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US3288662A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of etching to dice a semiconductor slice

Assignee: RCA Corp
•
Filing: 1963-07-18
•
Granted: 1966-11-29
•
Expires: 1983-07-18
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Abstract

No abstract record available.

Inventors

  • 👤 Weisberg Harry

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 10:09
CPC Classifications
C; C23; C23F; C23F1/00; C23F1/02; H; H10; H10P; H10P14/00; H10P14/40; H10P14/46; H10P50/00; H10P50/60; H10P50/64; H10P50/642; H10P50/646; H10P50/69; H10P50/691; H10P50/692; H10P50/693; Y; Y10; Y10S; Y10S148/00; Y10S148/028; Y10S148/051; Y10S148/054

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 123 words
THE METHOD OF DICING A SLICE OF SEMICONDUCTIVE MATERIAL INTO FRUSTUM-SHAPED DICE, COMPRISING THE STEPS OF METALLIZING A PLURALITY OF PAIRED CONCENTRIC AREAS IN REGISTRY ON OPPOSITE MAJOR FACES OF SAID SLICE WITH A FILM OF A METAL SELECTED FROM THE GROUP CONSISTING OF COBALT, NICKEL, RHODIUM, PALLADIUM, IRIDIUM, PLATINUM, COPPER, SILVER AND GOLD, ONE AREA OF EACH SAID PAIR BEING LARGER THAN THE OPPOSITE AREA, COATING SAID METALLIZED AREAS ONLY WITH A METALLIC MATERIAL SELECTED FROM THE GROUP CONSISTING OF LEAD, TIN AND LEAD-TIN ALLOYS, AND IMMERSING SAID SLICE IN AN ETCHANT CAPABLE OF DISSOLVING SAID SEMICONDUCTIVE MATERIAL BUT RELATIVELY INERT WITH RESPECT TO SAID METALLIC MATERIAL TO DISSOVE THE UNCOATED PORTIONS OF SAID SLICE AND PRODUCE A PLURALITY OF FRUSTUM-SHAPED DICE.
Claim 2
Independent Claim 123 words
THE METHOD OF DICING A SLICE OF SEMICONDUCTIVE MATERIAL INTO FRUSTUM-SHAPED DICE, COMPRISING THE STEPS OF METALLIZING A PLURALITY OF PAIRED CONCENTRIC AREAS IN REGISTRY ON OPPOSITE MAJOR FACES OF SAID SLICE WITH A FILM OF A METAL SELECTED FROM THE GROUP CONSISTING OF COBALT, NICKEL, RHODIUM, PALLADIUM, IRIDIUM, PLATINUM, COPPER, SILVER AND GOLD, ONE AREA OF EACH SAID PAIR BEING LARGER THAN THE OPPOSITE AREA, COATING SAID METALLIZED AREAS ONLY WITH A METALLIC MATERIAL SELECTED FROM THE GROUP CONSISTING OF LEAD, TIN AND LEAD-TIN ALLOYS, AND IMMERSING SAID SLICE IN AN ETCHANT CAPABLE OF DISSOLVING SAID SEMICONDUCTIVE MATERIAL BUT RELATIVELY INERT WITH RESPECT TO SAID METALLIC MATERIAL TO DISSOVE THE UNCOATED PORTIONS OF SAID SLICE AND PRODUCE A PLURALITY OF FRUSTUM-SHAPED DICE.

References Cited (Backward Citations)

US3046176A Cited
US2944321A Cited
US3154450A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1969-11-28 1970-05-30 1970-11-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1973-11-28 1974-05-30 1974-11-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1977-11-28 1978-05-30 1978-11-29 $7700.00 Window Closed / Lapsed

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