16
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Abstract

Abstract A process for preparing nuclear hardened semiconductor or microelectronic devices comprising: 1. DETERMINING THE ELECTRICAL CHARACTERISTICS OF SEMICONDUCTOR OR MICROELECTRONIC DEVICES; 2. DESIGNATING THE ELECTRICALLY ACCEPTABLE SEMI-CONDUCTOR OR MICROELECTRONIC DEVICES; 3. EXPOSING SAID ACCEPTABLE SEMICONDUCTOR OR MICRO-ELECTRONIC DEVICES TO A NEUTRON ENVIRONMENT; 4. DETERMINING THE ELECTRICAL CHARACTERISTICS OF SAID EXPOSED SEMICONDUCTOR OR MICROELECTRONIC DEVICES; AND 5. ANNEALING THE NEUTRON ENVIRONMENT ELECTRICALLY ACCEPTABLE SEMICONDUCTOR OR MICROELECTRONIC DEVICES IS DISCLOSED.

Inventors

  • 👤 H Cates
  • 👤 R Darling

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 20:41
CPC Classifications
H; H10; H10P; H10P95/00; H10P34/00; Y; Y10; Y10S; Y10S438/00; Y10S438/953

Claims Analysis

Total Claims: 23
Claim 1
Independent Claim 59 words
A process for preparing nuclear hard semiconductor or microelectronic devices comprising: 1. determining the electrical characteristics of said devices, 2. subjecting said devices having acceptable electrical characteristics to neutron radiation, 3. determining the electrical characteristic of said irradiated devices, 4. annealing said devices having acceptable electrical characteristics at a temperature ranging from about 225* C to about 700* C.
Claim 2
Dependent Claim 59 words
A process for preparing nuclear hard semiconductor or microelectronic devices comprising: 1. determining the electrical characteristics of said devices, 2. subjecting said devices having acceptable electrical characteristics to neutron radiation, 3. determining the electrical characteristic of said irradiated devices, 4. annealing said devices having acceptable electrical characteristics at a temperature ranging from about 225* C to about 700* C.
Claim 3
Dependent Claim 10 words
subjecting said devices having acceptable electrical characteristics to neutron radiation,
Claim 4
Dependent Claim 10 words
subjecting said devices having acceptable electrical characteristics to neutron radiation,
Claim 5
Dependent Claim 14 words
The process of claim 1 wherein said semiconductor is silicon, germanium or gallium arsenide.
Claim 6
Dependent Claim 11 words
marking the individual dice of said semiconductor having unacceptable electrical characteristics,
Claim 7
Dependent Claim 11 words
marking the individual dice of said semiconductor having unacceptable electrical characteristics,
Claim 8
Dependent Claim 6 words
subjecting said semiconductor to neutron radiation
Claim 9
Dependent Claim 6 words
subjecting said semiconductor to neutron radiation
Claim 10
Dependent Claim 21 words
The process of claim 1 wherein said annealing is at a temperature of from about 400* C to about 550* C.
Claim 11
Dependent Claim 8 words
determining the electrical characteristic of said irradiated devices,
Claim 12
Dependent Claim 8 words
determining the electrical characteristic of said irradiated devices,
Claim 13
Dependent Claim 19 words
annealing said devices having acceptable electrical characteristics at a temperature ranging from about 225* C to about 700* C.
Claim 14
Dependent Claim 19 words
annealing said devices having acceptable electrical characteristics at a temperature ranging from about 225* C to about 700* C.
Claim 15
Dependent Claim 13 words
The process of claim 1 wherein said device is annealed more than once.
Claim 16
Dependent Claim 12 words
determining the electrical characteristics of the individual dice of said irradiated semiconductor
Claim 17
Dependent Claim 12 words
determining the electrical characteristics of the individual dice of said irradiated semiconductor
Claim 18
Dependent Claim 12 words
marking the individual dice of said semiconductor having unacceptablE electrical characteristics, and
Claim 19
Dependent Claim 12 words
marking the individual dice of said semiconductor having unacceptablE electrical characteristics, and
Claim 20
Dependent Claim 8 words
A process for preparing nuclear hard semiconductor comprising:
Claim 21
Dependent Claim 8 words
A process for preparing nuclear hard semiconductor comprising:
Claim 22
Dependent Claim 23 words
annealing the individual dice of said semiconductor having acceptable electrical characteristics at a temperature ranging from about 225* C to about 700* C.
Claim 23
Dependent Claim 23 words
annealing the individual dice of said semiconductor having acceptable electrical characteristics at a temperature ranging from about 225* C to about 700* C.

References Cited (Backward Citations)

US3015762A Cited
US3464790A Cited
US3660171A Cited
US3667116A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-11-05 1977-05-07 1977-11-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-11-05 1981-05-07 1981-11-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-11-05 1985-05-07 1985-11-06 $7700.00 Window Closed / Lapsed

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