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US3748544A Expired / Lapsed US ⏱️ 0.0 years remaining

Laminated ceramic high-frequency semiconductor package

Assignee: FRENCHTOWN AMERICAN Corp A CORP OF NJ
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Filing: 1972-02-14
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Granted: 1973-07-24
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Expires: 1992-02-14
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Abstract

Abstract A laminated ceramic ring brazed to a beryllia base provides an improved package for high-frequency and high-power semiconductive devices. Hermetic seals provided by standard metallizing and brazing techniques are better than seals obtained with ceramicglass seals used heretofore. Electrical connection is provided by conductive paths at the adjoining surfaces of the laminated ring.

Inventors

  • 👤 S Noren

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 13:18
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 24 words
The package assembly as claimed in claim 1, and additionally comprising outwardly extending metallic leads brazed to said conductive paths at said cut-out areas.
Claim 2
Dependent Claim 23 words
The package assembly as claimed in claim 1, and additionally comprising a metallic stud brazed to the bottom surface of said ceramic base.
Claim 3
Dependent Claim 26 words
The package assembly as claimed in claim 1, and additionally comprising a cover brazed to the metallized area of the top surface of said top ring.
Claim 4
Dependent Claim 21 words
The package assembly as claimed in claim 1, wherein said ceramic base is beryllia and said laminated ceramic ring is alumina.
Claim 5
Dependent Claim 127 words
In a hermetically sealed ceramic package for containing a semiconductive device, said package comprising a base with said device bonded thereto, a ceramic ring surrounding said device, bonded to said base and having a cover bonded thereto, the improvements comprising: brazed joints between said ceramic ring and said base and between said ring and said cover; said ceramic ring being a lamination of two rings of differing configuration, the top surface of the bottom ring having discrete metallized areas defining conductive paths for connection to said device near the inside edge and to cooperating lands near the outside edge, said bottom ring having a smaller inside diameter than said top ring, and said top ring having cut-out areas exposing said conductive paths near the outside edge thereof.
Claim 6
Dependent Claim 22 words
The package of claim 6, wherein said cut-out areas comprise said top ring having a smaller outside diameter than said bottom ring.

References Cited (Backward Citations)

US3404215A Cited
US3478161A Cited
US3651434A Cited
US3641398A Cited
US3681513A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-07-23 1977-01-22 1977-07-24 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-07-23 1981-01-22 1981-07-24 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-07-23 1985-01-22 1985-07-24 $7700.00 Window Closed / Lapsed

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