Abstract A heat-exchanger end plate assembly is shown to comprise a metal plate member embodying a heat-conductive layer and a surface layer of solder, the plate having a plurality of apertures in which metal tubes are disposed. The solder layer is adhered to the tubes completely around the tube peripheries for sealing the apertures around the tubes. Where the heat-conductive layer material is formed of a material which is incompatible with the solder material at the melting temperature of the solder material, as where the heat-conductive layer is formed of copper and the solder has a copper constituent, an intermediate metal layer of steel or the like is metallurgically bonded to the heatconductive layer and is adhered to the solder layer. A method for making the heat exchanger assembly is also shown.
An assembly as set forth in claim 1 wherein said plate member embodies a single solder layer bonded to said layer of selected heat-conductivity properties and wherein said metal tubes each extend from opposite sides of said plate member.
Claim 2
Dependent Claim
95 words
An assembly as set forth in claim 1 wherein said plate member layer of selected heat-conductivity properties is incompatible with said plate member solder layer material at the melting temperature of said solder material, said plate member embodying an intermediate metal layer of solderable material which is compatible with said solder material at the melting temperature of said solder material, said intermediate layer being metallurgically bonded to said layer of selected heat-conductivity properties and adhered to said plate member solder layer and wherein said metal tubes each extend from opposite sides of said plate member.
Claim 3
Dependent Claim
47 words
An assembly as set forth in claim 3 wherein said plate member layer of selected heat-conductivity properties is formed of copper, said solder layer embodies an alloy having copper as a constituent thereof, and said intermediate layer is formed of steel, said tubes being formed of copper.
Claim 4
Dependent Claim
67 words
An assembly as set forth in claim 4 wherein said solder layer comprises a material selected from the group consisting of an alloy embodying about 72 percent silver and 28 percent copper, an alloy embodying about 45 percent silver, 15 percent copper, 16 percent zinc and 24 percent cadmium, and an alloy embodying about 52 percent silver, 16 percent copper, 15.5 percent zinc and 16.5 percent cadmium.
Claim 5
Dependent Claim
30 words
An assembly as set forth in claim 1 wherein said plate member embodies a solder surface layer adhered to each side of said plate member layer of selected heat-conductivity properties.
Claim 6
Dependent Claim
84 words
An assembly as set forth in claim 1 wherein said plate member layer of said selected heat-conductivity properties is incompatible with said plate member solder layer material, said plate member embodying an intermediate layer of solderable material metallurgically bonded to each side of plate member layer of selected heat-conductivity properties, said plate member having a layer of solder material adhered to each of said intermediate layers of said plate member and wherein said metal tubes each extend from opposite sides of said plate member.