Flushing silver solders over and onto surfaces of other metals

Claim 1

A METHOD OF SOLDERING AN ELECTRICAL CONTACT TO A CONDUCTIVE METALLIC SUPPORTING ARM WITH A LAMINATED SOLDER HAVING A FIRST LAMINATION OF A SILVER-COPPERPHOSPHOROUS ALLOY AND A SECOND LAMINATION OF A SILVERCOPPER-ZINC ALLOY BONDED TO THE FIRST LAMINATION, SAID SECOND LAMINATION HAVING A MELTING POINT AND FLOW POINT IN EXCESS OF THE MELTING POINT AND FLOW POINT, RESPECTIVELY, OF SAID FRIST LAMINATION, COMPRISING BONDING SAID FIRST LAMINATION TO THE CONTACT SURFACE BY FLUSHING SAID FIRST LAMINATION ON TO SAID SURFACE WITH A QUANTITY OFHEAT SUFFICIENT TO CAUSE SAID FIRST LAMINATION TO FLOW AND MODIFY ITS CHARACTERTICS SO AS TO RENDER IT INEFFECTIVE FOR A FURTHER SOLDER OPERATION BUT INSUFFICIENT TO APPRECIABLY MELT SAID SECOND LAMINATION AND, THEREAFTER, BONDING SAID SECOND LAMINATION TO A SURFACE OF THE METALLIC SUPPORTING ARM BY HEATING SAID SECOND LAMINATION ABOVE ITS FLOW POINT IN CONTACT WITH THE LAST MENTIONED SURFACE AND FLUSHING SAID SECOND LAMINATION OVER SAID LAST MENTIONED SURFACE. 49 A LAMINATED SOLDER COMPOSITION HAVING A FIRST LAMINATION CONSISTING ESSENTIALLY OF ABOUT 15 PERCENT SILVER, 80 PERCENT COPPER AND 5 PERCENT PHOSPHOROUS, AND A SECOND LAMINATION CONSISTING ESSENTIALLY OF ABOUT 9 PERCENT SILVER, 51 PERCENT COPPER, AND 40 PERCENT ZINC.

Claim 2

A METHOD OF SOLDERING AN ELECTRICAL CONTACT TO A CONDUCTIVE METALLIC SUPPORTING ARM WITH A LAMINATED SOLDER HAVING A FIRST LAMINATION OF A SILVER-COPPERPHOSPHOROUS ALLOY AND A SECOND LAMINATION OF A SILVERCOPPER-ZINC ALLOY BONDED TO THE FIRST LAMINATION, SAID SECOND LAMINATION HAVING A MELTING POINT AND FLOW POINT IN EXCESS OF THE MELTING POINT AND FLOW POINT, RESPECTIVELY, OF SAID FRIST LAMINATION, COMPRISING BONDING SAID FIRST LAMINATION TO THE CONTACT SURFACE BY FLUSHING SAID FIRST LAMINATION ON TO SAID SURFACE WITH A QUANTITY OFHEAT SUFFICIENT TO CAUSE SAID FIRST LAMINATION TO FLOW AND MODIFY ITS CHARACTERTICS SO AS TO RENDER IT INEFFECTIVE FOR A FURTHER SOLDER OPERATION BUT INSUFFICIENT TO APPRECIABLY MELT SAID SECOND LAMINATION AND, THEREAFTER, BONDING SAID SECOND LAMINATION TO A SURFACE OF THE METALLIC SUPPORTING ARM BY HEATING SAID SECOND LAMINATION ABOVE ITS FLOW POINT IN CONTACT WITH THE LAST MENTIONED SURFACE AND FLUSHING SAID SECOND LAMINATION OVER SAID LAST MENTIONED SURFACE. 49 A LAMINATED SOLDER COMPOSITION HAVING A FIRST LAMINATION CONSISTING ESSENTIALLY OF ABOUT 15 PERCENT SILVER, 80 PERCENT COPPER AND 5 PERCENT PHOSPHOROUS, AND A SECOND LAMINATION CONSISTING ESSENTIALLY OF ABOUT 9 PERCENT SILVER, 51 PERCENT COPPER, AND 40 PERCENT ZINC.