US3740672A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor carrier for microwave applications
Assignee: RCA Corp
•
Filing: 1971-11-22
•
Granted: 1973-06-19
•
Expires: 1991-11-22
Abstract
Abstract A semiconductor carrier, having microstrip transmission means designed integrally into the carrier structure, includes a ground plane member of electrical and thermally conductive material having a notch therein extending continuously from two adjacent surfaces thereof. A microstrip transmission pedestal of thermally conductive material is mounted within the notch and has its upper surface partially covered with an electrically conductive film that is separated from the ground plane member. A semiconductor element, having at least two electrodes on its surface is mounted on the conductive-film on the upper surface of the pedestal. An input microstrip transmission section is mounted on an uppersurface of the ground plane member and extends to an edge of the notch. One semiconductor element electrode is electrically connected to the ground plane member and another electrode is electrically connected to the input microstrip section. The semiconductor carrier can be cascaded with an identical carrier for amplifier applications wherein the input microstrip transmission section of each carrier is dimensioned to obtain a desired gain over a large frequency band when loaded with an impedance necessary for optimum power output.
Inventors
- 👤 A Presser
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 17:26
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W44/00; H10W44/20; H10W44/203; H10W44/206; H10W44/226; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/07551; H10W72/07552; H10W72/07553; H10W72/50; H10W72/521; H10W72/527; H10W72/531; H10W72/5368; H10W72/537; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
337 words
A semiconductor carrier for microwave applications comprising: a. a ground plane member of an electrically and thermally conductive material, said ground plane member being generally shaped like a rectangular parallelepiped with a top surface, a first end, and a second opposing end, said ground plane member having a notch extending therein from said top surface and said first end, and said top surface having a slanted portion extending from said second end to at least the edge of said notch; b. a microstrip transmission pedestal of a thermally conductive material mounted on said ground plane member within said notch, said pedestal having an upper surface of an electrically conductive material which is separated from said ground plane member; c. an input microstrip transmission section mounted on said slanted portion of said top surface of said ground plane member and extending from said second end of said ground plane member at least to said notch; d. an output strip comprising a substantially flat piece of an electrically conductive material mounted on and electrically connected to said electrically conductive upper surface of said microstrip transmission pedestal, said output strip being substantially coplanar with and having a height slightly greater than does said top layer of said input microstrip transmission section at said second end of said ground plane member, said output strip extending outward from said notch, being substantially perpendicularly disposed to said first end, and having a length suitable for slidably interconnecting said semiconductor carrier to a second such semiconductor carrier; e. a semiconductor element having a top surface and a bottom surface, said bottom surface being mounted on said microstrip transmission pedestal such that said semiconductor element is electrically and thermally connected to said electrically conductive upper surface of said microstrip transmission pedestal, and said top surface having at least two electrodes connected thereto; and f. means electrically connecting one of said electrodes from said semiconductor element to said plane member and the other of said electrodes from said semiconductor element to said input microstrip transmission section.
Claim 2
Dependent Claim
337 words
A semiconductor carrier for microwave applications comprising: a. a ground plane member of an electrically and thermally conductive material, said ground plane member being generally shaped like a rectangular parallelepiped with a top surface, a first end, and a second opposing end, said ground plane member having a notch extending therein from said top surface and said first end, and said top surface having a slanted portion extending from said second end to at least the edge of said notch; b. a microstrip transmission pedestal of a thermally conductive material mounted on said ground plane member within said notch, said pedestal having an upper surface of an electrically conductive material which is separated from said ground plane member; c. an input microstrip transmission section mounted on said slanted portion of said top surface of said ground plane member and extending from said second end of said ground plane member at least to said notch; d. an output strip comprising a substantially flat piece of an electrically conductive material mounted on and electrically connected to said electrically conductive upper surface of said microstrip transmission pedestal, said output strip being substantially coplanar with and having a height slightly greater than does said top layer of said input microstrip transmission section at said second end of said ground plane member, said output strip extending outward from said notch, being substantially perpendicularly disposed to said first end, and having a length suitable for slidably interconnecting said semiconductor carrier to a second such semiconductor carrier; e. a semiconductor element having a top surface and a bottom surface, said bottom surface being mounted on said microstrip transmission pedestal such that said semiconductor element is electrically and thermally connected to said electrically conductive upper surface of said microstrip transmission pedestal, and said top surface having at least two electrodes connected thereto; and f. means electrically connecting one of said electrodes from said semiconductor element to said plane member and the other of said electrodes from said semiconductor element to said input microstrip transmission section.
Claim 3
Dependent Claim
27 words
The semiconductor carrier of claim 1 wherein said input microstrip transmission section is flat and comprises upper and lower metallic layers with a dielectric material sandwiched therebetween.
Claim 4
Dependent Claim
52 words
The semiconductor carrier of claim 2 in which said slanted portion of said top surface of said ground plane member is recesseD such that said upper metallic layer of said input microstrip transmission section is substantially the same height as the nonslanted portions of said top surface of said ground plane member.
Claim 5
Dependent Claim
27 words
The semiconductor carrier of claim 1 in which said top surface of said semiconductor element is substantially coplanar with said top surface of said ground plane member.
References Cited (Backward Citations)
US3008089A
Cited
US3428866A
Cited
US3324224A
Cited
US3489956A
Cited
US3419813A
Cited
US3500428A
Cited
GB1206675A
Cited
US3577181A
Cited
US3626259A
Cited
US3649872A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-06-18 | 1976-12-18 | 1977-06-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-06-18 | 1980-12-18 | 1981-06-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-06-18 | 1984-12-18 | 1985-06-19 | $7700.00 | Window Closed / Lapsed |