US3632074A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Releasable mounting and method of placing an oriented array of devices on the mounting
Assignee: AT&T Inc
•
Filing: 1968-04-10
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Granted: 1972-01-04
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Expires: 1988-04-10
Abstract
Abstract An oriented array of small, fragile electrical devices such as beam-lead transistors or integrated circuits, partially embedded in wax, are removed from the wax and transferred to a releasable mounting without disrupting the orientation of the devices. The releasable mounting comprises a plate with a layer of silicone rubber or resin which exerts a suction or vacuum holding force on the array of oriented devices.
Inventors
- 👤 William R Wanesky
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 14:02
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; B; B23; B23Q; B23Q3/00; B23Q3/02; B23Q3/06; B23Q3/08; B23Q3/086; B65; B65H; B65H41/00; H10P54/00; H10P95/00; H10W; H10W74/00; H10W74/40; H10P72/741; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/26; Y10T428/263; Y10T428/264; Y10T428/265
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
105 words
A carrier for minute, beam-lead, integrated-circuit chips which comprises: a rigid substrate; and a coating of cured material selected from the group consisting of silicone rubber and silicone resin wherein the selected material of the group exhibits pressure-sensitive, vacuum holding properties, the coating being applied uniformly to a surface of the substrate in a thin layer from which the chips are readily releasable, said layer having a thickness of less than 0.001 inch whereby the chips can be releasably held by the coating with a force sufficiently low that the chips can be readily removed from the coating without bending or distortion of the leads.
Claim 2
Dependent Claim
105 words
A carrier for minute, beam-lead, integrated-circuit chips which comprises: a rigid substrate; and a coating of cured material selected from the group consisting of silicone rubber and silicone resin wherein the selected material of the group exhibits pressure-sensitive, vacuum holding properties, the coating being applied uniformly to a surface of the substrate in a thin layer from which the chips are readily releasable, said layer having a thickness of less than 0.001 inch whereby the chips can be releasably held by the coating with a force sufficiently low that the chips can be readily removed from the coating without bending or distortion of the leads.
Claim 3
Dependent Claim
26 words
The apparatus of claim 1 wherein the coating and the substrate are both transparent thereby facilitating viewing of the chips from either side of the substrate.
Claim 4
Dependent Claim
96 words
A carrier for supporting an array of articles, each of which has a planar surface: a platelike member having a flat surface, said member having a plurality of apertures opening into said flat surface; and plugs positioned in said apertures having sections projecting through said openings in said flat surface, the ends of which establish a group of uniplanar surfaces, said plugs constructed of pressure-sensitive, vacuum holding material selected from a group consisting of silicone resin and silicone rubber, each of which exhibits pressure-sensitive, vacuum holding properties to hold the planar surfaces of articles placed thereagainst.
Claim 5
Dependent Claim
96 words
A carrier for supporting an array of articles, each of which has a planar surface: a platelike member having a flat surface, said member having a plurality of apertures opening into said flat surface; and plugs positioned in said apertures having sections projecting through said openings in said flat surface, the ends of which establish a group of uniplanar surfaces, said plugs constructed of pressure-sensitive, vacuum holding material selected from a group consisting of silicone resin and silicone rubber, each of which exhibits pressure-sensitive, vacuum holding properties to hold the planar surfaces of articles placed thereagainst.
Claim 6
Dependent Claim
37 words
A carrier for supporting articles as defined in claim 3, wherein the apertures are frustoconical in shape and the plugs have (1) frustoconical bases positioned within said apertures and (2) cylindrical projections terminating in said uniplanar surfaces.
Claim 7
Dependent Claim
93 words
A carrier for an article having a flat surface, which comprises: a plate having a frustoconical hole, the top of which terminates in the top surface of said plate; a plug having a frustoconical shape fitted within said hole, said plug having a projection thereon extending beyond the top surface of said plate; and said plug being constructed of material selected from the group consisting of silicone resin and silicone rubber wherein said material exhibits pressure-sensitive, vacuum holding properties, so that an article pressed against the top of said projection is held thereon.
Claim 8
Dependent Claim
93 words
A carrier for an article having a flat surface, which comprises: a plate having a frustoconical hole, the top of which terminates in the top surface of said plate; a plug having a frustoconical shape fitted within said hole, said plug having a projection thereon extending beyond the top surface of said plate; and said plug being constructed of material selected from the group consisting of silicone resin and silicone rubber wherein said material exhibits pressure-sensitive, vacuum holding properties, so that an article pressed against the top of said projection is held thereon.
Claim 9
Independent Claim
71 words
A method of handling minute, beam-lead integrated-circuit chips, which comprises the step of: supporting the chips on a rigid substrate coated with a cured material selected from the group consisting of silicone rubber and silicone resin wherein the selected material of the group exhibits pressure-sensitive, vacuum holding properties and wherein the coating is a thin layer from which the chips are readily releasable, said coating being less than 0.001 inch thick.
Claim 10
Independent Claim
71 words
A method of handling minute, beam-lead integrated-circuit chips, which comprises the step of: supporting the chips on a rigid substrate coated with a cured material selected from the group consisting of silicone rubber and silicone resin wherein the selected material of the group exhibits pressure-sensitive, vacuum holding properties and wherein the coating is a thin layer from which the chips are readily releasable, said coating being less than 0.001 inch thick.
Claim 11
Dependent Claim
22 words
The method of handling beam-lead integrated-circuit chips of claim 6 wherein a plurality of the chips are arranged in a desired array.
Claim 12
Dependent Claim
30 words
The method of handling beam-lead integrated-circuit chips of claim 6 wherein the coating and the substrate are both transparent and the chips are viewed from either side of the substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-01-03 | 1975-07-05 | 1976-01-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-01-03 | 1979-07-05 | 1980-01-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-01-03 | 1983-07-05 | 1984-01-04 | $7700.00 | Window Closed / Lapsed |