Abstract In the method of forming electrical leads for a semiconductor device, an insulating layer is formed on the area of a semiconductor substrate except at the electrode portion of each semiconductor element, and a parting or releasing agent is then coated over the insulating layer and electrical leads for the said respective elements are then fixed to the substrate in the positions where they extend over the semiconductor substrate of another or other elements. The semiconductor substrate is then divided into respective semiconductor elements and as a result, a semiconductor device, in which electrical leads are projecting outwardly from the circumference of the semiconductor element to which the leads are fixed, is provided.
The method of claim 1 wherein the electrical leads are insulated from each other.
Claim 2
Dependent Claim
30 words
The method of claim 1 wherein the electrical leads contact the electrodes of one element in such a manner that the leads extend over the semiconductor substrate of another element.
Claim 3
Dependent Claim
32 words
The method of claim 1 comprising making the electrical leads contact the electrodes of one element in such a manner that the leads extend over the semiconductor substrate of two other elements.
Claim 4
Dependent Claim
14 words
The method according to claim 1 comprising using photo resist as the releasing agent.
Claim 5
Dependent Claim
14 words
The method according to claim 1 in which the semiconductor element is a diode.
Claim 6
Dependent Claim
14 words
The method according to claim 1 in which the semiconductor element is a transistor.
Claim 7
Dependent Claim
23 words
The method according to claim 1 in which the electrode lead is fixed onto the semiconductor substrate obliquely relative to the semiconductor element.