Patent US3762039A successfully refreshed from Google Patents.
US3762039A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plastic encapsulation of microcircuits
Assignee: Mos Technology Inc
•
Filing: 1971-09-10
•
Granted: 1973-10-02
•
Expires: 1991-09-10
Abstract
Abstract Microcircuits are encapsulated in a hermetic plastic package by enclosing the ends of conductive leads in an open cavity arranged to house the microcircuit and defined by an inner casing, then positioning a microcircuit in the open cavity and electrically connecting the ends of the conductive leads to the microcircuit, thereafter, covering the open cavity and defining a closed cavity about the microcircuit, and then completely encapsulating the inner casing and adjacent portions of the conductive leads with an outer plastic molded casing.
Inventors
- 👤 R Douglass
- 👤 Dulin C Mc
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 22:55
CPC Classifications
B; B29; B29C; B29C70/00; B29C70/68; B29C70/72; H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W74/00; H10W74/10; H10W74/111; H10W74/124; H10W76/00; H10W76/10; H10W76/12; H10W76/161; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W76/15; H10W76/157; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
126 words
A method of encapsulating a microcircuit comprising obtaining a substantially flat metal lead frame having a paddle for supporting a microcircuit defined in its center portion, and conductive leads extending from a periphery portion of the lead frame and terminating at ends in said center portion adjacent said paddle, forming an inner casing about said center portion of said lead frame to define an open cavity housing said paddle and said ends of the conductive leads, fixing a microcircuit to said paddle and electrically connecting said microcircuit to said ends of the conductive leads, covering said open cavity and defining a closed cavity about said microcircuit, and then completely encapsulating said inner casing and adjacent portions of said lead frame with an outer molded plastic casing.
Claim 2
Independent Claim
126 words
A method of encapsulating a microcircuit comprising obtaining a substantially flat metal lead frame having a paddle for supporting a microcircuit defined in its center portion, and conductive leads extending from a periphery portion of the lead frame and terminating at ends in said center portion adjacent said paddle, forming an inner casing about said center portion of said lead frame to define an open cavity housing said paddle and said ends of the conductive leads, fixing a microcircuit to said paddle and electrically connecting said microcircuit to said ends of the conductive leads, covering said open cavity and defining a closed cavity about said microcircuit, and then completely encapsulating said inner casing and adjacent portions of said lead frame with an outer molded plastic casing.
Claim 3
Dependent Claim
44 words
A method of encapsulating a microcircuit as in claim 1, wherein said inner casing is formed by displacing said paddle relative to said ends and molding plastic about said paddle and ends to fix and enclose said paddle and ends in said open cavity.
Claim 4
Dependent Claim
19 words
A method of encapsulating a microcircuit as in claim 1, wherein said inner casing is molded with silicone material.
Claim 5
Dependent Claim
62 words
A method of encapsulating a microcircuit as in claim 1, wherein said inner casing is defined by fixing said conductive leads and said paddle in the walls of a hollow body open at the top and bottom and defining said open cavity, and wherein said open cavity is covered by placing lids over the open top and bottom of said hollow body.
Claim 6
Dependent Claim
29 words
A method of encapsulating a microcircuit as in claim 1, wherein said microcircuit is fixed to said paddle by forming a eutectic bond between said paddle and said microcircuit.
Claim 7
Dependent Claim
32 words
A method of encapsulating a microcircuit as in claim 1, wherein said microcircuit and said ends of the conductive leads are electrically connected by interconnecting same with wiring attached by ultra-sonic bonding.
Claim 8
Dependent Claim
37 words
A method of encapsulating a microcircuit as in claim 1, wherein said paddle and said ends are gold plated prior to the fixing of the microcircuit on the paddle and electrically connecting the microcircuit to said ends.
Claim 9
Dependent Claim
35 words
A method of encapsulating a microcircuit as in claim 1, further including the step of removing said periphery portion of said lead frame after said inner casing is encapsulated with said outer molded plastic casing.
Claim 10
Dependent Claim
25 words
A method of encapsulating a microcircuit as in claim 8, further including the step of bending said conductive leads to form a socket-engagable encapsulated microcircuit.
Claim 11
Dependent Claim
68 words
A method of encapsulating a microcircuit as in claim 1, wherein said flat metal lead frame further includes inner tie bars supporting said conductive leads adjacent said center portion, wherein said inner casing is formed by molding plastic adjacent said inner tie bars, and further comprising the step of removing said inner tie bars prior to the encapsulation of said inner casing with the outer molded plastic casing.
Claim 12
Dependent Claim
64 words
A method of encapsulating a microcircuit as in claim 10, wherein said flat metal lead frame further includes outer tie bars supporting said conductive leads, wherein said outer molded plastic casing is formed by molding plastic about said inner casing up to said outer tie bars, and further comprising the step of removing said outer tie bars after the formation of said outer casing.
References Cited (Backward Citations)
US3544857A
Cited
US3484533A
Cited
US3606673A
Cited
US3648357A
Cited
US3693252A
Cited
US3627901A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-10-01 | 1977-04-02 | 1977-10-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-10-01 | 1981-04-02 | 1981-10-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-10-01 | 1985-04-02 | 1985-10-02 | $7700.00 | Window Closed / Lapsed |