Patent US3750269A successfully refreshed from Google Patents.
US3750269A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of mounting electronic devices
Assignee: Texas Instruments Inc
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Filing: 1970-07-06
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Granted: 1973-08-07
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Expires: 1990-07-06
Abstract
Abstract In a method of mounting electronic devices, a gold lead is connected to each contact pad of each wafer in a semiconductor slice. In a parallel step, a body of wafer receiving material is secured to a support and is thereafter separated into wafer receiving members. Then, a layer of epoxy resin is applied to the slice, and the slice is secured to the wafer receiving members with each wafer mounted on a wafer receiving member and with the gold leads positioned between the wafers and the wafer receiving members. After the mounting step, the wafers comprising the slice are separated and the wafer receiving members are disengaged from the support. The resulting wafer-wafer receiving member subassemblies are subsequently fabricated into thermal printheads by mounting the wafer receiving members on heat sinks and connecting electrical conductors to the gold leads.
Inventors
- 👤 R Small
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 19:03
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P95/00; H10W; H10W72/00; H10W72/60; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
110 words
A method of mounting electronic devices contained in a plurality of interconnected wafers comprising a slice, each wafer having bonding pads of one of said electronic devices therein, including the steps of: selectively forming leads on the wafers for providing electrical connection to the bonding pads; mounting the interconnected wafers to a pLurality of selectively positioned wafer receiving members secured to a support, each of said wafers separated from an adjacent wafer by a groove, with a portion of the leads positioned overlying said groove; disconnecting the wafers adjacent said grooves thereby forming a plurality of wafer-wafer receiving member subassemblies on said support; and disengaging said support from said subassemblies.
Claim 2
Independent Claim
110 words
A method of mounting electronic devices contained in a plurality of interconnected wafers comprising a slice, each wafer having bonding pads of one of said electronic devices therein, including the steps of: selectively forming leads on the wafers for providing electrical connection to the bonding pads; mounting the interconnected wafers to a pLurality of selectively positioned wafer receiving members secured to a support, each of said wafers separated from an adjacent wafer by a groove, with a portion of the leads positioned overlying said groove; disconnecting the wafers adjacent said grooves thereby forming a plurality of wafer-wafer receiving member subassemblies on said support; and disengaging said support from said subassemblies.
Claim 3
Dependent Claim
13 words
The method of claim 1 wherein said wafer and said slice are semiconductors.
Claim 4
Independent Claim
108 words
A method of mounting electronic devices selectively positioned in a first surface of a semiconductor slice having first and second surfaces, each of said devices having selectively positioned bonding pads comprising: a. selectively forming leads on said first surface for electrical connection of said bonding pads; b. forming a plurality of device receiving members secured to a support such that said members are selectively positioned with spaces therebetween; c. mounting said one surface to said device receiving members such that portions of said leads directly overlie said spaces; and d. selectively removing regions of said semiconductor slice adjacent said portions for separating said devices and exposing said leads.
Claim 5
Independent Claim
108 words
A method of mounting electronic devices selectively positioned in a first surface of a semiconductor slice having first and second surfaces, each of said devices having selectively positioned bonding pads comprising: a. selectively forming leads on said first surface for electrical connection of said bonding pads; b. forming a plurality of device receiving members secured to a support such that said members are selectively positioned with spaces therebetween; c. mounting said one surface to said device receiving members such that portions of said leads directly overlie said spaces; and d. selectively removing regions of said semiconductor slice adjacent said portions for separating said devices and exposing said leads.
Claim 6
Dependent Claim
21 words
The method of claim 3 wherein said step of selectively removing regions includes selectively etching said second surface of said slice.
Claim 7
Dependent Claim
19 words
The method according to claim 4 and including the step of disengaging the device receiving members from said support.
Claim 8
Dependent Claim
42 words
The method according to claim 5 wherein the step of forming a plurality of device receiving members includes: a. forming an adhesive bond between the devices and the device receiving members; and b. the step of disengaging includes dissolving said adhesive bond.
Claim 9
Dependent Claim
25 words
The method according to claim 6 wherein the mounting step is characterized by mounting each device of the slice on a respective device receiving member.
Claim 10
Dependent Claim
25 words
The method according to claim 5 wherein said space comprises a soluble supporting material and said step of disengaging includes dissolving said soluble supporting material.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-08-06 | 1977-02-05 | 1977-08-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-08-06 | 1981-02-05 | 1981-08-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-08-06 | 1985-02-05 | 1985-08-07 | $7700.00 | Window Closed / Lapsed |