US3762426A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor chip separation apparatus
Assignee: International Business Machines Corp
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Filing: 1972-04-26
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Granted: 1973-10-02
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Expires: 1992-04-26
Abstract
Abstract Disclosed is a method and apparatus for separating discrete chips of a diced semiconductor wafer without disturbing the orientation of the chips, the chips being bonded to a support or substrate from which they must be separated prior to use. The substrate is first positioned in a fixture so that the diced wafer assumes a predetermined orientation, and then a resilient foraminous pad is pressed against the chips, and a bond releasing fluid is urged, by a novel pump, through the pad until the chips are released from their support, the thickness of the removed bond being compensated for by expansion of the pad. Also disclosed is a fixture which acts as a convenient storage tray for the chips in their original orientation.
Inventors
- 👤 C Yakubowski
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 07:39
CPC Classifications
H; H10; H10P; H10P52/00
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
58 words
Apparatus for destroying the bond between discrete chips of a semiconductor wafer without disturbing their orientation, said chips being bonded on a substrate, said apparatus comprising: means to hold said substrate in a fixed position; pump means connected to said substrate; and means to direct a bidirectional flow of bond releasing medium from said pump against said bond.
Claim 2
Dependent Claim
58 words
Apparatus for destroying the bond between discrete chips of a semiconductor wafer without disturbing their orientation, said chips being bonded on a substrate, said apparatus comprising: means to hold said substrate in a fixed position; pump means connected to said substrate; and means to direct a bidirectional flow of bond releasing medium from said pump against said bond.
Claim 3
Dependent Claim
33 words
Apparatus in accordAnce with claim 1 wherein said pump means comprises a receiver, bellows means in said receiver, and means to effect reciprocation of said bellows to pump said medium against said bond.
Claim 4
Dependent Claim
16 words
Apparatus in accordance with claim 2 including stop means to limit the stroke of said bellows.
Claim 5
Dependent Claim
34 words
Apparatus in accordance with claim 3 including a bed plate having a plurality of apertures therein; means for aligning said substrate to said bed plate so that said apertures are aligned intermediate said chips.
Claim 6
Dependent Claim
22 words
Apparatus in accordance with claim 2 including a tank for holding said medium, and means to hold said receiver in said tank.
Claim 7
Dependent Claim
34 words
Apparatus in accordance with claim 2 including a tank for holding a supply of medium therein, means for holding at least said surface of said substrate, to which chips are bonded, in said medium.
Claim 8
Dependent Claim
72 words
Apparatus for separating discrete chips of a diced semiconductor wafer, without disturbing their orientation, from a substrate to which said chips are bonded, said apparatus comprising: means to fix said substrate in a predetermined position relative to a fixture; means defining a plurality of apertures in said fixture and aligned intermediate adjacent chips on said substrate; a bond destroying medium, and pump means for directing the bond destroying medium through said apertures.
Claim 9
Dependent Claim
72 words
Apparatus for separating discrete chips of a diced semiconductor wafer, without disturbing their orientation, from a substrate to which said chips are bonded, said apparatus comprising: means to fix said substrate in a predetermined position relative to a fixture; means defining a plurality of apertures in said fixture and aligned intermediate adjacent chips on said substrate; a bond destroying medium, and pump means for directing the bond destroying medium through said apertures.
Claim 10
Dependent Claim
33 words
Apparatus in accordance with claim 7 wherein said pump means includes a receiver, a bellows in said receiver and means to effect reciprocation of said bellows to pump said medium against said bond.
Claim 11
Dependent Claim
22 words
Apparatus in accordance with claim 8 including a tank for holding said medium, and means to fix said receiver in said tank.
Claim 12
Dependent Claim
34 words
Apparatus in accordance with claim 8 including a tank for holding a supply of medium therein, means for retaining at least the surface of said substrate, to which chips are bonded, in said medium.
Claim 13
Dependent Claim
31 words
Apparatus in accordance with claim 8 including a bed plate, having a plurality of apertures therein, means for aligning the apertures in said fixture to the apertures in said bed plate.
Claim 14
Dependent Claim
42 words
Apparatus in accordance with claim 11 including a tank for holding a supply of medium therein, means for fixing said pump means in said tank with at least the surface of said substrate to which said chips are bonded in said medium.
Claim 15
Dependent Claim
16 words
Apparatus in accordance with claim 12 including stop means to limit the stroke of said bellows.
Claim 16
Dependent Claim
102 words
In an apparatus for separating discrete chips of a diced semiconductor wafer without disturbing their orientation, said chips being bonded on a substrate and said substrate being fixed in a predetermined position in a fixture, the improvement comprising: a pump including a bed plate, a plurality of apertures in said bed plate; means to fix said fixture in a predetermined position relative to said bed plate wherein said apertures are aligned intermediate the chips on said substrate; pump means connected to said apertures and means to direct a bidirectional flow of bond releasing medium to and from said pump against said bond.
Claim 17
Dependent Claim
102 words
In an apparatus for separating discrete chips of a diced semiconductor wafer without disturbing their orientation, said chips being bonded on a substrate and said substrate being fixed in a predetermined position in a fixture, the improvement comprising: a pump including a bed plate, a plurality of apertures in said bed plate; means to fix said fixture in a predetermined position relative to said bed plate wherein said apertures are aligned intermediate the chips on said substrate; pump means connected to said apertures and means to direct a bidirectional flow of bond releasing medium to and from said pump against said bond.
Claim 18
Dependent Claim
40 words
In an apparatus in accordance with claim 14 wherein said pump means comprises a receiver connected to said bed plate, bellows means in said receiver, and means to effect reciprocation of said bellows to pump said medium through said apertures.
Claim 19
Dependent Claim
37 words
In an apparatus in accordance with claim 15, a tank for holding a supply of medium therein, and means for suspending, at least the surface of said substrate to which said chips are bonded in said medium.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-10-01 | 1977-04-02 | 1977-10-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-10-01 | 1981-04-02 | 1981-10-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-10-01 | 1985-04-02 | 1985-10-02 | $7700.00 | Window Closed / Lapsed |